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NEWS TAGGED PACKAGING
Tuesday 28 October 2025
SK Hynix M15X completion expected by end of 2025
To meet the growing demand for HBM, SK Hynix is accelerating the construction of its DRAM production base, M15X plant in Cheongju, South Korea. According to Yonhap News and...
Monday 27 October 2025
LG Electronics advances HBM and glass substrate equipment for advanced packaging
LG Electronics is aggressively entering the advanced semiconductor packaging equipment market to meet the surging demand driven by AI. The company plans to gradually localize production...
Monday 27 October 2025
Taiwan’s PCB makers enter ‘AI moment’ as complexity nears semiconductor levels
The development of artificial intelligence (AI) chips has brought the printed circuit board (PCB) and semiconductor industries closer together. Zhen Ding Technology chairman Charles...
Friday 24 October 2025
Samsung CTO: Cross-disciplinary collaboration key to semiconductor innovation
Silicon transistors are approaching their physical limits, and AI is increasing demand for higher density, performance, and energy efficiency. Advanced packaging and bonding technologies...
Thursday 23 October 2025
Taiwan's ZDT and Unimicron forecast golden decade for PCB industry on AI boom
As artificial intelligence (AI) and high-performance computing (HPC) lead a new industrial revolution in the PCB sector, Taiwanese giants Zhen Ding Tech (ZDT) and Unimicron are optimistic...
Thursday 23 October 2025
Taiwanese firms poised to lead TGV process equipment amid semiconductor-PCB integration
Tongtai and Contrel are focusing on the convergence of semiconductors and PCBs in advanced TGV packaging. Taiwanese companies aim to lead in this area, as Tongtai seeks profitability...
Thursday 23 October 2025
Apple assembles new Vision Pro in Vietnam, signaling broader shift from China

Apple's updated Vision Pro headset, launching this week, may not bring sweeping new features, but the packaging reveals a quietly significant...

Wednesday 22 October 2025
TSMC strengthens foundry 2.0 leadership, backed by robust AI chip packaging demand
AI investment has boosted semiconductor demand, with TSMC reporting a third-quarter 2025 revenue of US$33.1 billion. Strong advanced packaging demand, supported by Nvidia GPUs, benefits...
Wednesday 22 October 2025
The Packaging Pivot Driving AI Chip Performance

Artificial intelligence (AI) is reshaping the semiconductor landscape-both as a fast-growing end market and as a catalyst for innovation across mobile, automotive, networking,...

Wednesday 22 October 2025
ASE to acquire ADI's Penang plant, plans long-term supply deal
ASE Technology Holding announced it will acquire Analog Devices' (ADI) manufacturing facility in Penang, Malaysia, further expanding its global IC packaging and testing service network...
Tuesday 21 October 2025
Global Electronics Association joins AMD and ASE to encourage advanced packaging standardization at IMPACT 2025
The Global Electronics Association (GEA) participated as a co-organizer in the 2025 International Microsystems, Packaging, Assembly, and Circuits Technology (IMPACT) Conference, hosting...
Tuesday 21 October 2025
Micron lures Korean engineers to Taiwan with premium salaries
The world's third-largest memory manufacturer, Micron Technology, is reportedly recruiting Korean engineers to work in Taiwan. Sources indicate that Micron's hiring targets engineers...
Tuesday 21 October 2025
China races to cut ASML reliance: AMIES unveils lithography lineup
China's semiconductor industry is stepping up its drive for self-sufficiency. In its latest move, AMIES Technology, a subsidiary of Shanghai Micro Electronics Equipment (SMEE), introduced...
Tuesday 21 October 2025
Column: Advanced packaging's standardization challenge

While advanced packaging technologies first gained traction in high-end smartphones, it was the supply crunch of AI chips in 2023 that...

Friday 17 October 2025
Taiwan PCB makers seize semiconductor opportunity amid load board shortage
As the AI boom drives demand for advanced packaging, chip testing at the backend is facing challenges in temperature, frequency, and speed. In response, the testing interface industry...