CONNECT WITH US
NEWS TAGGED CHIPS + COMPONENTS
Wednesday 8 July 2026
ELAN revenue hit the top of forecast as notebook and AI products gained traction
ELAN reported June 2026 revenue of NT$1.059 billion, up 5.48% from the prior month and 7.13% from a year earlier. The Taiwanese chip maker said second-quarter 2026 revenue reached...
Wednesday 8 July 2026
Samsung's Jae-yong Lee heads to Sun Valley Conference for likely AI talks

Samsung Electronics Chairman Jae-yong Lee departed for the Sun Valley Conference in the US on July 7, marking his second straight year...

Wednesday 8 July 2026
France-Taiwan tech ties move from talks to factory floor

France's push into Taiwan's tech ecosystem has entered a new phase. After three years of cultural outreach and research exchanges,...

Wednesday 8 July 2026
AI memory boom turns price hikes into antitrust flashpoint across supply chain
As AI demand drives record price increases in the memory market, the aftermath of such volatility is weighing on the wider supply chain, rippling into downstream industries where manufacturers...
Wednesday 8 July 2026
TSMC earnings call could signal how long the AI boom can keep lifting its outlook

TSMC's July 16 earnings call is likely to test how far the chipmaker can extend its already upbeat guidance, as investors look for...

Wednesday 8 July 2026
Netherlands presses China talks on Nexperia and ASML trade frictions
The Netherlands used a trade mission to Beijing this week to reopen economic ties with China while semiconductor tensions remained at the center of the agenda. Dutch trade officials...
Wednesday 8 July 2026
National Center for Instrumentation Research helps academia break 2D materials bottleneck
As AI infrastructure chip orders flood in and TSMC runs near nonstop, academia has found it difficult to carry out industry-academia collaboration with the world's top foundry house...
Wednesday 8 July 2026
Samsung widens Nvidia Vera Rubin memory play with PCIe 6.0 eSSD

Samsung Electronics has started mass production of its PM1763 enterprise SSD, a PCIe 6.0-based drive built for AI infrastructure and slated...

Wednesday 8 July 2026
CPUs return to AI spotlight as agentic workloads reshape data center demand; Perplexity plans to adopt Nvidia's Vera
As AI workloads pivot toward emerging needs for systems that can perform tasks with a coordinated balance between speed and control, the hardware race is moving beyond GPUs. While...
Wednesday 8 July 2026
Samsung's HBM4 comeback hinges on one chip-level advantage

Samsung Electronics is using HBM4 to test whether its memory, logic, foundry, and advanced packaging businesses can finally work as...

Wednesday 8 July 2026
Apple tests CXMT DRAM, thrusting China's memory champion into AI spotlight

China's CXMT has moved from a little-known state-backed DRAM maker to one of the most closely watched companies in the global memory...

Wednesday 8 July 2026
AI servers squeeze MOSFET supply while PC slump tests power component pricing power

AI servers are tightening Taiwan's power component supply chain, lifting demand for MOSFETs, PMICs, cooling motors and power management...

Wednesday 8 July 2026
China unveils memristor chip for real-time neural dynamics, pushes computing into millisecond range

A Chinese research team has developed a phase-change memristor-based neural dynamical system chip, offering a potential hardware path...

Wednesday 8 July 2026
ASE expands globally as Hanmi Semiconductor targets CoWoS packaging demand
South Korean equipment maker Hanmi Semiconductor is moving beyond high-bandwidth memory (HBM) tools into advanced chip packaging, a shift that could affect the global semiconductor...
Wednesday 8 July 2026
Chinese equipment maker wins first large-format PLP lithography order for AI packaging equipment
Circuit Fabology Microelectronics Equipment (CFMEE) has secured China's first commercial order for a large-format panel-level packaging lithography tool, marking the company's entry...