TSMC held its shareholders' meeting today, where chairman Mark Liu stated that the company has faced various global challenges in recent years, including the US-China trade war, climate...
TSMC has placed rush orders for CoWoS packaging equipment in order to meet surging demand for Nvidia's AI chips, according to sources at fab toolmakers.
TSMC's CoWoS, ASE Technology's FOCoS, and other advanced packaging technologies are expected to draw an influx of orders for AI and HPC processors, according to industry sources.
LED packaging service provider Ledtech Electronics swung back to profitability in April, buoyed by a pick-up in demand for low-temperature lighting devices.
Manz AG, a global high-tech engineering company with a comprehensive technology portfolio, showcases its high-density packaging production solutions at the SEMICON Southeast Asia...
SEMI, TECHCET, and TechSearch International jointly published "Global Semiconductor Packaging Materials Outlook" report on May 24, predicting that the size of global semiconductor...
LED packaging houses Bright LED Electronics and Harvatek continue to see customers adjusting their inventories in the second quarter, putting pressure on their operations. The firms...
Micron Technology could lose an estimated US$3 billion in revenue from China as a result of the country's ban on Chinese enterprises working on critical infrastructure projects procuring...
The semiconductor assembly and packaging industry has long struggled with labor-intensive processes. AUO Digitech (a subsidiary of AUO), specializing in smart industrial services,...
Chang Wah Technology (CWTC) has inaugurated a new facility in Kaohsiung, southern Taiwan, where it will manufacture leadframes for advanced quad flat no-lead (aQFN) packaging, third-generation...
LED module and packaging service provider Edison Opto has stepped up its deployment in the automotive segment, with plans to add a new LED automotive lighting product line in June,...
