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NEWS TAGGED PACKAGING
Monday 4 August 2025
ASE raises 2025 capex to US$5.5B as AI strains advanced packaging lines
ASE Holdings, the world's second-largest IC packaging and testing company after Amkor Technology, struck a cautious note in its second-quarter earnings call despite booming AI-driven...
Monday 4 August 2025
Innolux starts mass production of FOPLP, eyes monthly shipments surge by 2H25
Taiwanese display maker Innolux has officially entered volume production of its fan-out panel-level packaging (FOPLP) technology, a cornerstone of its broader transformation strategy...
Monday 4 August 2025
ASMPT emerges as advanced packaging's next kingmaker amid AI chip boom
Singapore-based ASMPT, founded in Hong Kong in 1975, has grown from a regional distributor into one of the world's most influential semiconductor equipment makers. With AI and hyperscale...
Sunday 3 August 2025
Tong Hsing bets on 800G and GaN to offset currency-driven profit slide
Tong Hsing Electronics, a key player in the backend packaging and testing of CMOS image sensors (CIS), held its quarterly investor conference on July 29, 2025. The company warned...
Sunday 3 August 2025
Greatek sees 2Q25 growth but faces currency erosion; flip-chip capacity expansion to complete by 1H26
Benefiting from a tariff buffer period, customers actively stocked up in advance. Powertech Technology Inc. (PTI)'s invested testing and packaging subsidiary, Greatek Electronics,...
Friday 1 August 2025
AI talent's potential to revive Taiwan's traditional industries
As Taiwan's AI server production and shipments continue to expand, high-performance computing chips are driving strong demand in manufacturing, packaging, and testing, making Taiwan's...
Friday 1 August 2025
Horng Terng fully booked with orders amid AI chip cooling demand surge
Horng Terng Automation, a leading manufacturer of advanced semiconductor packaging equipment, has leveraged its joint development efforts with packaging clients and mastery of critical...
Friday 1 August 2025
ASE maxes out Taiwan backend capacity on AI, automotive demand
ASE Holdings posted solid growth in advanced packaging and testing in the first half of 2025, fueled by robust demand for AI-related high-performance computing (HPC) chips. However,...
Thursday 31 July 2025
China's third central automaker revs up EV-chip cluster in Chongqing

As China moves to curb domestic EV overcompetition and prioritize industrial upgrading, China Changan Automobile Group (CCAG) officially...

Thursday 31 July 2025
Samsung's Lee Jae-yong visits DC with US tariff negotiations ongoing, eyes further Texas investment
Samsung Electronics Chairman Lee Jae-yong recently made a spontaneous trip to Washington, DC, to assist South Korea in ongoing reciprocal tariff negotiations with the US. As AI semiconductors...
Wednesday 30 July 2025
From substrate to system: A deep dive into Nvidia's CoWoP packaging shift
As artificial intelligence and high-performance computing enter a phase of explosive growth, the limitations of traditional chip manufacturing and the slowing of Moore's Law have...
Wednesday 30 July 2025
China unveils first optical-interconnect GPU supernode in AI infrastructure push

As demand for computing power accelerates alongside the rise of large-scale and multimodal AI models, China is ramping up efforts to expand...

Wednesday 30 July 2025
PTI overcomes awkward phase with FOPLP, expects major growth from 2026
Memory packaging and testing company Powertech Technology Inc. (PTI) has heavily invested in fan-out panel-level packaging (FOPLP) in recent years. Chairman DK Tsai stated that the...
Tuesday 29 July 2025
Phison warns of BT substrate shortages, partial supply constraints expected from August 2025
As raw materials for IC substrates face shortages, the supply of BT substrates continues to tighten. This has led to material shortages in flash and SSD packaging ICs. Phison CEO...
Tuesday 29 July 2025
Cadence expands beyond China with 3D IC momentum from TSMC ecosystem
Cadence Design Systems expressed confidence in its second-half 2025 outlook despite lingering geopolitical uncertainties. In its second-quarter 2025 earnings call, executives affirmed...