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Friday 7 August 2026
Wah Hong speeds AI cooling and semiconductor materials push with Taoyuan pilot line

Wah Hong Industrial Co. said that in the first half of 2026, it accelerated development of high-value-added products, new technologies...

Friday 7 August 2026
SK Hynix commits US$39 billion to new Yongin and Cheongju fabs as AI memory demand builds
SK Hynix has approved roughly KRW54 trillion (approx. US$39 billion) in new fab construction across two domestic sites, allocating KRW35.2 trillion to a second Yongin fab and KRW19.1...
Friday 7 August 2026
Zhen Ding Tech hits July revenue record on AI and consumer electronics demand

Zhen Ding Tech (ZDT) said July revenue reached its highest level so far in 2026, supported by strong momentum across mobile communications,...

Friday 7 August 2026
South Korea welcomes Trump polysilicon rules as boost to non-China suppliers
US President Donald Trump's new import rules on polysilicon, ingots, wafers, and solar products could ripple through global clean energy and semiconductor markets, affecting pricing,...
Friday 7 August 2026
AP Memory secures PSMC, ASE capacity ahead of 2027 IPD ramp

Memory IC designer AP Memory posted higher revenue and profit in the second quarter and expects to enter a new growth cycle beginning...

Friday 7 August 2026
Samsung sounds out Novatek for Galaxy S28 Ultra DDI

Samsung Electronics is considering opening its flagship Galaxy S display driver IC (DDI) supply chain to an outside supplier, a move...

Friday 7 August 2026
SK Hynix's Solidigm weighs up to US$7 billion in pre-IPO funding

Solidigm, SK Hynix's US NAND and enterprise storage unit, is weighing a pre-IPO funding round of KRW5 trillion to KRW10 trillion, roughly US$3.5 billion to US$7 billion,...

Friday 7 August 2026
Exclusive: STATS ChipPAC readies broad packaging price hikes on AI-driven OSAT squeeze

AI chip demand is sustaining a global rise in semiconductor packaging and testing prices, with STATS ChipPAC preparing a broad round...

Friday 7 August 2026
Interview: Nvidia exec on progress of CPO production and pluggable optics
Nvidia Senior Vice President of Networking Gilad Shainer said the company is building the key network architecture and optical interconnect technologies needed for AI factory deployments...
Friday 7 August 2026
LG plans three-tier AI chips for appliances, home robots

LG Electronics plans to develop premium, midrange and entry-level on-device AI chips for products ranging from refrigerators and washing...

Friday 7 August 2026
Analysis: SpaceX's Nvidia exclusivity isn't a knock on AMD — it's a land grab in orbit

SpaceX's earnings call — the first since its IPO disclosure — beat expectations on Aug 4, but the line that moved markets...

Friday 7 August 2026
Inside Terafab: Musk's US$16.8B bet to turn AI chip shortages into a homegrown supply chain

Elon Musk's ambitions across AI, robotics and space infrastructure are moving into a new phase following the unveiling of Terafab,...

Friday 7 August 2026
Panel makers turn old fabs into AI-advanced packaging hubs

AI-driven demand for advanced packaging is giving old-generation panel fabs and equipment new value. As Taiwan's panel makers accelerate...

Friday 7 August 2026
Winbond's record 2Q points to tighter memory markets and more pricing power ahead

Winbond Electronics Corp. reported record second-quarter revenue, profit, gross margin, and operating margin as DRAM prices jumped...

Friday 7 August 2026
Nokia's NXP Arizona fab buy signals AI optical bottleneck shifting upstream

Nokia is moving deeper into semiconductor manufacturing by acquiring NXP's Chandler fabrication campus in Arizona, signaling that the...