Out in Front
Friday 20 April 2018
Global semiconductor packaging materials market reaches US$16.7 billion in 2017
The global semiconductor packaging materials market reached US$16.7 billion in 2017, according to a report by SEMI and TechSearch International. While slower growth of smartphones...
Tuesday 3 April 2018
TSMC advanced packaging seen crucial for HPC chips
The InFO WLP (integrated fan-out wafer level packaging) and CoWoS (chip on wafer on substrate) developed by Taiwan Semiconductor Manufacturing Company (TSMC) have emerged as two major...
Friday 2 February 2018
ASE expects revenues to pick up starting 2Q18
Advanced Semiconductor Engineering (ASE) expects its IC backend business sales to register strong sequential growth in the second quarter and grow through the fourth quarter. The...
Tuesday 21 November 2017
ASE to expand WLCSP capacity at Singapore plant, sources say
In the wake of robust demand for wearable devices and automotive electronics applications, packaging and testing company Advanced Semiconductor Engineering (ASE) is set to expand...
Friday 15 September 2017
IC packager ASE reportedly enters Amazon supply chain
Advanced Semiconductor Engineering (ASE) has cut into the supply chain for Amazon's datacenter construction set to begin between 2017 and 2018, by providing 2.5D IC packaging services...
Thursday 14 September 2017
SEMICON Taiwan 2017: Brewer Science showcasing innovative materials for EUV and 3D IC manufacturing
With the semiconductor-manufacturing industry needing the high computing power that can only be achieved through advanced node logic and memory, as well as the heterogeneous-integration...
Tuesday 29 August 2017
Nidec to acquire SV Probe
Japan-based Nidec has announced plans to acquire SV Probe, a Singapore-based probe card manufacturer, through subsidiary Nidec-Read. A stock purchase agreement has been reached between...
Thursday 20 July 2017
TSMC InFO packaging brings more competitiveness to its 7nm process technology
Taiwan Semiconductor Manufacturing Company's (TSMC) integrated fan-out (InFO) wafer-level packaging technology is about to enter its second generation, which will bring more competitiveness...
Monday 12 June 2017
Packaging can extend physical limits of semiconductors, says TSMC chair
Moore's Law will reach its physical limits in 8-10 years, but the development of advanced packaging technology will help extend innovations, according to Morris Chang, chairman of...
Wednesday 26 April 2017
Micron talks about its integrated global operations
Micron Technology has been actively allocating its global resources to enhance its DRAM and NAND flash product lines, according to Wayne Allan, VP of global manufacturing at the US-based...
Wednesday 8 February 2017
Amkor to buy fellow packaging company Nanium
Amkor Technology and Nanium, a Portugal-based IC backend house specializing in wafer-level fan-out (WLFO) packaging solutions, have entered into a definitive agreement for Amkor to...
Monday 14 November 2016
Fujifilm to open new plant for advanced IC materials in Taiwan
Fujifilm has announced that its semiconductor business subsidiary, Fujifilm Electronic Materials, will launch the operation of its third plant in Taiwan in late November. The new...
Wednesday 26 October 2016
ASE ready to enter volume production of fan-out wafer-level packaging
Advanced Semiconductor Engineering (ASE) has reportedly obtained orders for fan-out wafer-level packaging (FOWLP) from Qualcomm, MediaTek and HiSilicon with volume production set...
Wednesday 28 September 2016
PTI buys wafer-level packaging equipment
Packaging and testing company Powertech Technology has purchased wafer-level packaging equipment from Ultratech SE Asia for NT$544 million (US$17 million), according to a company...
Tuesday 20 September 2016
Applied Materials, IME to advance R&D in fan-out wafer-level packaging
Applied Materials and the Institute of Microelectronics (IME), a research institute under Singapore's Agency for Science, Technology and Research, have announced a five-year extension...
Summary of Tech Supply Chain News!
Taiwan IPC makers pushing integrated services to boost profits and to see revenues grow in 2024, says DIGITIMES Research
Global smartphone shipments hit 2023 peak in 4Q23, but decelerate in 1Q24 due to seasonality, says DIGITIMES Research
Meet the analyst: Operating system in AI era will be king, says DIGITIMES Research