Kaynes Semicon, the semiconductor assembly and test arm of Kaynes Technology India Ltd., has adopted engineering simulation software from Synopsys to strengthen its outsourced semiconductor...
AI and high-performance computing chip demand continue to expand, keeping TSMC's CoWoS capacity tight into 2026. The supply constraint is pushing Taiwan's major OSAT providers, including...
Foxconn's move from assembly to semiconductor packaging in India marks a strategic deepening that could accelerate local supply-chain integration and influence global EMS competition,...
Looking beyond advanced logic nodes, compound semiconductors have emerged as a strategic priority for applications ranging from power electronics and RF to optoelectronics.
Samsung Electronics is reportedly accelerating preparations for next-generation high-bandwidth memory (HBM), moving to establish a hybrid bonding production line at its Cheonan campus...
TSMC raised its 2026 capital expenditure forecast to US$52-56 billion, driving strong demand in the global semiconductor supply chain amid AI growth. Memory giants SK Hynix, Micron,...
SK Hynix has started placing initial equipment orders to convert an idle Cheongju fab into a high-bandwidth memory (HBM) packaging and testing line, according to ET News,...
Due to low production efficiency and intense price competition, major panel makers like AUO, Innolux, and LG Display are selling older LCD factories. Semiconductor companies such as...
Applied Materials used its fiscal first quarter 2026 earnings call to underscore that AI-related semiconductor demand is running ahead of earlier forecasts, with industry revenues...
Amid mounting tariff pressures and geopolitical risks, the Taiwan Printed Circuit Association (TPCA) announced that it will showcase a Taiwan advanced packaging zone at Apex Expo 2026,...
The latest global ranking of the top 10 outsourced semiconductor assembly and test (OSAT) providers points to a shift in competitive balance. In 2025, five Chinese companies entered...
The microcontroller unit (MCU) sector has emerged from inventory destocking in 2025, with the easing of US-China tariff tensions signaling a market recovery. Industry insiders expect...
Xintec, the packaging and testing subsidiary of TSMC, held an investor conference in which Chairman CH Chen said full-year 2025 revenue maintained modest growth, driven primarily by...
Taiwan-based AblePrint Technology, a key supplier of advanced packaging defoaming equipment for major clients including TSMC, reported record-breaking performance despite earlier regulatory...
