News tagged Chips + components at DIGITIMES

NEWS TAGGED CHIPS + COMPONENTS

Thursday 24 September 2026

Beijing Eswin heads for HK IPO as RISC-V growth shifts to autos, industrial chips

Beijing Eswin Computing Technology has cleared its Hong Kong Stock Exchange listing hearing, moving closer to becoming the market's first listed RISC-V-focused chip company.

Thursday 24 September 2026

Qualcomm sticks with TSMC for both 2nm Snapdragon flagships as Samsung steps up foundry push

Qualcomm is sticking with TSMC for both of its newly launched 2nm Snapdragon flagship processors, extending the Taiwan foundry's hold on Qualcomm's top-tier mobile chips even as Samsung...

Thursday 24 September 2026

Qualcomm splits flagship mobile SoCs into more tiers

Qualcomm is launching two flagship platforms in 2026—the Snapdragon 8 Elite Gen 6 and the Snapdragon 8 Elite Extreme Gen 6—signaling a new era of finer-grained flagship...

Thursday 24 September 2026

Samsung reportedly shifts sub-10nm DRAM roadmap toward hybrid bonding

Samsung Electronics has reportedly revised the roadmap for its first sub-10nm DRAM generation, making a wafer-to-wafer hybrid-bonding architecture the baseline for its D0a process...

Thursday 24 September 2026

Xi-Trump summit masks AI rift as Chinese AI leaders stay away

Chinese President Xi Jinping is set to make his first state visit to the US since 2015, with the Trump administration rolling out high-level welcoming ceremonies, a state dinner and...

Thursday 24 September 2026

Qualcomm pushes Snapdragon PCs further into Linux, GoogleBook as AI shifts to the device edge

Qualcomm used the second day of its Snapdragon Summit 2026 to underline a broader shift for Snapdragon-powered PCs, announcing Linux...

Thursday 24 September 2026

TSMC locks in 3-6% wafer out price hikes for 2027

TSMC is reportedly planning another wafer foundry price increase, with supply chain sources saying its order visibility now extends...

Thursday 24 September 2026

Eternal Materials eyes 2H26 peak season as precision equipment, advanced packaging shipments rise

Eternal Materials reported unaudited earnings before taxes (EBT) of NT$269 million (approx. US$8.47 million) in August 2026, up 28.05% from August 2025, with pre-tax earnings per share...

Thursday 24 September 2026

Qualcomm bets on earphones as the voice gateway for personal AI

Qualcomm used its keynote on the second day of Snapdragon Summit 2026 to argue that earphones, glasses, and other wearables will shape the next phase of AI computing. For global consumers...

Thursday 24 September 2026

Qualcomm adopts 'offset PoP' packaging to cool new flagship phone SoC

Qualcomm unveiled two flagship mobile platforms at the Snapdragon Summit 2026, including the Snapdragon 8 Elite Extreme Gen 6, which changes its packaging approach to improve heat...

Thursday 24 September 2026

Alibaba Zhenwu V900 joins Huawei Ascend 960 in race to fill Nvidia's China AI compute gap

Alibaba has formally unveiled its self-developed Zhenwu V900 AI chip at the 2026 Apsara Conference, with CEO Eddie Wu describing the T-Head Semiconductor-designed processor as "China's...

Thursday 24 September 2026

Qualcomm's PickNik deal brings robotics software to its edge AI push

MoveIt's integration with Qualcomm's Dragonwing and Arduino platforms could give robot builders a more direct route from on-device AI to motion planning and control, while also testing...

Thursday 24 September 2026

Trump-Xi pre-summit watch: H20 setbacks and Ascend gains reshape China's Nvidia calculus

Ahead of the Trump-Xi summit, the key semiconductor question is no longer simply how much Nvidia hardware Washington will allow China to buy.

Thursday 24 September 2026

Powertech targets quarterly growth in 2026, eyes record high

Powertech Technology expects stronger memory packaging and testing demand, higher average selling prices (ASPs), and ramping high-end...

Thursday 24 September 2026

SK Hynix Indiana HBM plant faces lawsuit

SK Hynix's high-bandwidth memory (HBM) production site under construction in Indiana has been drawn into local litigation as the race...

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