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IC substrate makers develop coreless substrates for thin-profile mobile devices

Ingrid Lee, Taipei; Jessie Shen, DIGITIMES Asia Friday 26 October 2012 0

Major Taiwan-based IC substrate suppliers, including Nanya PCB (NPC) and Unimicron Technology, have developed coreless IC substrates for use in thin-profile mobile devices, and already received verification from clients, according to industry sources...

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