中文網
  • 繁體
  • 简体
    •
  • My account
  • Sign in
  • Sign up
    •
    Trending
    CONNECT WITH US
    NEWS TAGGED PACKAGING
    Monday 11 August 2025
    From cost burden to growth engine: AI revolutionizes advanced packaging
    At the OCP APAC 2025 conference, a high-profile panel brought together senior executives from TSMC, ASE, MediaTek, and Synopsys to examine how chiplets, advanced packaging, and next-generation...
    Sunday 10 August 2025
    Tesla's Dojo shutdown signals new alliances with Samsung and Intel in AI race

    Tesla is dismantling its in-house AI supercomputer project "Dojo" and shifting gears toward a new external chip strategy involving Samsung...

    Sunday 10 August 2025
    Ample Electronic unveils advanced thermal paste for AI chip cooling

    Ample Electronic Technology, a leading upstream supplier of conductive pastes and thick-film conductor materials for passive components,...

    Friday 8 August 2025
    Intel breaks from GPU-centric playbook as CEO Tan charts AI-focused overhaul
    Intel is undergoing a sweeping strategic overhaul under CEO Lip-Bu Tan, signaling a decisive break from legacy structures and a bold push to reposition the company at the center of...
    Thursday 7 August 2025
    OSAT giants expand in US as Trump pushes for 100% tariff on chip imports
    Amkor and ASE, two of the world's top semiconductor packaging and testing providers, are deepening their US presence following the return of Trump-era "Made in America" policies....
    Thursday 7 August 2025
    ASE challenges TSMC’s photonics play with CPO packaging push
    At the inaugural Open Compute Project (OCP) APAC Summit in Taipei, ASE Group Executive Vice President Tingu Yin Chang said surging AI computing demand has become the primary catalyst...
    Wednesday 6 August 2025
    OCP APAC 2025: ASE doubles down on co-packaged optics as AI reshapes semiconductor design
    As artificial intelligence continues to redefine the architecture and demands of modern computing, ASE is positioning Co-Packaged Optics (CPO) and advanced packaging at the center...
    Tuesday 5 August 2025
    Taiwan OSAT gains from BIS whitelist fall short as US grants Chinese firms exemptions
    Taiwan's IC OSAT supply chain was previously expected to benefit from US Bureau of Industry and Security (BIS) restrictions on Chinese semiconductor firms. The BIS's semiconductor...
    Tuesday 5 August 2025
    CoWoS capacity utilization reportedly only 60% amid AI boom, supply chain on alert
    Reports have emerged that TSMC's advanced packaging technology, CoWoS, is operating at only 60% capacity utilization. Such a supply-demand mismatch has confused the supply chain.
    Tuesday 5 August 2025
    Canon builds first fab in 20 years to chase back-end boom
    Japanese optical giant Canon, which had not built a new semiconductor lithography equipment production plant since 2004 due to a declining market, announced on July 30, 2025, the...
    Monday 4 August 2025
    ASE raises 2025 capex to US$5.5B as AI strains advanced packaging lines
    ASE Holdings, the world's second-largest IC packaging and testing company after Amkor Technology, struck a cautious note in its second-quarter earnings call despite booming AI-driven...
    Monday 4 August 2025
    Innolux starts mass production of FOPLP, eyes monthly shipments surge by 2H25
    Taiwanese display maker Innolux has officially entered volume production of its fan-out panel-level packaging (FOPLP) technology, a cornerstone of its broader transformation strategy...
    Monday 4 August 2025
    ASMPT emerges as advanced packaging's next kingmaker amid AI chip boom
    Singapore-based ASMPT, founded in Hong Kong in 1975, has grown from a regional distributor into one of the world's most influential semiconductor equipment makers. With AI and hyperscale...
    Sunday 3 August 2025
    Tong Hsing bets on 800G and GaN to offset currency-driven profit slide
    Tong Hsing Electronics, a key player in the backend packaging and testing of CMOS image sensors (CIS), held its quarterly investor conference on July 29, 2025. The company warned...
    Sunday 3 August 2025
    Greatek sees 2Q25 growth but faces currency erosion; flip-chip capacity expansion to complete by 1H26
    Benefiting from a tariff buffer period, customers actively stocked up in advance. Powertech Technology Inc. (PTI)'s invested testing and packaging subsidiary, Greatek Electronics,...
    2/33 pages
    Research Report Database
    BIZ FOCUS
    Aug 5, 11:49
    Cultivating OCP, embracing open source
    Wednesday 13 August 2025
    Advanced WLP and back-end solutions at SEMICON Taiwan 2025
    Wednesday 9 July 2025
    TRI unveils new multi-camera AOI, TR7500 SIII Ultra
    Wednesday 13 August 2025
    Alif Semiconductor vying for market dominance in battery-powered generative AI applications and Edge AI
    RESEARCH INSIGHTS
    Intel signals overhaul of IDM 2.0 and foundry strategy with Lip-Bu Tan's appointment, says DIGITIMES