News tagged Chips + components at DIGITIMES

NEWS TAGGED CHIPS + COMPONENTS

Thursday 12 February 2026

Applied Materials settles with BIS for US$252.5 million over SMIC shipments

Applied Materials, a Santa Clara-based semiconductor equipment maker, has reached a US$252.5 million settlement with the US Department of Commerce's Bureau of Industry and Security...

Thursday 12 February 2026

Winsemi revenue falls 5% in 2025, speeds pivot to AI optical and LEO satellite markets

Win Semiconductors (Winsemi), a GaAs wafer foundry, held its earnings conference on February 11. Its fourth-quarter 2025 consolidated revenue...

Thursday 12 February 2026

TSMC's advanced process drives AI profits; SMIC, UMC, VIS face growth pressure

Amazon, Google, Meta, and Microsoft are set to sharply increase AI capital expenditure in 2026, with total investments reaching US$670 billion. This surge has sparked market concerns...

Thursday 12 February 2026

SMIC warns AI pull-forward is rewriting chip cycle, lifts mature-node pricing

The global foundry industry is undergoing a structural shift, and it is emerging first in mature process nodes once widely considered oversupplied. SMIC stated on February 11 that...

Thursday 12 February 2026

Taiwan PCB industry unites at Apex Expo for US advanced packaging push

Amid mounting tariff pressures and geopolitical risks, the Taiwan Printed Circuit Association (TPCA) announced that it will showcase a Taiwan advanced packaging zone at Apex Expo 2026,...

Thursday 12 February 2026

Global Mixed-Mode's DDR5 PMIC push signals tighter memory supply and margin focus

Global Mixed-Mode Technology said it is expanding its DDR5 power management IC (PMIC) portfolio and prioritizing production for high-bandwidth memory (HBM), while warning that rising...

Thursday 12 February 2026

China claims five places in 2025 global OSAT top 10

The latest global ranking of the top 10 outsourced semiconductor assembly and test (OSAT) providers points to a shift in competitive balance. In 2025, five Chinese companies entered...

Thursday 12 February 2026

Micron begins high-volume HBM4 shipments as supply stays tight and capex rises

Micron Technology has begun high-volume production and customer shipments of its next-generation HBM4 memory, ramping volumes earlier than expected amid tight industry supply, CFO...

Thursday 12 February 2026

SEMI: AI and HBM lift 2025 silicon wafer shipments, revenue still dips

Worldwide silicon wafer shipments increased 5.8% in 2025 to 12,973 million square inches (MSI), while wafer revenue declined 1.2% to US$11.4 billion, according to the year-end analysis...

Thursday 12 February 2026

The Netherlands draws a harder line on Nexperia’s Chinese parent

The Enterprise Chamber of the Amsterdam Court of Appeal in the Netherlands has ordered a formal investigation into Dutch chipmaker Nexperia BV, deepening a legal dispute that has curtailed...

Thursday 12 February 2026

Samsung weighs Europe chip expansion after Intel retreat opens German window

Samsung is reportedly evaluating a potential European semiconductor expansion alongside its South Korea and US manufacturing base, as the...

Thursday 12 February 2026

TSMC spillover lifts Xintec testing orders, 2026 growth in sight

Xintec, the packaging and testing subsidiary of TSMC, held an investor conference in which Chairman CH Chen said full-year 2025 revenue maintained modest growth, driven primarily by...

Thursday 12 February 2026

Chinese MCU price hikes open door for Holtek's quality play

Holtek Corp. said recent price increases announced by Chinese microcontroller (MCU) maker Cmsemicon are a positive development for the sector, arguing that rising prices among Chinese...

Wednesday 11 February 2026

Nvidia finalizes deal for first overseas HQ in Taipei; groundbreaking set for June 2026

Nvidia has officially finalized a deal to establish its first overseas headquarters in Taipei, marking a major milestone in Taiwan's evolution into...

Wednesday 11 February 2026

Rapidus aims for 2nm ramp in FY2027 with fourfold capacity boost

Rapidus is expected to begin full-scale production in fiscal 2028. Mass production of 2nm-class chips is scheduled to commence in the second half of fiscal 2027, according to Kyoto...

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Feb 9, 08:00

iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory

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RESEARCH INSIGHTS

Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook