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    Samsung Foundry rebounds on Tesla, Qualcomm orders
    3min ago
    US export restrictions reshape China's semiconductor equipment imports in 3Q25
    Oct 30, 18:30
    Global EV market shifts to multi-axis growth in 2024-25
    Oct 30, 18:30
    The unexpected benificary of China's rare earth curbs: Taiwan's recycling and refining industry
    Oct 30, 18:30
    Foxconn's AI transformation and strategic partnerships highlighted at GTC DC 2024
    Oct 30, 18:29
    Major CSPs boost AI server supply chain with increased capital expenditure
    Oct 30, 18:27
    Commentary: Trump-Xi meeting leaves core tech conflicts unresolved
    Oct 30, 18:27
    NEWS TAGGED PACKAGING
    Monday 4 August 2025
    ASE raises 2025 capex to US$5.5B as AI strains advanced packaging lines
    ASE Holdings, the world's second-largest IC packaging and testing company after Amkor Technology, struck a cautious note in its second-quarter earnings call despite booming AI-driven...
    Monday 4 August 2025
    Innolux starts mass production of FOPLP, eyes monthly shipments surge by 2H25
    Taiwanese display maker Innolux has officially entered volume production of its fan-out panel-level packaging (FOPLP) technology, a cornerstone of its broader transformation strategy...
    Monday 4 August 2025
    ASMPT emerges as advanced packaging's next kingmaker amid AI chip boom
    Singapore-based ASMPT, founded in Hong Kong in 1975, has grown from a regional distributor into one of the world's most influential semiconductor equipment makers. With AI and hyperscale...
    Sunday 3 August 2025
    Tong Hsing bets on 800G and GaN to offset currency-driven profit slide
    Tong Hsing Electronics, a key player in the backend packaging and testing of CMOS image sensors (CIS), held its quarterly investor conference on July 29, 2025. The company warned...
    Sunday 3 August 2025
    Greatek sees 2Q25 growth but faces currency erosion; flip-chip capacity expansion to complete by 1H26
    Benefiting from a tariff buffer period, customers actively stocked up in advance. Powertech Technology Inc. (PTI)'s invested testing and packaging subsidiary, Greatek Electronics,...
    Friday 1 August 2025
    AI talent's potential to revive Taiwan's traditional industries
    As Taiwan's AI server production and shipments continue to expand, high-performance computing chips are driving strong demand in manufacturing, packaging, and testing, making Taiwan's...
    Friday 1 August 2025
    Horng Terng fully booked with orders amid AI chip cooling demand surge
    Horng Terng Automation, a leading manufacturer of advanced semiconductor packaging equipment, has leveraged its joint development efforts with packaging clients and mastery of critical...
    Friday 1 August 2025
    ASE maxes out Taiwan backend capacity on AI, automotive demand
    ASE Holdings posted solid growth in advanced packaging and testing in the first half of 2025, fueled by robust demand for AI-related high-performance computing (HPC) chips. However,...
    Thursday 31 July 2025
    China's third central automaker revs up EV-chip cluster in Chongqing

    As China moves to curb domestic EV overcompetition and prioritize industrial upgrading, China Changan Automobile Group (CCAG) officially...

    Thursday 31 July 2025
    Samsung's Lee Jae-yong visits DC with US tariff negotiations ongoing, eyes further Texas investment
    Samsung Electronics Chairman Lee Jae-yong recently made a spontaneous trip to Washington, DC, to assist South Korea in ongoing reciprocal tariff negotiations with the US. As AI semiconductors...
    Wednesday 30 July 2025
    From substrate to system: A deep dive into Nvidia's CoWoP packaging shift
    As artificial intelligence and high-performance computing enter a phase of explosive growth, the limitations of traditional chip manufacturing and the slowing of Moore's Law have...
    Wednesday 30 July 2025
    China unveils first optical-interconnect GPU supernode in AI infrastructure push

    As demand for computing power accelerates alongside the rise of large-scale and multimodal AI models, China is ramping up efforts to expand...

    Wednesday 30 July 2025
    PTI overcomes awkward phase with FOPLP, expects major growth from 2026
    Memory packaging and testing company Powertech Technology Inc. (PTI) has heavily invested in fan-out panel-level packaging (FOPLP) in recent years. Chairman DK Tsai stated that the...
    Tuesday 29 July 2025
    Phison warns of BT substrate shortages, partial supply constraints expected from August 2025
    As raw materials for IC substrates face shortages, the supply of BT substrates continues to tighten. This has led to material shortages in flash and SSD packaging ICs. Phison CEO...
    Tuesday 29 July 2025
    Cadence expands beyond China with 3D IC momentum from TSMC ecosystem
    Cadence Design Systems expressed confidence in its second-half 2025 outlook despite lingering geopolitical uncertainties. In its second-quarter 2025 earnings call, executives affirmed...
    14/36 pages
    Research Report Database
    BIZ FOCUS
    Oct 2, 10:32
    SK Group partners with OpenAI to advance global AI infrastructure
    Thursday 30 October 2025
    Asian Power Devices Officially Launches New Vietnam Factory, Setting a New Global Production Milestone
    Thursday 30 October 2025
    BIWIN Mini SSD Named to TIME's 'Best Inventions of 2025'
    Thursday 23 October 2025
    APD: Technology-Driven Innovation Powering Global Growth
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