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Kinsus ramping up FC CSP substrate shipments for Apple A5 CPUs, says paper
Commercial Times, October 4; Steve Shen, DIGITIMES
Shipments of flip-chip chip-scale package (FC CSP) substrates for Apple's A5 processors from Taiwan-based Kinsus Interconnect Technology are expected to top one million units a month starting October, according to a Chinese-language Commercial Times...
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The coronavirus outbreak has disrupted production and weakened consumer confidence, with all ICT sectors bracing for major declines in shipments. Digitimes Research has conducted analyses on three mobile device sectors, namely notebooks, smartphones and tablets in the wake of the outbreak.