Micron Technology has been actively allocating its global resources to enhance its DRAM and NAND flash product lines, according to Wayne Allan, VP of global manufacturing at the US-based...

Amkor Technology and Nanium, a Portugal-based IC backend house specializing in wafer-level fan-out (WLFO) packaging solutions, have entered into a definitive agreement for Amkor to...

Fujifilm has announced that its semiconductor business subsidiary, Fujifilm Electronic Materials, will launch the operation of its third plant in Taiwan in late November. The new...

Advanced Semiconductor Engineering (ASE) has reportedly obtained orders for fan-out wafer-level packaging (FOWLP) from Qualcomm, MediaTek and HiSilicon with volume production set...

Packaging and testing company Powertech Technology has purchased wafer-level packaging equipment from Ultratech SE Asia for NT$544 million (US$17 million), according to a company...

Applied Materials and the Institute of Microelectronics (IME), a research institute under Singapore's Agency for Science, Technology and Research, have announced a five-year extension...

STATS ChipPAC has shipped over one billion fan-out wafer level packages (FOWLP), also known in the industry as embedded wafer-level ball grid array (eWLB), according to the company...

Advanced Semiconductor Engineering (ASE) and Deca Technologies, a subsidiary of Cypress Semiconductor, have announced the signing of an agreement whereby ASE will invest US$60 million...

Cadence Design Systems has announced the availability of foundry-proven IC packaging design and analysis solutions for advanced fan-out wafer-level chip scale packaging (WLCSP) and...

TSMC will be ready to roll out its 5nm process technology two years after the launch of its 7nm node, according to the pure-play foundry.

The US$18 billion semiconductor packaging materials will undergo steady single-digit unit volume growth for many material segments through 2019, including laminate substrates, IC...

TSMC is scheduled to move its integrated fan-out (InFO) wafer-level packaging technology to volume production in the second quarter of 2016. Apple will be among the first wave of...

Cadence Design Systems has announced that its Allegro system-in-package (SiP) and physical verification system (PVS) implementation technologies have been enabled for TSMC's integrated...

NANIUM S.A., a leading provider of advanced semiconductor packaging known for its innovative solutions, today announced it achieved outstanding reliability results for a Wafer-Level...

Taiwan's Xintec, an affiliate of Taiwan Semiconductor Manufacturing Company (TSMC) specializing in packaging services for CMOS image sensors as well as MEMS and fingerprint sensors,...

Taiwan Semiconductor Manufacturing Company's (TSMC) backend integrated fan-out (InFO) wafer-level packaging (WLP) technology will start contributing significantly to the IC foundry's...

Altera and TSMC have produced an UBM-free (under-bump metallization-free) WLCSP (wafer-level chip scale package) technology for Altera's MAX 10 FPGA products, according to the comp...

Image sensor packaging house Xintec will have its 12-inch wafer-level chip-scale package (WL-CSP) line ready for volume production in the second half of 2015, according to company...

Taiwan Semiconductor Manufacturing Company (TSMC) will have its backend integrated fan-out (InFO) wafer-level packaging (WLP) technology ready for 16nm chips, eyeing orders for Apple's...

United Test and Assembly Center (UTAC), a Singapore-based assembly and test company, will continue its investment in Taiwan in 2015 by setting up a 12-inch wafer-level packaging line,...

Robust growth in smartphone usage is encouraging semiconductor assembly and test services providers to head towards related packaging technologies. Amkor Technology is already among...

STATS ChipPAC has unveiled plans to invest another US$500 million to expand its operations in Singapore, where the IC backend house is headquartered.

Taiwan-based semiconductor equipment distributor Scientech has deepened its development of 3D IC packaging and wafer-level packaging equipment, expecting some of its equipment to...

Packaging and testing firm ChipMOS Technologies has forecast consolidated revenues for 2012 will increase 10%. The company revealed that net revenues on a US GAAP basis for 2011 grew...

Aptos Technology, which specializes in backend services for the production of NAND flash chips and devices such as microSD cards, announced March 13 that two of its subsidiaries will...