CONNECT WITH US
Friday 26 July 2013
FORTREND turnkey OGS touch panel production line helps transform Shandong
FORTREND Tech has conducted one successful OGS tech-transfer case involving a turnkey solution in Shandong, China. Shandong has been working very hard putting their resources in the 3C industries in recent years.
Thursday 25 July 2013
Innodisk: SATA III now available for aerospace and defense applications
Innodisk, a designer and manufacturer of SSDs for commercial and industrial applications, announces the availability of SATA III products for aerospace and defense applications...
Thursday 25 July 2013
Google announces Chromecast and second-generation Nexus 7
Google has launched its second-generation Nexus 7 and the Chromecast, a device that can be plugged into TVs, PCs, smartphones or tablets for watching online content.
Wednesday 24 July 2013
Nvidia unveils new flagship GPU for visual computing
Nvidia has unveiled its new flagship technology, the Nvidia Quadro K6000 GPU along with the launch of a new line of professional graphics GPUs for mobile workstations, delivering performance on mobile platforms.
Wednesday 24 July 2013
Intel outlines strategy for datacenter business
As the massive growth of information technology services places increasing demand on the datacenter, Intel has outlined its strategy to re-architect the underlying infrastructure.
Tuesday 23 July 2013
Sharp launches new 20-inch Full HD multi-touch monitor
Sharp Imaging and Information Company of America (SIICA), a division of Sharp Electronics, has announced the release of a new 20-inch (19.5" diagonal) Full HD multi-touch monitor, the LL-S201A.
Tuesday 23 July 2013
Swedish MSO Com Hem chooses Compal Broadband Networks advanced cable gateway for its new high speed broadband service roll-out
Compal Broadband Networks, CBN has signed a multi-year frame agreement with Com Hem under which it will deliver its CBN CH7284E advanced Docsis cable gateway for the roll-out of Com Hem's new ultra high speed broadband service.
Friday 19 July 2013
Indium Corporation and Duksan Hi-Metal form strategic alliance for SACM solder balls
Indium Corporation and Duksan Hi-Metal Co., Ltd. announce a formal agreement to facilitate the global supply of an advanced alloy technology used to manufacture solder balls (spheres) for semiconductor packages. SACM, a novel alloy composition developed by Indium Corporation, provides the foremost reliability performance in terms of both drop-shock and thermal cycling.
Thursday 18 July 2013
Imagination Summit 2013 Grandly Opened, Unveiling Innovative Solutions for Smart Mobile/Consumer Devices with Key Partners
Imagination Technologies, one of the top three global semiconductor IP (SIP) vendors, grandly held its annual Summit in Hsinchu and Taipei recently. After completing the acquisition of MIPS early this year, the company demonstrated its full determination of expanding market presence with its comprehensive graphics, video, CPU, communication IP, as well as cloud IP solutions at the summit.
Thursday 18 July 2013
International biotech experts assemble at BioBusiness Asia 2013 to examine opportunities in Taiwan, the Asia-Pacific and the world
BioBusiness Asia, the event that global investors and biotech companies look forward to each year, take place July 17 and July 18...