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Monday 21 September 2026
TSMC builds Kaohsiung hub to speed advanced packaging tests
TSMC is building an advanced packaging validation hub in southern Taiwan as rapid chip-on-wafer-on-substrate (CoWoS) expansion puts pressure on equipment and materials suppliers to...
Monday 21 September 2026
Chinese image sensor maker GalaxyCore raises the stakes in high-end CIS
GalaxyCore Inc. plans to raise up to CNY4.2 billion (US$627 million) to expand 12-inch CMOS image sensor (CIS) capacity and develop 100MP and 200MP sensors, doubling down on higher-value...
Monday 21 September 2026
SK Hynix pushes deeper into logic for next-generation 3D DRAM

SK Hynix is pushing deeper into logic design as it develops a next-generation 3D DRAM architecture that could separate memory-cell processing...

Monday 21 September 2026
Samsung reportedly plans to double HBM4 output in 2027 as memory supply stays tight

Samsung Electronics is reportedly preparing to at least double production of its HBM4-family memory in 2027, accelerating a shift toward...

Monday 21 September 2026
ByteDance's China AI chip push hits substrate shortage

China's fast-rising AI models are running into a compute supply bottleneck as demand for advanced packaging substrates surges, with...

Monday 21 September 2026
Intel reportedly in talks with AUO on advanced packaging
Intel is reportedly in talks with AUO on Micro LED substrate-based advanced packaging for co-packaged optics (CPO) and high-density computing, as display makers look to turn large-area...
Monday 21 September 2026
Largan makes seventh land, factory purchase of 2026 in co-packaged optics push

Major Taiwanese optical lens maker Largan Precision announced on September 17 that it acquired around 7,468.43 square meters of land...

Monday 21 September 2026
DB HiTek gains pricing power as 8-inch supply tightens

South Korea's DB HiTek is gaining pricing power as tightening 8-inch foundry supply, high utilization, and stronger demand for power-management...

Monday 21 September 2026
CXMT closes in on DRAM leaders with G5 process breakthrough

China's CXMT has begun mass production of its fifth-generation DRAM platform, or G5, claiming process capabilities comparable with the...

Monday 21 September 2026
IBM unit secures US$1 billion CHIPS Act award to expand quantum wafer manufacturing
Anderon LLC, an IBM company, has finalized a US$1 billion award under the US CHIPS and Science Act to expand quantum wafer manufacturing in Albany, New York. The move could help speed...
Monday 21 September 2026
Weekly news roundup: AI boom strains chips; Google's TPUs pay off, China eyes 3nm without EUV
This week's reports centered on intensifying competition and bottlenecks across the semiconductor and AI supply chains, from Sandisk's unusual engineering push in Korea and Google's...
Monday 21 September 2026
DIGITIMES Insight: AI chip upgrades shift substrate supply bottleneck from upstream materials to equipment
DIGITIMES Intelligence has observed that as the performance of AI accelerators and server CPUs continues to advance, chips are increasing not only in compute core counts and...
Monday 21 September 2026
Ampoc AI PCB orders surge as it expands into CPO

Printed circuit board (PCB) wet-process equipment maker Ampoc Far-East said demand for its in-house high-end equipment has surged on...

Monday 21 September 2026
ACM Research's Shanghai unit leans on overseas installs, panel-level plating for its next leg of growth

ACM Research Shanghai is staking its growth case on two developments: planned tool installations at customers outside mainland China...

Monday 21 September 2026
India roundup: Semicon India 2026 puts commercial production and supplier investment in focus
India's semiconductor push is moving from policy to production, with new government funding, supplier investments, rising deal activity and expanding equipment, materials, testing...