IC packaging and testing house Advanced Semiconductor Engineering (ASE) plans to budget US$700 million in capex for 2011, flat on year, an unnamed company executive has been cited...

STATS ChipPAC on September 15 celebrated the opening of a new manufacturing facility to process 300mm wafers using embedded wafer-level BGA (eWLB) technology. The Singapore-based...

Siliconware Precision Industries (SPIL) has entered the LED packaging business and started LED shipments through wirebonding packaging technology to three US-based clients. It is...

Aptos Technology, a 20%-held packaging and testing affiliate of Phison Electronics, has announced it recently acquired an 87% stake in wafer-level packaging (WLP) house Advanced Chip...

Advanced Chip Engineering (ACE), a wafer-level packaging and testing house which has investment from King Yuan Electronics Company (KYEC), suffered a fire on the second floor of a...

STATS ChipPAC has announced it is expanding capacity for full turnkey wafer-level packaging in its Singapore operation. The IC packaging and testing service provider said it is on...

Handheld devices incorporating functionality such as Bluetooth, FM radio, GPS and Wi-Fi have become the market driver for wafer-level packaging (WLP), Taiwan's Advanced Semiconductor...