Kinsus to perform strongly in 1Q13 on steady demand for FC CSP substrates

Ingrid Lee, Taipei; Steve Shen, DIGITIMES Asia 0

Kinsus Interconnect Technology will perform relatively strongly in the first quarter of 2013, buoyed by shipments of FC CSP (flip-chip chip-scale package) substrates to clients including Qualcomm and MediaTek, according to industry sources.

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