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NEWS TAGGED WAFER-LEVEL PACKAGING
Friday 22 November 2019
Chinese foundry HSMC gearing up for 14nm, 7nm chip production
Wuhan Hongxin Semiconductor Manufacturing (HSMC), a logic IC foundry founded in late 2017, is gearing up for 14nm and 7nm process manufacturing eyeing to be China's most advanced...
Monday 23 September 2019
TSMC may join forces with OSAT firms to build SoIC ecosystem
In the era of heterogeneous chips integration, Taiwan Semiconductor Manufacturing Company (TSMC) is expected be among global top-3 players in the advanced 3D IC packaging field along...
Friday 30 August 2019
Backend firms eyeing COF orders for ultraslim optical fingerprint ID chips
As super-slim in-display optical fingerprint sensor chips will see increasing penetration in 5G smartphones, Taiwan's IC backend service firms including ASE Technology Holding, ChipMos...
Thursday 15 August 2019
EgisTec eyes rosy 4Q19 on growing adoption of in-display fingerprint sensors
Taiwan-based fingerprint ID chip designer Egis Technology (EgisTec) expects to enjoy higher revenue growth for the fourth quarter of 2019 than the third quarter thanks to growing...
Wednesday 14 August 2019
Wafer-level backend demand promising
The manufacture of under-display optical fingerprint sensors for use in 5G-enabled phones will require wafer-level backend services. Suppliers capable of providing wafer-level backend...
Wednesday 24 April 2019
PTI remains focused on FOPLP for advanced logic ICs
Memory backend specialist Powertech Technology is aggressively developing its advanced packaging technology capability for logic IC production, and will remain focused on fan-out...
Tuesday 26 March 2019
Advanced packaging to generate nearly US$3 billion in revenues in 2019, says TSMC chairman
Pure-play foundry TSMC remains aggressive in expanding its advanced packaging business, which will generate nearly US$3 billion in revenues this year, according to company chairman...
Monday 10 December 2018
China leadframe supply chain not gaining ground, says Chang Wah chairman
Chances are not high for leadframe suppliers to score double-digit revenue increases in 2019, and China leadframe supply chain can hardly emerge to threaten Taiwan peers, according...
Friday 2 November 2018
China not necessarily top job destination for Taiwan IC packaging talent
China backend service providers such as Tongfu Microelectronics, Tianshui Huatian Technology, Jiangsu Changjiang Electronics Technology have been actively raiding talent from Taiwan's...
Friday 12 October 2018
TSMC to be only supplier of Apple A13 chips in 2019
Taiwan Semiconductor Manufacturing Company (TSMC) is set to win all orders for A13 chips that Apple will reelase in 2019, extending its dominance in the pure-play foundry sector,...
Tuesday 25 September 2018
TSMC to set up new fab for advanced packaging
Taiwan's Environmental Protection Administration (EPA) has started its environmental impact assessment on land designated for construction of a new plant by Taiwan Semiconductor Manufacturing...
Friday 7 September 2018
Backend firm Amkor to expand capacity in Taiwan
Amkor Technology will soon start operating a new factory at its manufacturing site in Longtan, northern Taiwan for wafer-level packaging (WLP) and wafer test services. The arrival...
Wednesday 4 July 2018
Sigurd revenues for 2Q18 hit record on robust IC packaging demand
IC packaging and testing specialist Sigurd Microelectronics has seen its revenues for June and the second quarter of 2018 hit record highs on robust market demand for smartphone RF...
Friday 22 June 2018
TSMC develops SiP technology
Pure-play foundry Taiwan Semiconductor Manufacturing Company (TSMC) has been enhancing its IC packaging capability by developing system-level packaging technology.
Wednesday 20 June 2018
Xintec halts 12-inch wafer-level packaging production
Image sensor packaging specialist Xintec has decided to suspend its 12-inch wafer-level packaging production line for one year due to disappointing CMOS image sensor (CIS) demand...