News tagged packaging at DIGITIMES

NEWS TAGGED PACKAGING

Thursday 17 July 2025

Advanced packaging boom propels ASE, KYEC through shifting semiconductor landscape

Even as Taiwan's semiconductor tariff policies remain unresolved and the New Taiwan dollar continues to appreciate, major chip packaging...

Thursday 17 July 2025

Beyond Arizona: TSMC’s next big bet may be in rural Taiwan

Taiwan Semiconductor Manufacturing Co. (TSMC) has reiterated its commitment to growing semiconductor production in Taiwan, despite increasing investments in the US. Supply chain sources...

Wednesday 16 July 2025

LG enters hybrid bonding tool race, challenging Samsung and Hanwha

LG Electronics is making a bold push into the high-end semiconductor equipment market, setting its sights on hybrid bonding (HB) tools, critical for producing next-generation high-bandwidth...

Wednesday 16 July 2025

Penang's OSAT boom: ASE, Tongfu, Inari lead charge in advanced packaging

Malaysia has steadily developed its outsourced semiconductor assembly and testing (OSAT) industry, with Penang — often called the "Silicon Valley of the East" — at its...

Tuesday 15 July 2025

GlobalFoundries takes MIPS under its wing; Imagination shoots down SMIC takeover talk

With TSMC commanding the lion's share of foundry orders for data center AI accelerators, second-tier players like UMC, GlobalFoundries (GF), and SMIC are urgently repositioning to...

Tuesday 15 July 2025

Broadcom's plant investment in Spain reportedly canceled, dealing blow to Southern Europe's chip ambitions

Broadcom has reportedly scrapped its plan to invest US$1 billion in an assembly, test, and packaging (ATP) facility in Spain. Reuters and Europa Press cited insiders...

Tuesday 15 July 2025

Surge in GB200 and ASIC shipments boosts Taiwan semiconductor equipment sector

Strong demand for artificial intelligence (AI) applications has driven a significant rise in GB200 and ASIC shipments, propelling revenue growth across both upstream and downstream...

Monday 14 July 2025

Keysight sees AI chip boom driving verification market growth

Keysight Technologies expects AI and 6G networks to fuel structural growth in the semiconductor verification market that will outpace industry capital expenditure increases, according...

Monday 14 July 2025

BOE pivots beyond displays to glass substrate packaging, perovskite solar

BOE Technology chairman Chen Yanshun revealed at the 2025 BOE Investor Day that the company will pivot toward glass substrate packaging and perovskite solar cell (PSC) technology...

Friday 11 July 2025

Malaysia's Penang eyes semiconductor upgrade as AI demand reshapes industry

Malaysia's Penang state, home to about 13% of global semiconductor assembly and testing capacity, is positioning itself to capture more advanced chip manufacturing as artificial intelligence...

Friday 11 July 2025

Niching sees stellar 2Q25 results from AI, HPC, and advanced packaging applications

Materials supplier Niching is aiming to hit record-high revenue this year after strong performance in the first half of 2025, boosted by continued growing demand in the AI, high performance...

Friday 11 July 2025

NXP plots wafer shift to China as new CEO joins push for local supply chain

Kurt Sievers, the CEO of Dutch semiconductor giant NXP Semiconductors, who is set to officially step down at the end of October 2025, recently visited Shanghai and met with the mayor...

Friday 11 July 2025

Advanced packaging crisis hits as Asahi Kasei halts PSPI supply

Risks continue emerging one after another as the supply shortage of essential advanced packaging materials from Japan's chemical giant Asahi Kasei continues to escalate.

Thursday 10 July 2025

China's EDA shakeup stalls as Empyrean nixes Xpeedic deal

Empyrean Technology, one of China's top electronic design automation (EDA) vendors, announced on July 9 that it has terminated its proposed...

Thursday 10 July 2025

TSMC's CoPoS spurs industry shift as AI chip packaging hits glass ceiling

The global supply of CoWoS, or Chip-on-Wafer-on-Substrate, is tightening as demand for high-performance computing chips in AI applications continues to surge. These chips are simultaneously...

13/35 pages

BIZ FOCUS

Oct 2, 10:32

SK Group partners with OpenAI to advance global AI infrastructure

MOST-READ
7 DAYS NEWS

Full list