Indium Corporation's Mario Scalzo, Senior Technical Support Engineer, will present at the Surface Mount Technology Association's Ohio Valley Expo and Tech Forum, July 11 in Independence, Ohio. Scalzo's presentation, Effects of Thermal Pad Patterning on QFN Voiding, discusses the major challenge of eliminating voids underneath low standoff components. This presentation explores what causes voiding and presents results to help optimize thermal performance and reliability.Scalzo holds a bachelor's degree in chemistry from Saint Anselm College and a certificate from the American Chemical Society for Professional Education. He is an SMTA-Certified Process Engineer and earned his Six Sigma Black Belt from the Thayer School of Engineering at Dartmouth College. Scalzo is the author of the Electronics Assembly Materials blog, http://www.indium.com/blogs/Mario-Scalzo-Blog/.The SMTA Ohio Valley chapter is one in a network of chapters across the United States, South America, the Middle East, and Asia. The volunteer officers and leaders of SMTA local chapters plan events serving regional networks of industry professionals. For more information on upcoming expos, visit www.smta.org/expos.Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, solar, thin-film and thermal management markets. Products include solders, preforms, and fluxes; brazes; sputtering targets; indium, gallium, and germanium metals and inorganic compounds; and NanoFoil. Founded in 1934, Indium has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA.For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com.Mario Scalzo, Senior Technical Support Engineer, Indium Corporation

Indium Corporation's Indium8.9HFA Solder Paste is a versatile, halogen-free, Pb-free, solder paste with leading print performance on miniaturized components. Assemblers and OEMs are adopting this remarkable new product at an accelerating pace.Print performance is especially critical for manufacturers of mobile phones and other personal electronics devices as they struggle to contend with sub-8 mil challenges associated with continuing miniaturization in the electronics assembly industry.Indium8.9HFA Solder Paste provides:*Low cost of ownership & high print yields- Unsurpassed transfer efficiency for consistent, full volume print deposits (8 mil) results in reduced frequency of insufficients and high first-pass print yields- Low print pressure and excellent response-to-pause saves time and money on stencils and line changes- Solvent-free dry-wiping reduces costs*Increased throughput- Higher print speed and reduced wipe frequency enables short cycle time, high up-time, and high throughput printingDr. Ning-Cheng Lee, Vice President of Technology for Indium Corporation's Research and Development commented, "Indium8.9HFA represents the culmination of years of research into optimizing rheological properties to obtain the industry's best printing solder paste."Tim Jensen, Product Manager for Indium Corporation's PCB Assembly Materials noted, "The fast ramp of Indium8.9HFA with personal electronics manufacturers is driven by the product's ability to enable high print yields. Customers really value its high throughput performance. We have not seen adoption rates this fast since the introduction of NC-SMQ92J in 1999."Indium8.9HFA Solder Paste is part of Indium Corporation's Indium8.9 series of solder pastes. The series was designed to provide multi-faceted performance characteristics, bringing the right balance of solder paste attributes tailored specifically to customers' manufacturing process. Each paste in the series was developed to optimize print performance and mitigate common defects faced by manufacturers of personal electronics, such as QFN voiding, head-in-pillow, and graping.For more information about Indium8.9HFA or the Indium8.9 series of solder pastes, visit www.indium.com/indium8.9series or email askus@indium.comIndium8.9HFA Solder Paste

Dialog Semiconductor, a provider of highly integrated power management, audio and short-range wireless technologies, announced a new audio codec reference module - based on its DA7321 audio codec - for Freescale Semiconductor's Tower System Development Platform. The DA7321 is part of Freescale's microcontroller (MCU) and microprocessor (MPU) portfolio ecosystem and targets a broad range of audio applications, including small speakers, headphones, docking stations and gaming systems.OEMs can now use Dialog's latest low power audio codec to significantly improve the consumer's audio experience. Dialog's DA7321 codec delivers louder and cleaner audio by using a multi-channel architecture to digitally mix and route multiple audio streams. An on-chip, programmable Digital Signal Processor (DSP) offloads audio software from the host processor, enabling OEMs to benefit from consistent high quality audio. It also eliminates the need to re-encode the audio data in multi-channel applications. By using the DSP to process the audio signal, OEMs developing with the Freescale Tower System will benefit from:-More perceived volume to the audio signal without headphone or speaker distortion;-Psychoacoustic bass boost to improve perceived low frequencies;-Patented SRS SoundTM to improve the audio image size, bass sensation and audio system dynamics.The Freescale Tower System is a modular, expandable, open source development platform for 8, 16 and 32-bit MCUs and MPUs. The interchangeable and reusable modules and open source design files make it easy to customise a product and reduce low level design, giving OEMs more time to focus on creating differentiated solutions.Udo Kratz, Senior Vice President and General Manager, Mobile Systems Business Group at Dialog Semiconductor commented, "Freescale is a global leader in processing solutions with a broad portfolio of microprocessors and microcontrollers, offering a unique ecosystem approach for their customers. Dialog is delighted to continue to expand our partnership with Freescale with our latest multi-channel audio codec with dual I2S, which gives OEMs the design flexibility that they need to develop new generations of high performance audio peripherals."Rudan Bettelheim, Audio and Accessories Business Development Manager at Freescale noted, "Dialog is enabling OEMs to build and evaluate innovative new audio accessories quickly, while maximising hardware re-use across their product ranges by providing an optimised audio solution that is supported by the Freescale Tower System."The DA7321 is offered in a 64-pin BGA package with a 0.5mm pitch, with an operating temperature range of -40 degrees C to +85 degrees C, and can be found onboard the new TWR-AUDIO-DA7321 peripheral module for the Freescale Tower System. It is now available through Freescale Buy Direct. Learn more at www.Freescale.com/Tower

Dialog Semiconductor, a provider of highly integrated power management, audio and short-range wireless technologies, announced leading ODM Wistron as its first customer for its SmartWave Multi-Touch Integrated Circuit (MTIC) – part number DA8901. The MTIC is the world's first chip to enable touch technology from FlatFrog in high volume consumer devices. Using edge-to-edge, in-glass infrared light, the system can detect and track multiple touches, gestures and pressures from gloved hands and other objects, providing a premium, true-touch user experience at performance levels surpassing the latest capacitance-based solutions, but at a lower cost.Targeting high volume All-in-One PCs and monitors, Wistron has developed a 23-inch SmartWave-enabled touch module that can be used as a direct one-to-one replacement of today's projected capacitance touch module. This provides OEMs fast-to-market, low risk and low cost multi-touch technology without the need for product re-designs.Currently, other optical-based solutions require an edge bezel and do not meet the performance criteria for Windows 8. The DA8901 MTIC, enabling FlatFrog touch technology, allows OEMs to have edge-to-edge flush solutions without a bezel, which is similar to capacitive touch. However, unlike capacitance-based solutions, there are no expensive ITO layers to impede or distort light from the display. Moreover, the unique ability to detect high resolution pressure opens up new user interface options for GUI navigation and gaming. Combined with a superior viewing experience and the assurance of Windows 8 certification, ODMs and OEMs alike are finally able to increase the market penetration of touch into their lower price-point products without compromising performance.Mark Tyndall, VP Corporate Development and Strategy at Dialog Semiconductor commented, "Less than three months after announcing our first Multi-Touch IC, Dialog is pleased to announce our first ODM customer - an established manufacturer for the world's leading PC brands - and with it, the deployment of Dialog's mixed signal ICs into the exciting new generation of All-in-One PCs and touch monitors. This will help Dialog diversify and expand our addressable market beyond smartphones and tablets and into mass market PCs, including Ultrabooks."David Shen, President of Digital Consumer Business Group at Wistron commented, "As a leading ODM to the world's biggest PC brands, it is vital that Wistron is able to provide our customers with the best technology at the right price point and with the lowest risk. Developed in collaboration with FlatFrog, we expect our latest touch modules, featuring Dialog's MTICs, to deliver a cost-effective touch experience with superior performance. We anticipate first products in-store from January 2014."Dhwani Vyas, CEO FlatFrog Laboratories added, "Today we are launching FlatFrog touch system solutions for high volume desktop, notebook and tablet PCs. This has been made possible through our close collaboration with Dialog and Wistron, who together are ensuring the deployment of our FlatFrog touch technology to the high volume consumer market."MTIC is suitable for today's laptops, All-in-One PCs, Ultrabooks, and monitors and is optimised for displays of between 11 and 36 inches. Supporting up to 40 simultaneous touches, the MTIC uses the proven principles of FlatFrog's patented Planar Scatter Detection (PSD) touch technology to detect changes in infrared light injected into the cover lens of the display and help convert these changes into multi-touch coordinates.A single MTIC has the flexibility to drive up to twelve infrared LEDs directly or provide control for a large number of externally powered LEDs. Each chip is also able to process the signals from up to twelve infrared receivers.A typical Ultrabook, Tablet or All-in-One PC would contain a number of MTICs configured in a master/slave arrangement, catering for a flexible number of screen sizes. The 23-inch touch module from Wistron features ten DA8901 ICs, which provide the necessary performance to meet and exceed Windows 8 certification.The DA8901 comes in a 59 pin, 5.7 x 5.0mm QFN package. Its small footprint and minimal external bill of materials, makes it ideal for mounting alongside the LED emitter and receiver components on a very thin, low cost printed circuit board, located around the edges of the display or mounted on top of the display bezel to provide an edge-to-edge, clean industrial design, ideal for Windows 8 PCs, tablets and Ultrabooks.The DA8901 MTIC will be available in mass production from Q3 2013.

Secutech Thailand, planned for the first week of July, is a critical event for the security, fire and safety industries in Thailand. As a leading showcase of global security manufacturers, Secutech includes exhibitors in every segment of security, from key components, finished products to integration and solutions. The exhibition provides these exhibitors the chance to highlight their offerings to a crucial and growing market, while allowing attendees an overview of upcoming trends in safety and security.This year at Secutech Thailand, EverFocus plans to showcase a complete product lineup, including their comprehensive range of IP, HDcctv, Mobile and Analog Surveillance solutions. Installation based product line and mobile surveillance solutions will also be presented.EverFocus will demonstrate our newest recording products, such as the EPHD04+ compact HDcctv DVR and 960H capable PARAGON960 DVR, aimed at enhancing usability and surveillance quality.For imaging, EverFocus' upgraded network camera range, including award-winning IP cameras targeted at wide range of applications will be showcased, with emphasis on our enhanced third-party software compatibility.The new EDN1000 and EMN2000 series compact fixed domes, for indoor and on-board monitoring applications will also be on display. These cameras provide specialized features targeted especially at mobile applications, including IK10 Rating, IP67 Rating, backup partition, and EN50155 compliance.These devices will be highlighted on-site at EverFocus' booth, F107. EverFocus looks forward to providing you more detail about our products and solutions!Secutech Thailand Info:Date: July 3rd ~ July 5th, 2013Bangkok, ThailandBooth No.: F107

Altera Corporation expanded its FPGA-based solutions targeting smart energy systems by announcing a High-availability Seamless Redundancy (HSR) and Parallel Redundancy Protocol (PRP) reference design targeting smart grid substation automation equipment. Developed jointly with Flexibilis Oy, a provider of networking equipment and technologies for wireless and wired applications, the IEC 62439-3-compliant reference design includes Flexibilis Redundant Switch (FRS) intellectual property (IP) implemented on an Altera low-power, low-cost Cyclone-class FPGA or Cyclone V SoC. The reference design simplifies development and implementation of highly reliable mission-critical communications systems in smart grid substations."A key trend today in developing a smarter power grid is bidirectional communication and real-time control of the equipment in the grid's transmission and distribution substations," said Jason Chiang, senior strategic marketing manager in Altera's Industrial Business Unit. "Our FPGA-based HSR/PRP reference design enables equipment manufactures to build flexibility, performance, reliability and product longevity into their systems while lowering system costs and future proofing designs."The Flexibilis HSR/PRP IP included in the reference design is a triple-speed 10/100/1000 Mbps Ethernet Layer 2 switch that is scalable from 3 to 8 ports and is compliant with the IEC 62439-3 standard. The IP is optimized for use on an Altera low-power, low-cost Cyclone IV FPGA, Cyclone V FPGA or Cyclone V SoC, which feature an integrated dual-core ARM Cortex-A9 processor subsystem. Cyclone V SoCs enable customers to reduce component costs by implementing their HSR/PRP switch along with the associated software stacks running on the ARM processor subsystem in the FPGA. For timing synchronization, the HSR/PRP solution supports IEEE 1588 Precision Time Protocol (PTP) Version 2. Altera and Flexibilis are showcasing the FPGA-based HSR/PRP reference design in Altera's booth at Embedded World 2013, located in Hall 4, Booth 436."The IEC 62439-3 standard is rapidly evolving, making the flexibility of an FPGA an ideal platform to base our FSR IP on," said Heikki Ala-Juusela, chairman of the board at Flexibilis. "Altera's highly integrated FPGAs and SoCs allow users to reduce their total cost of ownership while at the same time leverage the device's performance to handle Gigabit Ethernet traffic. This HSR/PRP solution ensures designers can future-proof their substation automation systems by ensuring communication with future generations of intelligent electronics devices."The FPGA-based HSR/PRP reference design expands Altera's reach into the smart energy market. Altera's programmable solutions provide developers of smart grid equipment the means to adapt to evolving standards and increase their system's performance and scalability.No-hassle HSR/PRP Ethernet switch on an FPGAAltera and Flexibilis make it easy to implement an FPGA-based HSR/PRP Ethernet switch. Combining Altera FPGAs with the FRS IP provides an easy and cost-effective way to implement highly reliable mission-critical communications systems in smart grid substations by offering no license negotiation, no up-front licensing costs and no per-unit royalty reporting. For additional information regarding Altera's solutions targeting smart grid applications, contact your local Altera sales representative or visit http://www.altera.com/smartgrid.

Linear Technology has announced the LT3081, a rugged 1.5A wide input voltage range linear regulator with key usability, monitoring and protection features. The device has an extended safe operating area (SOA) compared to existing regulators, making it ideal for high input-to-output voltage and high output current applications where older regulators limit the output. The LT3081 uses a current source reference for single resistor output voltage settings and output adjustability down to "0." Output current limit can be set externally with a single resistor. This regulator architecture, combined with low millivolt regulation, enables multiple ICs to be paralleled easily for heat spreading and higher output current. The current from the device's current monitor can be summed with the set current for line-drop compensation, where the output of the LT3081 increases with current to compensate for line drops.The LT3081 achieves unmatched line and load regulation of under 2mV independent of output voltage and features an input voltage range from 1.2V to 40V. The device fits well in applications requiring multiple rails. Output voltage is programmable with a single resistor from 0V to 38.5V with a 1.2V dropout. The on-chip trimmed 50µA current reference is ±1% accurate. The regulation, transient response and output noise (30µVrms) are independent of output voltage due to the device's voltage follower architecture. The LT3081 is configurable as a 2-terminal current source with just two resistors. Input or output capacitors for stability are optional in either linear regulator or current-source mode of operation.The LT3081 provides several monitoring and protection functions. Current limit, accurate to ±10%, can be programmed with a single resistor. Monitor outputs provide a current output proportional to temperature (1µA/°C) and output current (200µA/A), allowing easy ground-based measurement. The current monitor can be used to compensate for cable drops. The LT3081's internal protection circuitry includes reverse input protection, reverse-current protection, internal current limiting and thermal shutdown.According to Robert Dobkin, Linear Technology's Vice President, Engineering and CTO, "The LT3081 regulator's robust architecture, protection and monitoring features provide designers with new tools for reliable design. A TO-220 package for high power dissipation and various surface mount packages for lower power applications are available. System power and temperature are easily checked for proper operation."The LT3081 is offered in a variety of thermally enhanced surface-mount compatible packages, including a low profile (0.75mm) 12-lead 4mm x 4mm DFN, a 16-lead thermally enhanced TSSOP and a 7-lead DD-Pak; all dissipate 2W in surface mount applications with no heat sink. The LT3081 is also available in a 7-lead TO-220 power package for vertical mounting to heat sinks for higher power dissipation capability. A wide variety of grades/temperature ranges are offered including: E & I grades -40°C to +125°C, H grade -40°C to +150°C and the high reliability MP grade -55°C to +150°C. 1,000-piece pricing starts at US$2.60 each for the E grade.

AIC's server team has announced the new storage system SB302-CP2, SB401-CP2 and 402-CP2 combined with Intel EPSD server board solution to shorten the validation process, and meet strong market demand.Designed with significant advantages to customers in performance, flexibility and reliability, SB302-CP2, SB401-CP2 and SB402-CP2, majorly focused on cloud computing market. "AIC and Intel jointly support, endorse, and recommend every unit of these Storage Server. We are ready to help customer's Cloud Architecture hardware setting. Suffice to say, speed is one of the main attributes on this cooperation. The combination can shorten product sourcing, validation and verification." said David Huang, AIC Sales Director.SB302-CP2, SB401-CP2 and SB402-CP2 covered from 3U to 4U form factor and supported up to 144TB of storage capacity throug twelve to thirty-six 3.5" drives and two 2.5" drives with onboard flash boot support includes eUSB SSD and SATA DOM, incl. Intel Trusted Platform Module (Intel TPM) header for Intel Trusted Execution Technology (Intel TXT) support. SB302-CP2, SB401-CP2 and SB402-CP2 can reduce data lost and improve data access efficiency, offering total integration with Intel server board S2600CP2. Supported for Intel Xeon processor E5-2600/E5-2600v2 product family and sixteen memory sockets support LR/U/R-DIMMs, the latest storage server series delivered up to 512 GB memory capacity.AIC storage server solution is ideally built to meet the needs of enterprise-level cloud storage application and various purposes. AIC storage server solution is ideally built to meet the needs of enterprise-level cloud storage application and various purposes. Incorporating with Intel Server Board, SB302-CP2, SB401-CP2 and 402-CP2 offer high versatility and expansion capacity to meet the evolving needs of vary-sized business and create a three-win situation for the booming demand of cloud architecture.Incorporated with Intel Server Board to provide powerful and high efficiency solution for cloud related application

Having established an early entry into the smartphone market, Taiwan-based power inductor manufacturer Chilisin delivered strong revenue performance in 2012. To sustain this growth momentum, Chilisin is now targeting the tablet market, a prominent and growing segment in the portable device market.According to the latest forecasts by the research institute, Gartner, tablet shipments will reach 197 million units in 2013, representing a year-on-year growth of 69.8%. Optimistic about the tablet boom, Chilisin notes that the tablet market is still at its high-growth stage and compared to makers from other application segments, tablet firms give priority to steady components supplier, hence pricing competition is not as severe. Chilisin has been establishing a strong position in the tablet market, and expects the tablet segment's share of total revenues to increase from 3% to 10-15%. Consequently, it expects the handheld device segment, including smartphones, to contribute 30% of the company's overall revenues.Miniaturized power inductors in demand to fit limited space in tabletsTablet shipment data has shown that 7- and 8-inch models are becoming mainstream. Chilisin provides various solutions such as power inductors, common mode filters, and high-frequency inductors for comprehensive tablet products. Chilisin states that because two thirds of the space inside a tablet is occupied by battery, the space left for circuit board is limited. Even a tiny fraction of an inch makes a big difference. As such, components must be shrunk to the smallest size possible.Catering to the miniaturization trend, Chilisin has developed shielded power inductors as small as 2.5x2.0x1.0mm specialized for large currents. Chilisin has also developed shielded low-DC-resistance power inductors as small as 4.0x4.0x1.2mm. In addition, Chilisin offers miniaturized closed magnetic circuit power inductors and ultra-small high-frequency power inductors. These power inductors effectively support the reduction of the PCB surface area and satisfy the growing demand for lighter, thinner, shorter and smaller devices offering higher performance yet consuming less power.In response to the growing demand for Full HD content, Chilisin is also introducing a solution for MIPI interfaces – the CMF11, a multilayer common mode filter that can reduce common mode interference. Chilisin emphasizes that compared to traditional wire-wound common mode filters, the CMF11 is produced using magnetic materials and multilayer technology. The multilayer technology allows the component to be soldered after etching, thereby accelerating production and effectively reducing cost.Comprehensive technologies enable one-stop shoppingChilisin has various types of production technology capable of providing comprehensive inductive solutions to its customers. In addition to wire-winding and multilayering technology, Chilisin also has the molding technology. Among inductor manufacturers, few firms are capable of boasting all three types of production technology. To make its product portfolio even more comprehensive, Chilisin has also been developing thin-film power inductors specializing in higher precision inductance. The newly developed thin-film inductors are expected to enter into mass production stage in the fourth quarter of 2013.One of Chilisin's key competitive advantage is its technology and ability to produce key materials such as ferrite powders and ferrite cores in-house. The mixing of raw materials can be tuned to cater to suit different products, applications and customer needs. Having a well-established vertical integration is one of the key factors that have helped Chilisin to serve many international brands.Dynamic and flexible strategy to target Japanese and South Korean marketsA while before the smartphone boom, Chilisin was early to foresee that the PC market was on its decline, setting the path for an early entry into the handheld sector. Leveraging the foundation it has laid in the smartphone market, Chilisin aims to focus on both China and other major brands in South Korea and Japan.Chilisin currently supplies power inductors in volume to various notable Chinese tablet brands. Chilisin is expecting Northeast Asian market shipment growth in the second half of the year. As smartphones and tablets continue to penetrate the consumer electronics industry, product life cycles will continue to shorten as product launches occur frequently. As such, demand for miniaturized power inductors has been consistently growing. With a comprehensive product portfolio and a sharp sensitivity for market trends, Chilisin expects equally strong performance in the tablet market.Chilisin eyes strong prospect of tablet market, expects strong growth

With unique loosely coupled wireless power technology, New Zealand-based PowerByProxi has been a promising up-and-comer in the industry recently. According to Greg Cross, Chaiman & CEO of PowerByProxi, the company has taken the lead to develop in-device charging solutions for consumer applications with better safety and efficiency.In order to expand this new market, he is looking for the opportunity to work with Taiwan makers by leveraging Taiwan's strong manufacturing capabilities and supply chain advantages.PowerByProxi was founded in 2007, and has raised USD 10M in funding in 3 rounds. The company is based in New Zealand with its R&D center, and has already set up sales office in Silicon Valley, US. It is planned to establish a new office in Taipei in the near future."PowerByProxi was a spun-out of University of Auckland, the leading wireless power research center over 30 year", Cross said. "We lead the industry with the most comprehensive technology and over 100 patents worldwide."Wireless charging technology with unique advantageHe emphasizes that PowerByProxi focuses on delivering more practical solutions for customers. For the wide adoption of wireless power, functionality will be a major driver to boost the take-off of the new applications.PowerByProxi has been delivering its solutions for industrial customers for four years to work in demanding mission critical environment from wind turbines to process automation. It is proved that its technology can perform with high level of efficiency from power source to device even in demanding variable load applications.As for consumer electronics, the company started an R&D program three years ago. "Unlike the existing tightly coupled solutions, our miniaturized loosely coupled or highly resonant wireless power can be integrated in even the most space constrained CE devices", Cross said."It means that CE devices can be charged with any orientation. With this spatial freedom, our solution really helps maximize customers experiencer with wireless power."Another feature of PowerByProxi's technology is that its industry-leading transmitter has the ability to charge one to multiple devices simultaneously. Moreover, it can intelligently detect foreign objects, so even conductive objects won't get hot. "This high level of safety and flexibility is the key to the wide adoption by consumers", he stressed.Promising outlook for consumer applicationsPowerByProxi has developed the world's first wireless rechargeable AA battery, Proxi-Fi AA. Cross explained that AA batteries are widely used in various CE devices, such as TV remote controllers, digital cameras, and hand-held game consoles. This solution can make in-device charging a ubiquitous reality for literally millions of existing devices.As for smartphones, PowerByProxi has also developed an integrated solution that meets safety standards. According to Cross, current wireless power solutions for smartphones are provided as an accessory rather than a built-in solution, which has slowed its wide adoption. PowerByProxi's technology, which is featured with miniaturization and effective heat management, can be directly integrated into a smartphone.With PowerByProxi's integrated receivers and Proxi-Fi AA wireless rechargeable batteries, Cross believed that, the in-device charging solution will be getting more popular as the technology matures. As a result, there will be a new product category such as transmitter stations emerging in the future.Cross foresees that, in the future, many wireless charging stations will be required in every household, so that consumers can put their TV remotes, cell phones, game controllers or cameras on/or in the station for charging at any time.Seeking for partnerships with Taiwan makersPowerByProxi is ready to offer the technology solutions, and the company is now ready to move into commercial production. Eyeing the strong manufacturing capabilities and supply chain advantages that Taiwan has, Cross believed that it is important for PowerByProxi to develop commercial opportunities with Taiwan's OEM partners in smartphone, tablet and battery markets.Cross has been visiting Taiwan frequently in recent times and they have begun talks with several local makers. In addition to building up partnerships, PowerByProxi also has plans to establish a product development center here. Moreover, he is looking at the potential of an IPO in Taiwan, as it represents a strong and knowledgeable market for hi-tech companies like PowerByProxi in terms of manufacturing and capital raising.In particular, he believes that the wireless power transmitter will become a whole new industry. "The demand will be huge as more in-device wireless charging solutions are available", Cross said. PowerByProxi will take the lead to drive the readiness of this new product and expects to work with Taiwan OEM partners in transmitter manufacturing and distribution in the future.Greg Cross, Chaiman & CEO of PowerByProxi