Memory design IC firm AP Memory reported consolidated revenue of NT$1.495 billion (US$48.3 million) in the third quarter of 2025, up 17.3% year-over-year, driven by multiple interposers...
The surge in AI computing has led to a significant price increase in DRAM and NAND Flash, with major manufacturers raising prices by up to 30% in late 2025, putting cost pressure...
The surge in storage demand driven by AI servers has caused a severe shortage of traditional hard disk drives (HDDs), with delivery times reportedly extending beyond two years. Major...
Edge AI startup Anaflash has unveiled a new AI microcontroller built on Samsung Electronics' 28nm foundry process. The move marks another design win for Samsung as it works to revive...
China's DRAM maker CXMT plans to start mass production of fourth-generation high-bandwidth memory (HBM3) in 2026 using mass reflow molded underfill (MR-MUF) packaging, the same technology...
Touch panel maker TPK Holding announced plans to acquire a 23.83% stake in IC design firm Ilitek for NT$5.807 billion (approx. US$188 million), at NT$49.5 per share, making TPK the...
The global semiconductor industry is facing widening supply-demand imbalances amid the AI boom, with memory and processor chips in particularly short supply. Prices have surged while...
Touch IC leader Elan Microelectronics held an earnings call on November 6, reporting that third-quarter performance exceeded internal forecasts despite a weaker consumer market than...
Every year's new flagship phones bring questions regarding pricing. This year, Samsung's Galaxy S26 series is expected to see a price increase from its predecessor. As the memory...
Google has introduced Ironwood, its seventh-generation Tensor Processing Unit (TPU), designed for large-scale AI model training, reinforcement learning, and inference.
Taiwan's machinery industry is leveraging artificial intelligence to transform from a traditional manufacturing base into a high-tech powerhouse, with growing ambitions in the global...
Update: Jensen Huang, CEO of Nvidia, is already in Tainan, a city about 300 kilometers south of Taipei. He dined with several key executives of TSMC, including CC Wei, chairman and...
Hanmi Semiconductor announced it will release a dedicated device called the "Wide TC Bonder" by the end of 2026, designed specifically for next-generation high-bandwidth memory (HBM)...
Amid US President Donald Trump's tariff threats and new incentives under the US "One Big Beautiful Bill Act," foreign companies are increasingly planning major investments in the...
ASE has announced a significant upgrade to its in-house integrated design ecosystem (IDE) platform, introducing IDE 2.0, which features AI integration to speed up design iterations...
