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NEWS TAGGED WAFER-LEVEL PACKAGING
Thursday 2 July 2020
Eternal Materials utilizes 90% of dry-film photoresist production capacity
Taiwan-based Eternal Materials continues to utilize as high as 90% of its dry-film photoresist production capacity, thanks to brisk PCB demand for base stations, servers, notebooks...
Friday 15 May 2020
China fab toolmaker ACM enhances offering for local demand
China-based ACM Research, a supplier of advanced wafer-level packaging equipment and other fab tools, has been expanding its product portfolio to satisfy the growing needs of China's...
Tuesday 7 April 2020
ASE enters ZTE supply chain for 5G base station chips
ASE Technology has entered the supply chain of ZTE, providing advanced backend technology to volume process 5G base station chips developed in house by the Chinese vendor, according...
Friday 3 January 2020
SJSemi strengthens presence in wafer-level 3D packaging segment
SJ Semiconductor (SJSemi), a joint venture between China-based foundry SMIC and backend house JCET, has started implementing its second-phase development looking to strengthen its...
Friday 22 November 2019
Chinese foundry HSMC gearing up for 14nm, 7nm chip production
Wuhan Hongxin Semiconductor Manufacturing (HSMC), a logic IC foundry founded in late 2017, is gearing up for 14nm and 7nm process manufacturing eyeing to be China's most advanced...
Monday 23 September 2019
TSMC may join forces with OSAT firms to build SoIC ecosystem
In the era of heterogeneous chips integration, Taiwan Semiconductor Manufacturing Company (TSMC) is expected be among global top-3 players in the advanced 3D IC packaging field along...
Friday 30 August 2019
Backend firms eyeing COF orders for ultraslim optical fingerprint ID chips
As super-slim in-display optical fingerprint sensor chips will see increasing penetration in 5G smartphones, Taiwan's IC backend service firms including ASE Technology Holding, ChipMos...
Thursday 15 August 2019
EgisTec eyes rosy 4Q19 on growing adoption of in-display fingerprint sensors
Taiwan-based fingerprint ID chip designer Egis Technology (EgisTec) expects to enjoy higher revenue growth for the fourth quarter of 2019 than the third quarter thanks to growing...
Wednesday 14 August 2019
Wafer-level backend demand promising
The manufacture of under-display optical fingerprint sensors for use in 5G-enabled phones will require wafer-level backend services. Suppliers capable of providing wafer-level backend...
Wednesday 24 April 2019
PTI remains focused on FOPLP for advanced logic ICs
Memory backend specialist Powertech Technology is aggressively developing its advanced packaging technology capability for logic IC production, and will remain focused on fan-out...
Tuesday 26 March 2019
Advanced packaging to generate nearly US$3 billion in revenues in 2019, says TSMC chairman
Pure-play foundry TSMC remains aggressive in expanding its advanced packaging business, which will generate nearly US$3 billion in revenues this year, according to company chairman...
Monday 10 December 2018
China leadframe supply chain not gaining ground, says Chang Wah chairman
Chances are not high for leadframe suppliers to score double-digit revenue increases in 2019, and China leadframe supply chain can hardly emerge to threaten Taiwan peers, according...
Friday 2 November 2018
China not necessarily top job destination for Taiwan IC packaging talent
China backend service providers such as Tongfu Microelectronics, Tianshui Huatian Technology, Jiangsu Changjiang Electronics Technology have been actively raiding talent from Taiwan's...
Friday 12 October 2018
TSMC to be only supplier of Apple A13 chips in 2019
Taiwan Semiconductor Manufacturing Company (TSMC) is set to win all orders for A13 chips that Apple will reelase in 2019, extending its dominance in the pure-play foundry sector,...
Tuesday 25 September 2018
TSMC to set up new fab for advanced packaging
Taiwan's Environmental Protection Administration (EPA) has started its environmental impact assessment on land designated for construction of a new plant by Taiwan Semiconductor Manufacturing...