After acquiring MIPS in December of 2012, Imagination Technologies simultaneously possesses the four key mobile-platform silicon intellectual property technologies (CPU, GPU, VPU, and RPU) and brings opportunities for the heterogeneous platform integration technology of tomorrow.The four silicon intellectual property technologies that controls SoC networkingAmit Rohatgi, vice president of mobile solutions for Imagination Technologies, stated that all networking SoC devices require key components such as the application processor (CPU), the graphic processor (GPU), the radio comms processor (RPU), and the video processor (VPU). Semiconductor evolutions in the past primarily focused on performances and ignored the serious power-down transistor gate power leakage condition. Imagination possesses the silicon intellectual property for these four key chips, and collaborates closely with upstream EDA, IP providers, SoC designers, and foundries to design optimized power consumption chips through hardware and software innovation. This allows the industry to develop low power consumption and always-connected networking to mobile devices that offers a rich variety of media content.Efficiency upgrade with multi-threaded CPU coresAmit Rohatgi indicated that the CPUs used in current mobile devices under the Linux operating system are prone to cache errors, difference forecast errors, data dependencies, as well as memory performance and other CPU idle time problems that can cause 50-200 machine cycle pipeline stagnations and reduce the overall implementation efficiency to less than 50%. Multithreading (MT) allows a single-core CPU to implement synchronized multi-threaded operations, which can optimize CPU execution units, significantly reduce the total number of execution cycles and stagnation cycles, and improve the application computing output rate to achieve the same objective at lower clocks and reduce system costs.Amit Rohatgi raised an example. If a MIPS multi-threaded CPU is used as the modem chip for a mobile device, the multi-threaded core plus the assistance of a multi-thread optimization RTOS and LTE baseband software stack layer can improve the video/date output rate by 37-57% compared to that of a traditional non-threaded CPU core. When comparable high-end proAptiv and ARM Cortex A15 chips compared (both of which are produced under a TSMC 28nm High-K metal gate process [28nm HKMG]), the former clocks at 1GHz to 2 GHz and the latter clocks at 1.8 GHz. However, the unit execution performance (CoreMark/MHz) of proAptive can reach 4.5 CoreMark/MHz, and the Cortex A15 can only reach 3.5 CoreMark/MHz. Meanwhile, the surface area of the proActive single-core silicon is 1.85 mm2, which is less than 60% compared to that of the 3.25 mm2 Cortex A15.The proAptive has dynamic voltage/dynamic voltage and frequency scaling (DVFS) technologies and can save 50% in power consumption by switching from 1.3V to 0.9V during standby mode, save 33% in power consumption by switching between idle and operational modes, and save 10-20% in power consumption even under the full speed operation. It also features PowerArtist power analysis tool to help system designers reduce overall power consumption.Achieving optimal GPU and VPU unit power efficiency through architectureAmit Rohatgi mentioned that the PowerVR SGX of Imagination uses a tile-based rendering architecture model design to remove 3D objects from the shielding surface data of the screen for recompression transmission to reducing memory bandwidth and optimizing power consumption without sacrificing the graphic performance of the GPU, which is why this chip is adopted by Apple's iPad 4. He cited PowerVR SGX, ARM Mali, and Nvidia Tegra3 power consumption tests conducted by a third party. The results of the test showed that ARM Mali experienced huge shocks when it went from 0.5W to 4W. The Nvidia Tegra3 has an average of 1.7-1.8W and the PowerVR SGX has an average of 0.5-1W, and both consumption ranges are relatively flat.In terms of VPU, standard coded circuits are adopted with the addition of deblocking, discrete cosine transform (DCT), and dynamic forecast/compensation circuits to automatically turn off each circuit block when it is not in use. The embedded DRAM memory of the SoC technology also provides dynamic clock gate control that can save 60% in power consumption. He cited the fact that when Microsoft's Surface tablet is compared to Acer's W510 tablet that adopts the Imagination VPU, during 1080 HD video playback, Acer W510's total/CPU/GPU/Memory power consumption rates of 3.5W, 0.17W, 0.37W, and 0.45W all performed better than Microsoft Surface's power consumption rates of4.21W, 0.35W, 0.51W, and 0.58W, respectively.Regarding the RPU, Amit Rohatgi indicated that radio signal transmissions must consider the location and time where the user chooses to switch between different channels as well as the signal shielding and attenuation caused by the complex and multiple paths. However, intelligent wave acquisition and tracking circuits are like multi-phase antennas that can enhance the 10dB noise ratio and reduce power consumption.Imagination's solution and heterogeneous SoC integration technologyAmit Rohatgi mentioned that Imagination offers technologies for the four major components (CPU, GPU, VPU, and RPU). The MIPS proAptiveas is designed with low-power consumption and multi-threading. The PowerVR SGX graphics chip can improve the unit power consumption performance by 50% under graphic rendering operations. The PowerVR Series4 VPU that provides high-efficiency video coding (HVEC), H.265 HD instant compression coding/decoding, and supports 4K x 2K resolution while consuming less than 10mW of power under the operational state. The Ensigma Series4 RPU provides 802.11ac 2x2 MIMO connectivity, supports all Wi-Fi protocols as well as Bluetooth, TV, and radio, and can maintain low power levels.Imagination is currently developing an image signal processor. Today's mobile devices are equipped with multiple cameras and must execute complex software instructions. The image signal processor can reduce/unload the digital signal processing burden of the CPU and further reduce power consumption.Finally, Amit Rohatgi indicated that Imagination is currently undergoing research and development for a CPU, GPU, VPU, and RPU heterogeneous compute system. The MCM and SiP/PoP system-level packaging would initially be offered at 28nm, and the four-in-one CPU, GPU, VPU, and RPU super single-chip is expected to be implemented under the 20nm process to further exert the power of heterogeneous computing capabilities, such as providing the dynamic voltage/clock switching between CPT/GPU required to enable the maximum of 1 TFLOPS of floating point performance.Amit Rohatgi, VP of mobile solutions for Imagination Technologies

News regarding the demise of the PC has been greatly exaggerated. According to statistics, the majority of networked and non-networked consumer applications still run on a PC. It is important to note though, that the trend in devices features and appearance is being recasted, so quality wireless networking capability is the key to the shrinking and mobilization of the PC.Michael Hurlston, executive vice president of worldwide sales for Broadcom, appeared while wearing Google Glasses to demonstrate the interactive applications of the next-generation device to the audience. He spoke about a 20-year PC obituary report published by CNN, while noting that from 1991-2005, PC shipments went from 23.81 million to more than 200 million units. He added that while Apple released the iPhone in 2007, PC shipments approached 300 million units in 2008.In 2011, the death of the PC argument resurfaced. However, PC sales oddly hit a new record height of 350 million, and only slightly declined in 2012, leading to CNN and The Guardian both pointing out that the demise of PC was greatly exaggerated. However, the media continues to post the question. An April 2013 edition of USA Today indicated that PC will not die; it will only become ultra-mobile. Forbes magazine mentioned that the news regarding to the death of PC is garbage, while The Business Insider even posted the big question of "Is PC dead yet?"Hurlston indicated that in fact, according to statistics, two-thirds of US consumers use two or more devices to surf the Internet, with the total typically being comprised of more than one PC. In addition, 53% of information workers worldwide use three or more devices at work, while 67% of online shoppers have ordered products through a PC. This indicates that the PC still plays a critical role in terms of a connection experience. Meanwhile, 87% of consumers spend at least 10 hours with digital content every day of the week. He pointed out that today's PCs are becoming lighter and slimmer as well as more efficient, and pursue longer battery life and to always stay connected. Tomorrow's PCs will incorporate human-computer interfaces and advance further with device integration to make PCs lighter, thinner, and more mobile. For example, Asus has launched Taichi, a transforming mobile Ultrabook, and other manufacturers have lunched transformable or detachable flat panel Ultrabook products as well.High-quality wireless networking capability drives the fourth wave of PC revolutionHurlston indicated that the first wave of PC revolution was the rise of PCs in the 1980s, the second wave of PC revolution was the development of the Internet in the 1990s, the third wave in the PC revolution was driven by wireless networking in the 2000, and the fourth wave of PC revolution was driven by the always connected capability in the 2010s that requires very high-quality connectivity.Hurlston enumerated a number of examples for PC connection development. 5G Wi-Fi can be used to provide fast and uninterrupted connections and to connect more devices. MiraCast can be used to watch videos through wireless streaming. Touch technology can be used for better interaction. Bluetooth technology can be used to enable the Internet of Things (IoT). Finally, the Global Navigation Satellite System (GNSS) can be used to detect geographical positions and determine user locations. In terms of PC wireless connection requirements, such as anytime Cloud access, stronger wireless network connection service capacity, and longer-lasting battery life to respond to the higher transmission rates to stream high-definition videos wirelessly; 5G Wi-Fi is the only technical solution because wireless video not only requires 5G Wi-Fi uninterrupted video data connection service capabilities, it also require direct interconnection, video agreements, and cross-platform capabilities as well as application support between the devices.5G Wi-Fi with DisplayLink/Miracast, a crossover borderless display demoHurlston invited Vijay, a Broadcom Technical Manager to provide an actual machine demonstration, who then unveiled two LCD monitors and a notebook that were connected with a USB 3.0 cable with DisplayLine software technology to enable three-screen horizon merge display. This heterogeneous device was connected in parallel to a big screen. Two windows were opened on the notebook; a live video feed of the exhibition center was shown, while the other window played a HD video across the two LCD monitors. The videos were all streamed wirelessly through a high-speed 5G Wi-Fi. When the notebook was moved, the position change caused the live recording video changes to instantly be reflected on the three cross-connected large displays.Hurlston also spoke about the Miracast wireless video transmission technology developed by the Wi-Fi Alliance. Through the Wi-Fi Direct technology, data can be transmitted through Wi-Fi devices directly – without requiring a wireless sharing device. This not only simplifies settings, it can enhance transmission performance as well. Miracast with 5GWi-Fi and the near field communication (NFC) protocol can work together to provide better user experiences.The PC is also the hub of IoT. New generation PCs can also handle numerous geographic/ location data such as navigation systems, warning systems, regional sales event information, and indoor map information. Michael Hurlston showcased an Ultrabook that integrated GNSS navigation technology with a built-in gyrometer, magnetometer/compass, and accelerometer; and uses 5G Wi-Fi technology. By providing constant 5G Wi-Fi base station coordinates and detecting the precise position of the Ultrabook, it can accurately calculate the location of the notebook within the room.Broadcom believes that the numerous next-generation convertible/detachable devices such as Asus' Taichi dual screen transformer Ultrabook, the Transformer Prime detachable transformer flat panel/laptop, Lenovo's IdealPad, and Hewlett-Packard (HP) next-generation devices will become the new diverse development styles of the future in the PC market. 5G Wi-Fi networking technology can deliver the optimal application performance and experience to users.Michael Hurlston, executive VP of worldwide sales for Broadcom

FORTREND Tech has conducted one successful OGS tech-transfer case involving a turnkey solution in Shandong, China. Shandong has been working very hard putting their resources in the 3C industries in recent years.Not long ago, Shandong province was still mostly known for its natural and historical resources, such as Taishan, a mountain famous for its natural beauty and historical significance. There is the city of Qufu where the great Confucius was born more than 2,000 years ago. Sandong has long been a vegetables provider for the Chinese capital of Beijing. Along its major highway are a lot of other places of historical significance, such as Linzi, the capital of Chi 2,800 years ago, and Jimo, another important place in Chi. They are some of the places constantly mentioned in history textbooks for elementary school students.But Shandong has changed. Sitting in between Korea, Japan and Shanghai, and boasting a large harbor in Qingdao, Shandong is seeing every one of its cities constructing high tech industrial parks. The province is eager to have a place in the IT industry.Jinan, the capital city of Shandong, is showing a strong commitment to pursuing its goal of becoming an OGS touch panel supplier. It took its first step by searching for potential business partners in Taiwan, and finally chose FORTREND to be its tech partner and production facilities provider.FORTREND custom-designed a complete OGS production line for Jinan. All the equipment was specially sourced from mainstream high-end manufacturers. The equipment was shipped in 60 40ft containers and arrived in Jinan safely in early June 2013. FORTREND sent a team of 80 engineers with another big team from equipment manufacturers to set up the production line in a newly built factory.The mission was completed in early July.On July 11, a grand opening ceremony was held, with Chairman Mr John Wu of FORTREND welcoming all guests of honor at the factory site. Ranking officials of Shandong Province, representatives from the local electronics industries and guests from Japan and Korea attended the ceremony to witness the birth of a new member of the OGS touch panel supply chain.This is also a faithful production partner of FORTREND, and the first automated OGS touch panel manufacturing plant in China, which is very meaningful to the local industry. It also attests to FORTREND's capability of providing its partners with turnkey solutions that cover facility design and equipment purchase. The Jinan plant is a successful case of tech transfer that promises a bright future for the city in the touch panel industry.FORTREND's turnkey OGS touch panel production line helps transform Shandong

Innodisk, a designer and manufacturer of SSDs for commercial and industrial applications, announces the availability of SATA III products for aerospace and defense applications. Innodisk builds upon the Taiwan Top Excellence award winning SATA II based InnoRobust II SSD and brings SATA III speeds to a wide variety of rugged storage products in various form factors, including: 2.5-inch SSD, 1.8-inch SSD, SATA Slim and mSATA.These latest-generation products are speedy, rugged, with military grade data security, smart data protection technology and are backed by Innodisk's world-class engineering support team.Twice the speed of SATA IIInnodisk brings the speed of SATA III to aerospace and defense fields. With sequential read and write speeds of up to 510/340 MB/s, double that of SATA II devices, SATA III storage devices are ideal for rugged, high-speed and low-latency data streaming military applications such as radar, sonar, signal intelligence and image processing.Made for extreme environments - MIL-STD-810F/G certifiedMeeting the military's strict specifications for operating in extreme environments, the complete line of Innodisk's flash and DRAM products are fully MIL-STD-810F/G compliant. A wide variety of rigorous tests must be passed for certification, including: low pressure altitude tests, exposure to high and low temperatures, thermal shock, humidity, shock and vibration.Military grade data securityInnodisk's data security system provides quick erase and secure destroy technologies that meet the standards of the U.S. Navy, Air Force, and Army, the Department of Defense, the National Security Agency and the National Industrial Security Program Operating Manual Supplement (NISPOMSUP).iCell smart data protection technologyiCell is vital for mission-critical applications, where working under extreme conditions and without backup power is unavoidable. This technology provides a mechanism to instantaneously discharge data stored in temporary volatile DRAM buffers to flash storage, to ensure the safety of data during power failures.Dedicated engineering support teamInnodisk's dedicated engineering support team is available to ensure that all of its products are backed by a comprehensive service system. Its software, hardware, firmware, R&D, and field-application engineers all work closely together to provide world-class support for each and every aerospace and defense application. Furthermore, rugged products are specially tailored to fit the needs of each application. A variety of speeds, capacities, sizes, and data security options are available for customization.To showcase its aerospace and defense flash storage devices and DRAM, Innodisk will be exhibiting at the Association for Unmanned Vehicle Systems International's (AUVSI) Unmanned Systems conference in Washington, D.C., from August 12th to August 15th at booth #4156.Innodisk: SATA III now available for aerospace and defense applications

Google has launched its second-generation Nexus 7 and the Chromecast, a device that can be plugged into TVs, PCs, smartphones or tablets for watching online content.The Chromecast is priced at US$35 and works with Netflix, YouTube, Google Play Movies & TV, and Google Play Music, with more apps like Pandora coming soon.Once Chromecast is set up, users can use their phones, tablets or notebooks to browse and cast content to their TVs, play and pause, control the volume, and more. But unlike other streaming solutions, users can still multitask – send emails or surf the web – while watching. It works across platforms – Android tablets and smartphones, iPhones, iPads, Chrome for Mac and Windows (more to come), so users' personal devices are also their remote control.In addition to apps like Netflix, users can use Chromecast to bring a broad range of content available on the web to their big screen, thanks to a new feature in the Chrome browser that allows them to project any browser tab to their TV. From sharing family photos to enjoying a video clip from their favorite news site.Together with Asustek Computer, Google has upgraded the original Nexus 7 with a high-resolution panel and made the device lighter. The tablet is also capable of having more than nine hours of HD video playback and 10 hours of web browsing or reading. The Nexus 7 now features stereo speakers and virtual surround sound from Fraunhofer, giving users rich and immersive audio.The new Nexus 7 is the first device to ship with Android 4.3, the latest version of Android. In Android 4.3, Google introduced restricted profiles, which let users limit access to apps and content. For example, restricted profiles enable parental controls, so certain family members are prevented from accessing mature content. Likewise, retail stores can use tablets to show off product information, and shops can use tablets as point of sale systems. Android 4.3 also now supports Bluetooth Smart technology, opening the door to mobile apps that connect to new devices like fitness sensors. Android 4.3 is rolling out to Nexus devices starting today.The Chromecast is now available for US$35 on Google Play plus Amazon and BestBuy's online shops. It will be available in Best Buy stores across the US starting July 28. For a limited time, users also get three months of Netflix included.The new Nexus 7 starts at US$229, and is available in the US beginning July 30.Google Chromecast TV stickPhoto: CompanyGoogle second-generation Nexus 7 tabletPhoto: Company

Nvidia has unveiled its new flagship technology, the Nvidia Quadro K6000 GPU along with the launch of a new line of professional graphics GPUs for mobile workstations, delivering performance on mobile platforms.The Quadro K6000 GPU delivers five-times higher compute performance and nearly double the graphics capability of its predecessor, the Nvidia Quadro 6000 GPU, and features the largest and fastest graphics memory available currently, claimed the GPU company.The Quadro K6000 GPU is based on the Nvidia Kepler architecture with key performance features and capabilities include 12GB GDDR5 graphics memory, 2,880 streaming multiprocessor (SMX) cores, support for four simultaneous displays and DisplayPort 1.2 and ultra-low latency video I/O and support for large-scale visualizations.Nvidia also revealed a new flagship professional graphics GPU for workstation notebooks, the Quadro K5100M GPU. The Quadro K5100M anchors a new line of workstation notebook graphics that includes the Quadro K4100M, K3100M, K2100M, K1100M, K610M, and K510M GPUs.The Nvidia Quadro K6000 will be available beginning this fall from Dell, Hewlett-Packard (HP), Lenovo and other major workstation providers; from systems integrators, including BOXX Technologies and Supermicro; and from authorized distribution partners, including PNY Technologies in North America and Europe, ELSA and Ryoyo in Japan, and Leadtek in Asia Pacific.The new Quadro mobile workstation graphics product line will also be available beginning this fall from major mobile workstation OEMs.Nvidia Quadro K6000 graphics cardPhoto: Company

As the massive growth of information technology services places increasing demand on the datacenter, Intel has outlined its strategy to re-architect the underlying infrastructure.The company also announced additional details about its next-generation Intel Atom processor C2000 product family (codenamed Avoton and Rangeley), as well as outlined its roadmap of next-generation 14nm products for 2014 and beyond.To help companies prepare for the next generation of datacenters, Intel revealed its plans to virtualize the network, enable smart storage solutions and invest in innovative rack optimized architectures.Diane Bryant, senior vice president and general manager of the Datacenter and Connected Systems Group at Intel highlighted Intel's Rack Scale Architecture (RSA), a design that promises to increase the utilization and flexibility of the datacenter to deliver new services.Rackspace Hosting, an open cloud company, has announced the deployment of new server racks that is a step toward reaching Intel's RSA vision, powered by Intel Xeon processors and Intel Ethernet controllers with storage accelerated by Intel Solid State Drives. The Rackspace design is the first commercial rack scale implementation.As part of its strategy, Intel revealed new details for the forthcoming Intel Atom processors C2000 product family aimed for low-energy, high-density microservers and storage (Avoton), and network devices (Rangeley). This second-generation of Intel's 64-bit SoCs is expected to become available later this year and will be based on the company's 22nm process technology and the Silvermont microarchitecture. It will feature up to eight cores with integrated Ethernet and support for up to 64GB of memory.The new products are expected to deliver up to four times the energy efficiency and up to seven times more performance than the first-generation Intel Atom processor-based server SoCs introduced in December, 2012. Intel has been sampling the new Intel Atom processor server product family to customers since April and has already more than doubled the number of system designs compared to the previous generation.Intel also outlined its roadmap of next-generation products based on its forthcoming 14nm process technology scheduled for 2014 and beyond. These products are aimed at microservers, storage and network devices and will offer an even broader set of low-power, high-density solutions for their Web-scale applications and services.The future products include the next-generation of Intel Xeon processors E3 family (Broadwell) built for processor and graphic-centric workloads such as online gaming and media transcoding. It also includes the next-generation of Intel Atom processor SoCs (Denverton) that will enable even higher density deployments for datacenter operators. Intel also disclosed an addition to its future roadmap - a new SoC designed from the ground up for the datacenter based on Intel's next-generation Broadwell microarchitecture that follows today's Haswell microarchitecture.An Intel executive shows off second-generation 64-bit SoC for microservers.Photo: Company

Sharp Imaging and Information Company of America (SIICA), a division of Sharp Electronics, has announced the release of a new 20-inch (19.5" diagonal) Full HD multi-touch monitor, the LL-S201A.The LL-S201A features Sharp's Interactive Display System and is ideal for use in business, medical and education environments as a complement to the AQUOS BOARD display, said Sharp.The 20-inch touchscreen LCD panel delivers 1,920 by 1,080 Full HD resolution with performance-enhancing UV2A technology to help prevent light leakage for bright whites and deep blacks.It also features a 10-point multi-touch screen and Palm Cancellation Function, which Sharp said can prioritize the touch of the pen over the touch of peoples' hands in order to provide smooth writing while the hand rests on the screen.The LL-S201A weighs 5.1 pounds, is approximately 1-inch thick, and features a narrow half-inch bezel along with a full-flat screen, said Sharp.

Compal Broadband Networks, CBN has signed a multi-year frame agreement with Com Hem under which it will deliver its CBN CH7284E advanced Docsis cable gateway for the roll-out of Com Hem's new ultra high speed broadband service.The CBN CH7284E advanced Docsis cable gateway is the most compact 16x4 gateway on the European market to enter effective commercial deployment, combining Docsis network speeds of 800 Mbps with real-world wireless speeds well over 500 Mbps based on its embedded 3x3 11ac based Wi-Fi technology.Besides its tremendous speed capabilities and stylish slim enclosure design, the CBN CH7284E provides a whole range of advanced feature sets like Wi-Fi Home-spots, L2oGRE tunneling, home automation and smart meter support, full band capture tuner with remote diagnostics, as well as full IMS compatibility. This combination of raw speed power with an advanced feature set makes it the ideal product for the challenges that MSO's face today and their needs for support of a wide range of sophisticated applications at very high speed."The partnership with Compal Broadband Networks enables Com Hem to take our ultra high-speed strategy to the next level and enable even higher broadband speeds for our customers. Compal's CH7284E advanced Docsis cable gateway offers the latest technology and we are proud to, together with Compal's technology, be one of the first providers in the world to offer such high speeds over cable," says Henri Caddeo, CTO at Com Hem.Alex Wang, CEO of Compal Broadband Networks CBN: "We are very happy and proud to be able to support Com Hem in the roll-out of their new ultra high-speed broadband service. Compal Broadband Networks will continue to lead the cable gateway business with a strong and innovative product portfolio well adapted to the needs of our customers."About Com HemCom Hem is one of Sweden's leading suppliers of television, high-speed broadband and fixed-telephony. Approximately 37%, nearly 1.78 million, of Sweden's households are connected to Com Hem's network, with access to the market's broadest range of television services. Com Hem offers attractively priced, high-quality and comprehensive services for television, high-speed broadband and fixed-telephony. The company was established in 1983, is controlled by BC Partners and has approximately 950 employees and its head office in Stockholm. For further information, visit: http://www.comhem.se/About Compal Broadband NetworksCompal Broadband Networks, Inc. CBN is part of the global Compal group. Combining its extensive experience in Cable Voice and Broadband products with its innovative Wireless and in-home Gateway technologies, CBN offers a full line of cable modems, gateways, media gateways, set top boxes and digital connected consumer appliances, such as TV's, Wi-Fi Repeater's, Android based tablets and Smart TV Dongles. As a result of its extensive connected home integration approach, all of CBN products interface with each other seamlessly, allowing people to live a convenient and better life while using CBN products. For more information, visit http://www.icbn.com.tw/The CBN CH7284E advanced Docsis cable gateway

Indium Corporation and Duksan Hi-Metal Co., Ltd. announce a formal agreement to facilitate the global supply of an advanced alloy technology used to manufacture solder balls (spheres) for semiconductor packages. SACM, a novel alloy composition developed by Indium Corporation, provides the foremost reliability performance in terms of both drop-shock and thermal cycling.Solder joint architectures that utilize both SACM solder paste and SACM solder balls realize the maximum value of this alloy technology. Duksan Hi-Metal, the second largest solder ball supplier in the industry, provides cost-effective manufacturing capability for SACM solder balls, coupled with world-class quality."We couldn't be any happier with our selection of Duksan Hi-Metals as our strategic partner to bring SACM balls to market," said Chris Bastecki, Indium Corporation's Associate Director of Electronics Assembly Materials. "The challenge of effectively and repeatedly incorporating the proprietary dopant into SACM solder balls is quite complex. The engineers at Duksan have demonstrated great skill and capability with their ability to scale the process up to a viable commercial process within a short period of time.""We are very pleased to be able to offer our customers SACM technology," said Perry Kim, Director of Sales for Duksan. "Our customers are continuously challenged to improve reliability, avoid the need for board level underfills, and extend the use of semiconductor packages to larger die sizes. If we can enable our customers to realize these improvements through the cost-effective application of SACM solder balls, we are happy to help."Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, solar, thin-film and thermal management markets. Products include solders, preforms, and fluxes; brazes; sputtering targets; indium, gallium, and germanium metals and inorganic compounds; and NanoFoil. Founded in 1934, Indium has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA.Duksan Hi-Metal Co., Ltd. was established in 1999 and manufactures solder balls for BGA and CSP assemblies. Headquartered in Korea, they have business relationships with customers in China, Japan, Taiwan, the Philippines, Singapore, and Europe. Duksan is ISO 14002:2000 certified.For more information about Indium Corporation, visit http://www.indium.com/ or email abrown@indium.com.