Dr. Chen-Hua Douglas Yu, Vice President of Pathfinding for System Integration and the sole TSMC Distinguished Fellow, officially retired on July 8, 2025, closing a chapter in one...
Hana Technology, a South Korean equipment maker formerly focused on battery solutions, has developed core Through Glass Via (TGV) technology for semiconductor glass substrates, signaling...
Since the end of 2024, a critical shortage of T-Glass has been disrupting the global supply chain for advanced chip packaging. This specialized glass fabric, prized for its low thermal...
Glass substrates are considered one of the key directions for advanced packaging development, especially showing significant potential in high-performance computing (HPC) and data...
Small-to-medium-size panel maker Japan Display (JDI), despite having suffered 11 consecutive years of losses, global layoffs, and the recent resignation of its former CEO Scott Callon,...
As artificial intelligence fuels rapid growth in high-performance computing, it's also triggering a shift in how semiconductor chips are tested. Beyond leading AI GPU makers, major...
SEMICON Taiwan 2025 is scheduled to take place from September 10 to 12 at the Taipei Nangang Exhibition Center, with a series of technical forums kicking off on September 8. A key...
Japanese semiconductor equipment maker Towa Corporation, a global leader in advanced packaging systems, recently unveiled its newest technology for sixth-generation HBM4, aiming squarely...
TSMC announced important resolutions from the extraordinary general meeting of its subsidiary TSMC Arizona. Rick Cassidy, senior vice president of corporate strategy development and...
As global semiconductor production shifts toward localization, Taiwan's chipmaking ecosystem is responding with a unified alliance strategy to expand its presence in the US, Europe,...
Benefiting from a surge of rush orders spurred by US tariffs and steadily rising demand from AI server customers, memory packaging and EMS firm OSE is seeing its business momentum...
CoAsia, a Taiwan-based semiconductor company, announced that its subsidiary, CoAsia SEMI, will partner with Rebellions, a South Korean AI chipmaker, to co-develop a next-generation...
TSMC's US$65 billion Arizona expansion, initially hampered by cost overruns and construction delays, is now showing signs of strategic success as the chipmaker addresses key operational...
