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NEWS TAGGED PACKAGING
Monday 2 June 2025
Samsung Electro-Mechanics to supply glass substrate samples to US firms, Korean giants target TSMC's packaging lead
Samsung Electro-Mechanics announced that preparations for its glass substrate sample production line are nearing completion, with plans to begin supplying samples to two to three...
Monday 2 June 2025
AIchip goes all in on CoWoS advanced packaging
Fabless manufacturer AIchip Technologies held a shareholders' meeting on May 29, during which it held a reelection of directors and supervisors. Jerry Tzou, the director of advanced...
Thursday 29 May 2025
Hanmi Semiconductor wins US$5.8 million ASE supply contract
Hanmi Semiconductor has secured a major supply agreement with Taiwan's ASE Technology Holding Co., marking another strategic win in its global expansion drive. Under the contract,...
Tuesday 27 May 2025
TSMC's CoWoS boom squeezes substrates, stirs NAND pricing
Mitsubishi Gas Chemical (MGC), the world's leading supplier of BT substrate base materials, has notified clients of delayed shipments due to tightening raw material supply. The growing...
Tuesday 27 May 2025
FOCI advances 1.6T optical module validation as LPO and CPO poised to coexist
As data transmission and exchange volumes skyrocket, high-speed connectivity has emerged as a defining trend in the tech landscape. FOCI Fiber Optic Communications, a leading player...
Tuesday 27 May 2025
Malaysia bets on advanced chip design to power US$270 billion semiconductor ambition
Southeast Asian nation pivots from assembly hub to IC design powerhouse amid global supply chain tensions, but faces talent and scaling challenges
Tuesday 27 May 2025
AI chips and CoWoS orders keep HPI’s outlook running hot
Hon. Precision (HPI), a leading IC test equipment manufacturer, is benefiting from robust AI chip demand. In the first quarter of 2025, its after-tax net profit surged to NT$2.568...
Monday 26 May 2025
TSMC's advanced packaging booms on Middle East AI orders, boost by Apple's WMCM
Semiconductor industry analysts project a bright future for TSMC's advanced packaging systems, driven by significant demand from the Middle East for AI-centric CoWoS chips and Apple's...
Monday 26 May 2025
Weekly news roundup: Huawei's 5G lead, DeepSeek's LLM moves, and TSMC's packaging gap
These are the most-read DIGITIMES Asia stories from the week of May 19 – May 25. Highlights include China's accelerating push for tech self-sufficiency with new AI...
Monday 26 May 2025
As Nvidia deepens roots in Taipei, Taiwan launches push to attract global talent

Nvidia CEO Jensen Huang delivered a powerful message at the company's GTC global press conference in Taipei this week: the key to Nvidia's...

Friday 23 May 2025
TSMC urges caution in US semiconductor probe, highlights US$165B investment in Arizona
Taiwan's TSMC has urged the US Department of Commerce to avoid disrupting its record-setting US$165 billion chip investment in Arizona amid a national security probe into semiconductor...
Friday 23 May 2025
IBM and Deca boost North American chipmaking with new advanced packaging line in Quebec
According to an official press release, Deca Technologies has signed an agreement with IBM to deploy its M-Series and Adaptive Patterning technologies at IBM's advanced packaging...
Thursday 22 May 2025
Nvidia's Taiwan inner circle powers up for the Blackwell era
During Computex 2025, Nvidia CEO Jensen Huang highlighted key Taiwanese suppliers central to its AI chip packaging and testing ecosystem. These include Unimicron for CoWoS substrates,...
Thursday 22 May 2025
ASE’s advanced test unit surges on AI chip boom
ASE Technology Holdings is witnessing strong order momentum in its advanced test materials (ATM) business, fueled by surging AI-related demand. Company executives revealed that testing...
Thursday 22 May 2025
Advanced packaging fuels growth for C Sun
As capex simultaneously rises across foundry, outsourced semiconductor assembly and test (OSAT), and printed circuit board (PCB) sectors, C Sun Manufacturing, a specialist in PCB...