News tagged Chips + components at DIGITIMES

NEWS TAGGED CHIPS + COMPONENTS

Tuesday 21 July 2026

Samsung could overtake SK Hynix in the HBM market by 2027

Samsung Electronics could overtake SK Hynix to lead the global high-bandwidth memory market in 2027 as shipments of HBM4 expand, according to forecasts from UBS cited by Money...

Tuesday 21 July 2026

AI boom may reshape SK Siltron sale as chairman reportedly rethinks

SK Group chairman Chey Tae-Won is reportedly making a final decision on the sale of semiconductor silicon wafer subsidiary SK Siltron, as surging AI chip demand raises doubts about...

Tuesday 21 July 2026

VSMC warns AI-ready MES is becoming essential for wafer fabs, with China accelerating adoption

TSMC's sustained capital spending highlights the two foundations of its competitive strength: technology leadership and manufacturing excellence...

Monday 20 July 2026

HBM4 battle shifts to cooling as hybrid bonding slips

Sixth-generation high-bandwidth memory (HBM4) shipments paired with Nvidia Vera Rubin will keep rising in the second half of 2026, setting up a head-to-head fight among the three major...

Monday 20 July 2026

Alibaba open-sources AI chip software, launches Zhenwu cloud supernode service

Alibaba Group's chip design unit, T-Head, has open-sourced the software stack behind its Zhenwu AI processors while extending the platform from individual accelerators into rack-scale...

Monday 20 July 2026

Samsung to cut over 800 US jobs amid market headwinds

Samsung Electronics is cutting over 800 jobs in the US from its smartphone, display, and consumer electronics business units. The division,...

Monday 20 July 2026

Memory is becoming a national security priority, SK chair warns

The global scramble for AI memory is fast becoming a matter of national economic security, with governments intervening in supply and...

Monday 20 July 2026

Commentary: China's DRAM comes of age with CXMT's IPO — but a trio of hurdles remains

CXMT's STAR Market IPO marks a coming-of-age moment for China's DRAM industry, but the listing is only the beginning. Having proved...

Monday 20 July 2026

Rapidus taps Cadence AI agents to speed 2nm chip design

Japanese foundry Rapidus is integrating Cadence's AI-agent technology into its chip design platform as it seeks to shorten development cycles and attract customers for its planned...

Monday 20 July 2026

Compeq acquires Guanyin site for NT$2.09 billion to expand optical and space data center PCB capacity

HDI PCB maker Compeq Manufacturing has approved the acquisition of a new manufacturing site in Taoyuan's Guanyin Industrial Park for approximately NT$2.09 billion (US$64.5 million),...

Monday 20 July 2026

Samsung preps multi-billion-dollar P5 orders as AI boom speeds up memory demand

Samsung Electronics' latest multi-billion-dollar equipment procurement reflects the company's accelerating investment in AI memory...

Monday 20 July 2026

Intel reassigns global fabs, eyes early 14A and EMIB-T AI wins

Intel has accelerated its global footprint reset for 2026 after receiving investments from the US government, SoftBank, and Nvidia...

Monday 20 July 2026

Weekly news roundup: AI chip race widens across silicon photonics, HBM, memory fabs, and frontier models

AI competition is widening from chips to connectivity, memory, talent, patents, and model access,...

Monday 20 July 2026

AI boom pushes PCB, passive component lead times into a new normal

The global wave of AI data center construction continues to accelerate, driving structural growth across the PCB and passive component...

Monday 20 July 2026

Interview: AI race is now a financing race, and Compute Labs wants to bankroll GPUs

As AI's bottleneck shifts from chips to capital, Compute Labs pitches GPUs as financeable assets.

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Jul 30, 08:00

EDOM Accelerates Edge AI Deployment with NVIDIA Technologies

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