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    Home Tech Chips + Components

    Kinsus looks to increasing shipments of FC CSP substrates in 4Q12

    Ingrid Lee, Taipei; Steve Shen, DIGITIMES 0

    Kinsus Interconnect Technology has entered the supply chain of Apple's iPhone 5 and is expected to see robust shipments of its FC CSP (chip scale package) substrates for Qualcomm's 28nm baseband chips in the fourth quarter of 2012, according to industry...

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    Categories
    Chips + components IC manufacturing Passive, PCB, other IC components
    Tags
    CSP FC CSP IC substrate iPhone 5 Kinsus Qualcomm shipments Unimicron Technology
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    Kinsus Interconnect Technology Unimicron Technology
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