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NEWS TAGGED FC CSP
Thursday 29 October 2020
Fire strikes Unimicron IC substrate plant in northern Taiwan
Unimicron Technology's IC substrate plant in Taoyuan, northern Taiwan caught fire on the afternoon of October 28. The site is where the company produces flip-chip chip-scale packaging...
Monday 26 December 2016
Genesis Photonics boosting FC CSP application to avoid continued net losses
Genesis Photonics has been making efforts to promote FC CSP (flip chip chip scale packaging) for automotive headlights in a bid to bounce back from eight consecutive quarters of net...
Wednesday 25 February 2015
Kinsus to post more than 5% revenue growth in 2015, says report
Taiwan-based IC substrate maker Kinsus Interconnect Technology, which saw its sales hit a record high in 2014, is expected to report a more than 5% sales increase for 2015, according...
Tuesday 6 January 2015
IC substrate makers gearing up for expansion
Taiwan-based IC substrate makers Unimicron Technology, Kinsus Interconnect Technology and Nanya PCB will continue to ramp up their production capacities for flip-chip chip scale package...
Thursday 25 December 2014
Unimicron approves NT$10.67 billion for 2015 capex
The board of directors of Unimicron Technology, a manufacturer of PCBs and IC substrates, has approved plans to budget NT$10.67 billion (US$335.5 million) in capex for 2015.
Wednesday 3 September 2014
Niching looks to ramp up LED leadframe and FC CSP substrate shipments in 2015
IC packaging material and tool distributor Niching Industrial looks to ramp up its shipments of EMC-based (epoxy molding compound) LED leadframes and FC CSP substrates to drive revenue...
Tuesday 20 May 2014
SPIL setting up FC CSP capacity in eastern China
Siliconware Precision Industries (SPIL), in view of fast growing demand for ICs used in smartphones, is setting up FC (flip chip) CSP (chip scale package) capacity at its two factories...
Monday 27 January 2014
SPIL expects 1Q14 revenues to drop 4-8%
IC backend house Siliconware Precision Industries (SPIL) has forecast consolidated revenues for the the first quarter of 2014 will decrease 4-8% sequentially, as production utilization...
Tuesday 31 December 2013
IC backend service firms to ramp up bumping, WL-CSP capacities in 2014, say sources
Advanced Semiconductor Engineering (ASE), Siliconware Precision Industries (SPIL) and Amkor Technology will continue to commit heavy investments for ramping their high-end backend...
Monday 30 December 2013
IC substrate makers to ramp up FC CSP substrates in 2014
IC substrate makers Kinsus Interconnect Technology, Unimicron Technology and Nanya PCB all plan to ramp up their production capacity for flip-chip chip scale package (FC CSP) substrates...
Friday 13 December 2013
ASE likely to lose orders as plants might shut down over toxic leaks
One or more factories of Taiwan-based Advanced Semiconductor Engineering (ASE), the world's largest IC packaging house, might receive a government order to suspend operations for...
Wednesday 20 November 2013
Kinsus sales to decline 5% sequentially in 4Q13
Kinsus Interconnect Technology is expected to see its revenues drop 5% sequentially in the fourth quarter of 2013 as declining demand from the high-end smartphone sector will offset...
Wednesday 6 November 2013
SPIL posts record revenues for October
Siliconware Precision Industries (SPIL) saw its October consolidated revenues climb to an all-time high of NT$6.55 billion (US$222.7 million) for October 2013, representing growth...
Thursday 29 August 2013
ASE to land growing backend orders for Apple devices, says report
IC packaging and testing house Advanced Semiconductor Engineering (ASE) is expected to secure backend orders for fingerprint sensors, application processors and Wi-Fi modules for...
Wednesday 28 August 2013
Kinsus 3Q13 sales expected to hit record, says report
IC substrate supplier Kinsus Interconnect Technology is expected to see its third-quarter revenues climb to an all-time high with gross margin rising above 27%, thanks to growing...