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Thursday 4 September 2025
Tech Forum 2025: ASICs, packaging, and HBM reshape the AI chip race
The global market for high-end cloud AI accelerators is approaching a major turning point. DIGITIMES forecasts that beginning in 2026, the supply chain will enter a new "decentralized"...
Wednesday 3 September 2025
Tech Forum 2025: 2nm race begins, advanced packaging takes the baton, Trump 2.0 reshapes chip rivalry
DIGITIMES Research analyst Eric Chen notes that process scaling has been the core driver of Moore's Law in semiconductors. However, with short-channel effects emerging, the three...
Wednesday 3 September 2025
Etron chair optimistic about US Section 232 investigation results
Nicky Lu, chairman of Etron Technology, stated that the global semiconductor industry is expected to grow from US$300 billion in 2010 to US$2 trillion by 2040. Meanwhile, system applications...
Wednesday 3 September 2025
Ant Group buys stake in InnoStar to back China's chip self-sufficiency
Ant Group has taken a minority stake in InnoStar Semiconductor (Shanghai) Co., a rising Chinese memory chipmaker, highlighting Beijing's drive for semiconductor self-sufficiency as...
Wednesday 3 September 2025
GCCS poised for growth in China+1 SiC substrate market
Taiwan's GCCS has become a preferred third-party supplier for global semiconductor and EV giants amid China's SiC substrate price wars. Chairman Chung-Chieh Chang expects long-term...
Wednesday 3 September 2025
MicroLED technology opens new opportunities for equipment makers
MicroLED is regarded as the next-generation display technology, with Taiwan leading global development due to strong semiconductor and display integration, plus government support...
Wednesday 3 September 2025
EV Group promotes Yu-Ying Lee to lead Taiwan operations amid expanding semiconductor market
EV Group (EVG), a leading player in semiconductor process solutions, announced on September 2, 2025, the promotion of Yu-Ying Lee (Cindy Lee) to general manager of its Taiwan branch,...
Wednesday 3 September 2025
TSMC surpasses Intel in US silicon photonics patents as chip industry ramps up initiatives
TSMC has surpassed Intel in the number of US patent applications for silicon photonics (SiPh), a crucial optoelectronic integration technology essential for artificial intelligence...
Wednesday 3 September 2025
Why TSMC is holding back on advanced packaging despite soaring demand
TSMC's CoWoS capacity remains in high demand, securing its dominant position in advanced semiconductor packaging with rumored gross margins nearing 80%. However, TSMC is proceeding...
Wednesday 3 September 2025
Tokyo Electron expands India footprint as Japan ups chip investment
Tokyo Electron has announced plans to open new offices in India to support the country's growing chip industry. According to ANI and the Economic Times, senior executives...
Wednesday 3 September 2025
China's OSAT leaders Tongfu, JCET advance co-packaged optics for AI data centers
Surging demand for AI, large language models (LLMS), and high-performance computing is propelling co-packaged optics (CPO) into the spotlight of the semiconductor industry. The technology...
Wednesday 3 September 2025
The four structural hurdles hampering China's AI GPU sector
Nvidia CEO Jensen Huang's lobbying efforts for the H20 GPU and the company's upcoming Blackwell-based custom chips have drawn wide attention. But in China's GPU market, Nvidia and...
Wednesday 3 September 2025
South Korean semiconductor firms look to India, led by Samsung's expanding R&D presence
South Korea's semiconductor push into India is being spearheaded by major players such as Samsung Electronics, while smaller firms have shown limited investment despite growing int...
Wednesday 3 September 2025
Tata Electronics partners with Merck and C-DAC to strengthen India's semiconductor ecosystem
Tata Electronics has forged strategic partnerships with Merck and India's Centre for Development of Advanced Computing (C-DAC). The collaborations will enhance semiconductor materials,...
Wednesday 3 September 2025
Taiwan targets new growth in AI chip packaging with silicon carbide substrates
As AI chips advance, managing their high thermal output has become a key performance bottleneck. Semiconductor suppliers recently indicated that the advanced packaging sector is considering...