With Broadcom securing more application-specific integrated circuit (ASIC) orders, speculation has arisen about Broadcom attempting to overthrow Nvidia. In reality, the two companies...
China's ambition to become the world's top manufacturing power by 2049 is far from a pipe dream, according to Jie Yang, President of Samsung China. Speaking at a South Korean parliamentary...
Topco Scientific (TSC) is actively expanding its global footprint. Chairman Jeffery Pan stated that following the layout of global semiconductor clusters, besides establishing locations...
Intel and Nvidia have struck a landmark deal, with Nvidia investing US$5 billion for about 4% of Intel. The two will co-develop SoCs integrating Intel's x86 CPUs and Nvidia's RTX...
Nvidia has launched its latest Rubin CPX GPU aimed at applications in the era of large-scale inference for AI. According to research firm SemiAnalysis, the launch represents a new...
Chun-Hsien Yeh, the new minister of Taiwan's National Development Council (NDC), pointed out on September 17 that with strong demand for artificial intelligence (AI), TSMC will be...
Samsung Electronics has secured another US$250 million subsidy from the Texas state government, bringing its total state aid to US$520 million. The latest funding comes as Samsung's...
After months of back-and-forth in the takeover battle for Japanese negative temperature coefficient (NTC) thermistor manufacturer Shibaura Electronics, Taiwanese passive component...
Samsung Electronics is accelerating its research into silicon carbide (SiC), a next-generation power semiconductor material, as competition heats up across the industry.
The Yongin Semiconductor Cluster in South Korea, which is anchored by Samsung Electronics and SK Hynix, is currently under development. However, experts caution that there are unresolved...
As SK Hynix kicks off its second-half 2025 recruitment drive with a generous bonus package, the move has generated significant buzz among Samsung Electronics employees, especially...
As Nvidia raises the performance threshold for fourth-generation high-bandwidth memory (HBM4), reports suggest that Micron Technology may be struggling to meet these standards. Industry...
MEMS design company SiTime Corporation has introduced its new timing chip, Titan, aimed at the growing wearable device market. The new chip measures just 0.46mm by 0.46mm, significantly...
STMicroelectronics (STM) has announced a US$60 million investment to establish a panel-level packaging (PLP) technology pilot production line at its Tours facility in France, with...
