German-based AZZURRO Semiconductors, a leading provider of high-quality GaN-on-Si Epi wafers, announced that, the company has successfully achieved superior electrical performance and established a volume production track record for large size high voltage wafers. It is expected that this leading production technology will drive a new wave of demands for the high performance and cost-effective power devices.According to Erwin Ysewijn, VP Sales and Marketing of AZZURRO, under the mega trend of energy-saving, the power efficiency requirement for various electronic devices is getting higher, and the new applications, such as electrical vehicles and smart grid, will also drive the new demands for high voltage semiconductor market.Unlike silicon material, which has inherent limitations for fast switching at high voltage, GaN can meet these performance requirements with its excellent breakdown voltage and low leakage characteristics. At present, the availability in the industry is still limited for production suitable 6" (150 mm) wafers to fabricate GaN High voltage devices. AZZURRO's large-size GaN-on-Si technology will help customers boost the cost effectiveness of power devices to next level."By adopting GaN-on-Si technology, it is possible to develop power semiconductors up to 1700V, whereas our target market currently is 600 V", Ysewijn said. "It can replace current solutions across a broad range of power levels and targets various applications, such as hybrid and electric vehicles, solar and power supplies, SMPS (switched mode power supply), PFC (power factor corrector), and SFC (static frequency converters/inverters). Also, because GaN has higher switching speed, it can further realize the design goals of system miniaturization and cost-down."GaN-on-Si has significant advantages, it will see the initial adopted phase by the industryin 2014, technical difficulties have been overcome at AZZURRO. The main challenge was how to overcome the bows and cracks that are formed during manufacturing process. These defects are resulted from the different thermal expansion coefficients between the silicon substrate and GaN layers.After successful completing the first runs for GaN-on-Si at lab in 2003, AZZURRO already have accumulated around ten years of experiences in this technology. The company began pilot production in 2009 and continuously improved reproducibility. After that, two production lines were set up in Dresden in 2011 and moved to volume manufacturing in 2012, as well as transfer technology to multiwafer tool."AZZURRO can address the industries requirements, today!" Ysewijn stressed.He explained that factory requires large diameter GaN-on-Si technology for mass production, and the technology must be CMOS friendly, so that they can use standard silicon foundries. The most importantly, we need to help customers produce wafers with stress free and low bow wafers to meet their quality requirements."AZZURRO now can address large diameter (up to 200mm) GaN-on-Si technology. With own patented interlayers process, we can grow thick buffer layers on silicon substrates to achieve best crystal quality and excellent device performance."Thickness homogeneity is also important for high voltage devices, which have stricter requirements on breakdown voltage and leakage for each device manufactured on the wafer. AZZURRO's patented technology can achieve superior homogeneity for yield breakthroughs, and is ready for standard silicon process lines."In order to adopt existing CMOS lines, it is required that the GaN-on-Si wafer should be lower than 50μm", Ysewijn said. "Our production results show that bow is excellent managed per wafer, as well as per run. Take 150mm wafer as an example, AZZURRO can grow 6μm thick GaN layer with only 1.4% deviation of uniformity."In terms of material quality, AZZURRO can also achieve superior low tilt, twist, and defect level, with smooth and crack-free surface. As for leakage performance, the leakage current at 1000V is less than 100 nA/mm. Also, it also shows excellent breakdown characteristics regardless of gate width up to 100mm.Moreover, for 200mm GaN-on-Si HEMT wafers with breakdown voltage large than 600V, the result shows that wafers with total thickness of 5.6μm are crack-free and have wafer bow lower than 20μm."It's a quantum leap in material quality and device performance for large-size GaN-on-Si wafers with yield rate up to more than 70%, average size devices are meeting yields close to 90%." Ysewijn stressed. With high volume support capabilities, proven reproducibility and SPC data, AZZURRO will take the lead to drive the broad adoption of its leading GaN-on-Si technology and bring more innovative applications for high voltage semiconductor market.

Advantech (TWSE: 2395.TW) today announced the availability of a new 6U CompactPCI board based on fourth generation IntelR Core i5 and i7 processors. The MIC-3396 is designed for OEMs looking to benefit from the performance improvements, power efficiency and scalability of the latest IntelR processors.The new processors, based on 22nm technology support up to four cores / eight threads at 2.4GHz and 6MB last level cache boosting MIC-3396 computing performance while enabling the latest virtualization techniques and CPU enhancements. Onboard soldered low voltage DRAM with ECC is supported for maximum reliability and optional memory expansion via an SODIMM socket extends the capacity to up to 16GB for the most demanding applications in high performance or virtualized environments. Dual channel design and memory speeds up to 1600MT/s along with increased cache size and enhanced cache algorithms guarantee maximum memory performance.The MIC-3396 meets the growing needs for higher performance CompactPCI solutions offering faster floating-point arithmetic support. FMA3 (Fused Multiply/Add) accelerates floating point operations for signal processing algorithms which are used in graphics, imaging, instrumentation, industrial control, audio processing and medical applications. The new processor core also introduces full 256-bit AVX2.0 instruction extensions that improve parallel processing performance and result in smaller code for embedded tasks, particularly in CompactPCI-based security and surveillance equipment where faster encryption, compression and face detection are needed. New BMI (Integer Bit Manipulation) instructions optimize cryptography and help make solutions more secure. Other BMI instructions speed up TCP/IP operations in storage and networking applications, broadening the adaptability of the MIC-3396 to a wider variety of embedded applications. The processor's integrated enhanced graphics engine offers twice the performance over previous generations and improves video transcoding throughput. In addition, triple independent display support, makes the MIC-3396 an ideal fit for demanding industrial workstation applications.Combined with the powerful IntelR QM87 chipset, the 4th generation IntelR Core processors offer improved I/O performance by leveraging 5GT/s DMI, USB3.0 and 3rd generation PCIe interfaces. An onboard XMC/PMC site with PCIe x8 gen.3 connectivity is designed to host high speed offload or I/O mezzanines such as the MIC-3666 dual 10GE XMC card. With onboard SATA-III support at up to 6Gbps, OEMs can take advantage of the latest enhancements in storage technology such as high speed SSDs or enterprise HDDs. A CFast socket provides the ability to add industrial flash storage. For applications requiring the highest reliability and tolerance to environmental conditions an onboard soldered SATA-II SSD can be used. When higher performance and reliability is required, an RIO-3315 rear transitionmodule supports a 4-port SAS controller with RAID and failover.Five Gigabit Ethernet ports based on the latest gigabit Ethernet controllers from IntelR are employed for PICMG 2.16, front and rear connectivity, and ensure best in class network connectivity.Reliability, Availability, Serviceability, Usability and Manageability (RASUM) features integrated in the CPU and chipset combined with PICMG 2.9, IPMI-based management make the MIC-3396 a highly available and reliable computing engine.The RIO-3316 RTM module supports one PS/2 connector with both keyboard and mouse ports, one USB 3.0, two USB 2.0 ports, two RS-232 ports, two SATA ports, two DVI ports, and two Gigabit Ethernet ports.The MIC-3396 is available for OEM sampling now with comprehensive software support from Advantech's ecosystem alliance partners for WindowsR, Linux and VxWorksTM.MIC-3396 extends CompactPCI product line with significant gains in processing performance, security and graphics

Advantech (TWSE: 2395.TW) today announced the Q2 availability of a new product line based on the CompactPCI PlusIO and Serial standards, responding to a growing customer demand for a backwards compatible migration path from legacy PCI to PCIe and other serial technologies including Ethernet, SATA/SAS and USB. CompactPCIR PlusIO enables platforms that combine existing, legacy PCI based peripheral cards based on CompactPCIR as well as newly designed, high speed serial peripherals based on CompactPCI Serial.CompactPCI PlusIO makes use of the rear I/O pins available on CompactPCI system slots in order to support high-speed serial signals without interfering with legacy PCI signals. This allows interoperability with all other PICMG CompactPCI 2.xx standards which do not use these pins. A new Ultra Hard Metric (UHM) connector was introduced to transport these high-speed signals. The UHM connector was designed to mate on all deployed backplanes which comply with CompactPCIR base specification. System slot boards equipped with this high-speed connector can be used in existing 32-bit systems and support differential signals up to 5 Gb/s per pair."The transition to serial interfaces does not happen overnight. Customers have made significant investment into the CompactPCI platform, both in hardware and even more importantly the related software. With CompactPCI PlusIO we can offer a soft migration paththat protects our customers' investments but also takes them a step forward - by giving them the ability to utilize the latest high speed bus interfaces in the same system that hosts their legacy IO boards." said Peter Marek, Senior Director x86 Solutions, Advantech Networks and Communications Group. "Re-using well qualified platform building blocks like special purpose I/O cards along with the related software in these hybrid systems helps users to stay within their R&D budgets, meet their time to market objectives and mitigate risk."In addition to the parallel PCI bus architecture PlusIO allows the use of the CompactPCI system slot to provide a simple star architecture based on the applicable serial bus standard. A hybrid backplane features a CompactPCI PlusIO compliant system slot and a combination of legacy 32bit CompactPCI as well as CompactPCI Serial peripheral slots. For closely coupled extensions,PCI Express based I/O can used to implement interfaces requiring higher bandwidth and to upgrade legacy PCI functions which are reaching the end of their lifespan. For storage, SATA or SAS on the backplane now allows for RAID systems to be built-in. USB facilitates the integration of off the shelf wireless modules like WiFi or cellular network mezzanines for applications such as M2M."In the same way as VMEbus users can migrate to VPX or PCI/104 users to PCIe/104 our CompactPCI customer base now wants to leverage serial bus technologies more. But unlike VPX, which breaks backwards compatibility with legacy VME,CompactPCI PlusIO paves a backwards compliant upgrade path." added Marek.Full details concerning the first products to be released will be announced early in the second quarter with sampling expected shortly afterwards.

AMD has unveiled two new members for its FX family of CPUs: the FX-9590, which AMD claims to be the world's first commercially available 5GHz CPU processor, and the FX-9370. The AMD FX-9000 series CPUs will be available initially in PCs through system integrators.The new 5GHz FX-9590 and 4.7GHz FX-9370 feature the Piledriver architecture, and are unlocked for easy overclocking. Additionally, these processors feature AMD Turbo Core 3.0 technology to optimize performance across CPU cores.The new AMD FX CPUs will be available beginning this summer. AMD new FX-9000 series CPU specifications Model Number of core Clock speed Architecture FX-9590 8 5GHz Piledriver FX-9370 8 4.7GHz Piledriver Source: Company, compiled by Digitimes

ABB, the leading power and automation technology group, will present some of its leading power technologies at the CIRED conference and exhibition being held in Stockholm from June 10-13, 2013.CIRED is a biennial event and provides a key platform for the discussion of global trends, technologies and future developments in the electricity distribution sector, with delegates attending from all over the world. In addition to presenting a number of technical papers, ABB will exhibit a range of products that enable a stronger and smarter power network.A focal point will be the showcasing of UniGear Digital which combines medium voltage air-insulated switchgear with an innovative solution for protection, control, measurement and digital communication to enable a safe, flexible, eco-efficient and smart electrical network that can deliver power reliably and efficiently. Enabled with IEC 61850 communication protocol, UniGear Digital's advanced design and components help reduce resources and minimize environmental impact.Also on display will be the new SafeRing Air portfolio using 'dry air' as the insulation medium for applications up to 12 kV. The switchgear design is based on a completely sealed system with a stainless steel tank containing all live parts and switching functions. SafeRing Air is the arguably the most compact solution of its kind, making it ideal for use in compact secondary substations, light industry, building and infrastructure applications, among others.ABB will also showcase the latest developments in grid and network automation and distribution management addressing areas like fault management, outage response and reporting and network planning. Other exhibits include an active arcing fault protection system for dry-type transformers – or an Ultra-Fast Earthing Switch (UFES) that enhances safety and prevents serious damage caused by high pressure build up when an arcing faults occurs in an electrical installation. Energy storage solutions and the Gotland smart grid demonstration project will also be featured at the ABB pavilion.ABB (http://www.abb.com/) is a leader in power and automation technologies that enable utility and industry customers to improve performance while lowering environmental impact. The ABB Group of companies operates in around 100 countries and employs about 145,000 people.

The LVC-5570D4-CA and the LVC-5770-7A are high performance ruggedized platforms ideal for integrating a range of in-vehicle data needs, including surveillance (both digital and analog), digital signage and video capture, vehicle location, and driver behavior monitoring."These two products are a perfect fit for multitasking in-vehicle computing," said Eric Chiu, Director of the Vehicle Computing Division at Lanner. "The modern passenger or freight vehicle needs a range of computing services, and the powerful LVC-5570 and LVC-5770 are built to cover security, entertainment, and performance monitoring. With a range of options to configure the I/O and the CPU, the LVC-5570 and LVC-5770 can be finely-tuned to meet the needs of vehicle operators."Conforming to the exacting MIL-STD-810G for both vibration and shock, and incorporating ignition control functionality, the LVC-5570 and LVC-5770 are built for in-vehicle use, which can also be deployed in conjunction with external CAN bus devices to provide a complete driver behavior monitoring platform, thanks to the on board GPS and G-sensor. Speed, acceleration, deceleration, vehicle orientation, and vehicle position can all be recorded using this system.The LVC-5770-7A is equipped with 8 PoE LAN ports, and functions as a highly capable Mobile NVR in conjunction with remotely-powered IP cameras. The LVC-5570D4-CA is more suited to analog video use, functioning as a Mobile DVR, and offers superb extensibility through its 4 mini-PCIe slots and 2 removable storage bays. With pin-to-pin compatibility a range of CPU options are available depending on the needs of the end user.

Apple has showed a sneak peek into the future of the pro desktop with a first look at the next-generation Mac Pro. Designed around a unified thermal core, the Mac Pro introduces a completely new pro desktop architecture and design that is optimized for performance. The new 9.9-inch tall Mac Pro features next-generation Xeon processors, dual workstation-class GPUs, Thunderbolt 2, PCI Express-based flash storage, and ECC memory,.The next-generation Mac Pro is architected around a unified thermal core that allows the desktop to efficiently share its entire thermal capacity across all the processors. Next generation Intel Xeon E5 processors with up to 12 core configurations deliver double the floating point performance. With two AMD FirePro workstation-class GPUs, the all-new Mac Pro is up to 2.5 times faster than the current Mac Pro and delivers up to seven teraflops of compute power, said Apple. The new Mac Pro also features PCIe-based flash storage that is up to 10 times faster than conventional desktop hard drives and includes four-channel ECC DDR3 memory running at 1866MHz to deliver up to 60GBps of memory bandwidth.With six Thunderbolt 2 ports that can deliver up to 20Gbps of bandwidth to each external device, Mac Pro is able to connect to external storage, multiple PCI expansion chassis, audio and video breakout boxes, and the latest external displays, including Ultra HD desktop displays. Each of the six Thunderbolt 2 ports supports up to six daisy-chained devices, giving users the ability to connect up to 36 peripherals. Thunderbolt 2 is completely backwards compatible with existing Thunderbolt peripherals.The next-generation Mac Pro will be available later in 2013.Apple next-generation Mac ProPhoto: Company

Apple has updated MacBook Air with all-day battery life, fourth-generation Intel Core processors with faster graphics, 802.11ac Wi-Fi and flash storage that is up to 45% faster than the previous generation. Apple also introduced redesigned AirPort Extreme and AirPort Time Capsule base stations featuring 802.11ac Wi-Fi for up to three times faster performance, the company said.The new MacBook Air features fourth-generation Intel Core i5 and Core i7 processors that give the 13-inch MacBook Air up to 12 hours of battery life and up to 10 hours of iTunes movie playback. The 11-inch MacBook Air delivers up to nine hours of battery life and up to eight hours of iTunes movie playback. MacBook Air now supports next-generation 802.11ac Wi-Fi for wireless performance that is up to three times faster when connected to an 802.11ac base station. New Intel HD Graphics 5000 gives MacBook Air up to 40% faster performance for gaming and graphics intensive apps, and new flash storage provides speeds up to 45% faster than the previous generation and nine times faster than traditional hard drives.The series features dual microphones, a FaceTime HD camera, a high-speed Thunderbolt port and two USB 3.0 ports. MacBook Air also supports dual displays and video mirroring while simultaneously supporting full native resolution on the built-in display.MacBook Air ships with OS X Mountain Lion, bringing Messages, Notification Center, system-wide Sharing, AirPlay Mirroring, Dictation, Game Center and the enhanced security of Gatekeeper to consumers' Mac. With iCloud built into the foundation of OS X, the Mountain Lion makes it easier to keep users' content up to date across their Mac, iPhone, iPad and iPod touch.Apple also introduced redesigned AirPort Extreme and AirPort Time Capsule base stations that feature three-stream 802.11ac Wi-Fi technology with a maximum data rate of 1.3Gbps, almost three times faster than 802.11n. The new AirPort base stations include high-powered radios and a six-element beam-forming antenna array to maximize range and performance. With setup built right into OS X and iOS, users can create a high-speed Wi-Fi network in just a few clicks, and the intuitive AirPort Utility makes it easy to view and manage a network graphically. Featuring 2TB or 3TB hard drives, AirPort Time Capsule works in conjunction with Time Machine in OS X and can help wirelessly backup multiple Macs.The 11-inch MacBook Air comes with a 1.3GHz processor with Turbo Boost speeds up to 2.6GHz, 4GB of memory and is available with 128GB of flash storage starting at US$999, and 256GB of flash storage starting at US$1,199. The 13-inch MacBook Air comes with a 1.3GHz processor with Turbo Boost speeds up to 2.6GHz, 4GB of memory and is available with 128GB of flash storage starting at US$1,099, and 256GB of flash storage starting at US$1,299. Configure-to-order options include a 1.7GHz Intel Core i7 processor with Turbo Boost speeds up to 3.3GHz, up to 8GB of memory and up to 512GB flash storage.The AirPort Extreme is available for a suggested retail price of US$199. AirPort Time Capsule comes in two models: 2TB of storage for US$299 and 3TB of storage for US$399 (US).Apple MacBook Air with fouth-generation Intel processorPhoto: Company

First International Computer, Inc. (FIC), a world leader in the design and production of electronic devices, today announced a multi year technology collaboration and partnership to accelerate intelligent, flexible, cost efficient products and services for Machine to Machine (M2M) and enterprise markets both by FIC and Cluster Wireless, the world-leading expert in M2M solution.This partnership enhances FIC custom hardware products with programming flexibility during design, manufacturing, deployment, and post deployment phases, and accelerates time to market by using Cluster Wireless patent pending Cluster Wireless M2M Middleware. Cluster Wireless also provides Portfolio Management services to manage M2M deployments. The Portfolio Management services include enterprise grade Device Management, distributed architecture based Service Management, Sensor Management, Alarm & Fault Management, Application Management, and Device Diagnostics."Cluster Wireless M2M Middleware allows us to quickly build our hardware, and customize to a wide range of use cases" said Alex Dee, Vice President, FIC. "Cluster Wireless ability to download applications to the device allows us to adapt to customers' needs quickly"."We are pleased to partner with FIC, and help our customers in developing M2M products and solutions quicker. Our products and services ensure that customers can fine tune their devices to meet ever changing business requirements for M2M deployments" said Prem Kumar, CTO of Cluster Wireless.FIC demonstrates the Portfolio Management service through its own design Android tablet and the modeling house to show the data management, alarm, fault management, data usage tracking, sensor management and service, device management. By integrating the Cluster Wireless M2M solution, FIC provides its tablet with multiple applications on various devices.To learn more about FIC and Cluster Wireless M2M solution, visit FIC headquarters at No. 300, Yang Guang St., NeiHu, Taipei during Computex Taipei 2013 or contact us at e-mail: mkt@fic.com.twAbout Cluster WirelessCluster Wireless, LLC was founded in 2008 by ex-Qualcomm executives. Cluster Wireless has been designing and developing solutions for M2M market. Cluster Wireless brings total M2M solution to market with its products, services, and partners. For more Cluster Wireless information visit http://www.clusterwireless.com/About FICFounded in 1980, First International Computer, Inc. (FIC) is a world leader in the design and production of electronic devices now is focusing its core business on building automation system, tablet applications and wireless communication devices.FIC has a workforce of over 8,100 employees spread amongst 2 manufacturing/assembly sites and 4 branch offices.As an OEM/ODM supplier to many of the leading brands in North America, Asia and Europe, FIC has established itself as a pioneer of innovative products, supplying engineering expertise, advanced R&D and logistical services throughout the world.For the latest information on FIC products and services visit http://www.fic.com.tw/FIC partners with Cluster Wireless to deliver Intelligent M2M Solutions

As Chenbro moves into its thirtieth year of business, the company is ever more aware of how vital it is to infuse culture into the technology industry if products are to become an even greater part of people's lives. For this reason, the company has proactively promoted the concept of "combining technology with creativity" in its corporate culture over recent years. Chenbro would like to invite the Taiyuan Puppet Theatre Company, which benefits from the company's sponsorship, to take the stage at the Computex Taipei 2013 computer show on the theme of "Prospering Together", and demonstrate the creative energy that happens when technology meets innovation.Visitors to the Chenbro booth at Computex 2013 in Taipei will not only gain an insight into the company's comprehensive product line, but will also be treated to most usual sight for Computex. In contrast to the customary ranks of showgirls and noisy displays, Chenbro will host a performance by Taiyuan Puppet Theatre Company, part of the Lin Liu-Hsin Puppet Theatre Museum. The performance will use the artistry of traditional puppet theatre to demonstrate the vibrant energy that is generated when technology meets creativity.Culture must not be neglected in technological innovationNational Culture and Arts Foundation chairman Stan Shih and his wife have proactively supported the integration of the arts and culture into business over the last few years and kindly agreed to deliver the opening speech at Chenbro's opening press conference at Computex. Mr Shih noted that the Taiwan technology industry's beginnings in OEM work for European and American companies have resulted in product development being centered on the culture and requirements of the European and American markets; over the last decade, however, the Taiwan technology industry has continually strived to innovate and build brands, and should therefore reach back to its roots in the culture it knows best - Chinese culture - as the basis for inspiration, taking the high road by promoting the accomplishments of Chinese culture within the enterprise, while also supporting creative and cultural organizations that have quietly fostered culture within Taiwan; only in this way can we increase the value of our culture and improve the competitiveness of our businesses.Chenbro CEO Maggi Chen echoes Stan Shih's sentiments, commenting that Chenbro strives to "start out from the heart". Ms Chen stresses the need to return to the basics of manufacturing and product design, take to heart the voices of customers and create products that meet their needs; in order to stay as close as possible to customers' requirements, it is essential to incorporate aesthetics and the ability to appreciate culture into a company's corporate DNA; only then will the organization as a whole be able to grasp what users want from their lives and culture."Taking Chenbro chassis products as an example, a chassis is almost like a jacket - every detail from the design onward must correctly gauge its relationship with the user, in order to fit in with how people are used to using it and create the best possible product." Ms Chen went on to say that the only way to develop products that can become part of consumers' lives is to understand what touches people; for this reason, she has always strived to instill a greater appreciation of culture into the entire business organization of Chenbro.It was this conceptual background that led Maggi Chen (Chen Meiqi) to find herself deeply touched when she encountered the work of Dr Robin Ruizendaal, the director of the Taiyuan Puppet Theatre Company, who left his home in the Netherlands more than twenty years ago to research traditional puppet theater culture in Taiwan. Ms Chen commented that if a foreigner could write plays and design sets for Taiwanese puppet theater for so many years, she felt she should make a contribution to promoting her own traditional culture as a Taiwanese person. For this reason, Chenbro has contributed NT$3.0 million in sponsorship over three years to Taiyuan Puppet Theatre Company to help promote traditional Taiwanese culture. The company also regularly sends employees to volunteer at Taiwan Puppet Theatre to help its staff do their bit for traditional Taiwanese culture, as well as allowing them to immerse themselves in traditional culture and increase their own appreciation of the arts.Dr Ruizendaal, who speaks fluent Chinese, commented in his speech that Taiwan possesses both advanced technology and a beautiful traditional culture; for this reason, if Taiwanese companies are able to join forces with the arts and use the power of technology to create even more unique culture, it would bring Taiwan to an even better place.Culture and cultivation as a means of increasing soft powerChenbro consultant Tony Tsao (Cao Anbang) comments that thirty years ago, information in the global business environment was neither transparent nor symmetrical. At that time, Taiwan-based companies could essentially do business out of a suitcase; but as the IT industry has rapidly developed, in this age of symmetrical information, the value of each company and the specification of every product has become transparent. The old business model is no longer fit for purpose and Taiwan's technology industry cannot afford to remain stuck in the outmoded thinking of trying to beat competitors on specification alone; instead, it is vital to start out from the perspective of innovative design and culture, develop forms of art and craftsmanship that are truly one's own, and deliver both the quality and the prices that will enable businesses to conquer larger markets."As technology are culture are both parts of expressing life, if you want to develop innovative products, you have to start from a sound understanding of culture, and this is precisely why the entire world has been advocating the concept of soft power in recent years," notes Zheng Weichang, general manager of Chenbro. Mr Zhang explains that, faced with such trends, Chenbro has also been actively working to nourish the design and cultural elements of its company organization, an effort that began with fostering cultural appreciation and involvement amongst employees and extends right through to product design; Chenbro is striving to make technology a less cold, more vibrant business.Lin Yongtuan, deputy general manager at Chenbro, adds that the company has consistently been extremely competitive in manufacturing, including technologies for stamping dies, plastic molding, sputtering, and glass and plastic optical coatings; its hard power in all these areas has won the admiration of customers. Over the last few years, Chenbro has built on its existing hard power, while also changing its corporate philosophy to uphold and give back to society, to continue to support a variety of charitable and cultural activities; the goal of this effort is not only to make a contribution to Taiwanese culture, but also to inject the nourishing creative elements of art and culture into Chenbro's own design DNA, in order to make stuffy technology products a more vibrant and exciting affair.Chenro executives: General Manager Steven Chang (left) and CEO Maggi Chen (right)(From left to right) Maggi Chen, Stan Shih, Dr Robin Ruizendaal and Steven Chang