The InFO WLP (integrated fan-out wafer level packaging) and CoWoS (chip on wafer on substrate) developed by Taiwan Semiconductor Manufacturing Company (TSMC) have emerged as two major...

Advanced Semiconductor Engineering (ASE) expects its IC backend business sales to register strong sequential growth in the second quarter and grow through the fourth quarter. The...

In the wake of robust demand for wearable devices and automotive electronics applications, packaging and testing company Advanced Semiconductor Engineering (ASE) is set to expand...

Advanced Semiconductor Engineering (ASE) has cut into the supply chain for Amazon's datacenter construction set to begin between 2017 and 2018, by providing 2.5D IC packaging services...

With the semiconductor-manufacturing industry needing the high computing power that can only be achieved through advanced node logic and memory, as well as the heterogeneous-integration...

Japan-based Nidec has announced plans to acquire SV Probe, a Singapore-based probe card manufacturer, through subsidiary Nidec-Read. A stock purchase agreement has been reached between...

Taiwan Semiconductor Manufacturing Company's (TSMC) integrated fan-out (InFO) wafer-level packaging technology is about to enter its second generation, which will bring more competitiveness...

Moore's Law will reach its physical limits in 8-10 years, but the development of advanced packaging technology will help extend innovations, according to Morris Chang, chairman of...

Micron Technology has been actively allocating its global resources to enhance its DRAM and NAND flash product lines, according to Wayne Allan, VP of global manufacturing at the US-based...

Amkor Technology and Nanium, a Portugal-based IC backend house specializing in wafer-level fan-out (WLFO) packaging solutions, have entered into a definitive agreement for Amkor to...

Fujifilm has announced that its semiconductor business subsidiary, Fujifilm Electronic Materials, will launch the operation of its third plant in Taiwan in late November. The new...

Advanced Semiconductor Engineering (ASE) has reportedly obtained orders for fan-out wafer-level packaging (FOWLP) from Qualcomm, MediaTek and HiSilicon with volume production set...

Packaging and testing company Powertech Technology has purchased wafer-level packaging equipment from Ultratech SE Asia for NT$544 million (US$17 million), according to a company...

Applied Materials and the Institute of Microelectronics (IME), a research institute under Singapore's Agency for Science, Technology and Research, have announced a five-year extension...

STATS ChipPAC has shipped over one billion fan-out wafer level packages (FOWLP), also known in the industry as embedded wafer-level ball grid array (eWLB), according to the company...

Advanced Semiconductor Engineering (ASE) and Deca Technologies, a subsidiary of Cypress Semiconductor, have announced the signing of an agreement whereby ASE will invest US$60 million...

Cadence Design Systems has announced the availability of foundry-proven IC packaging design and analysis solutions for advanced fan-out wafer-level chip scale packaging (WLCSP) and...

TSMC will be ready to roll out its 5nm process technology two years after the launch of its 7nm node, according to the pure-play foundry.

The US$18 billion semiconductor packaging materials will undergo steady single-digit unit volume growth for many material segments through 2019, including laminate substrates, IC...

TSMC is scheduled to move its integrated fan-out (InFO) wafer-level packaging technology to volume production in the second quarter of 2016. Apple will be among the first wave of...

Cadence Design Systems has announced that its Allegro system-in-package (SiP) and physical verification system (PVS) implementation technologies have been enabled for TSMC's integrated...

NANIUM S.A., a leading provider of advanced semiconductor packaging known for its innovative solutions, today announced it achieved outstanding reliability results for a Wafer-Level...

Taiwan's Xintec, an affiliate of Taiwan Semiconductor Manufacturing Company (TSMC) specializing in packaging services for CMOS image sensors as well as MEMS and fingerprint sensors,...

Taiwan Semiconductor Manufacturing Company's (TSMC) backend integrated fan-out (InFO) wafer-level packaging (WLP) technology will start contributing significantly to the IC foundry's...

Altera and TSMC have produced an UBM-free (under-bump metallization-free) WLCSP (wafer-level chip scale package) technology for Altera's MAX 10 FPGA products, according to the comp...