News tagged Chips + components at DIGITIMES

NEWS TAGGED CHIPS + COMPONENTS

Thursday 15 January 2026

China's WUS to build US$300m optical-electrical PCB hub for AI systems

WUS Printed Circuit (Kunshan) Co. plans to invest up to US$300 million in a high-density optical-electrical printed circuit board (PCB) project aimed at supporting next-generation...

Thursday 15 January 2026

GlobalWafers' Topsil advances ultra-pure float zone silicon for quantum tech

GlobalWafers stated it is continuing to expand the application landscape of its advanced materials technologies, with its Danish subsidiary Topsil GlobalWafers ramping up investment...

Thursday 15 January 2026

GlobalFoundries moves into processor IP with ARC acquisition from Synopsys

GlobalFoundries said on January 13 that it has agreed to acquire the ARC Processor IP Solutions business from Synopsys, a move that modestly...

Wednesday 14 January 2026

Advanced packaging crunch lifts ASE, KYEC to new highs

TSMC will hold its earnings call on January 15, 2026. Supply chain sources expect AI chip demand to remain strong in 2026, while TSMC's advanced packaging and testing capacity continues...

Wednesday 14 January 2026

China lifts semiconductor equipment localization to 35%

China's push to localize its semiconductor equipment supply chain has reached an unexpected milestone. Domestic tools accounted for 35% of chipmaking equipment used in 2025, up from...

Wednesday 14 January 2026

SK Hynix to invest in new advanced packaging plant amid AI memory demand

SK Hynix has announced plans to invest KRW19 trillion (US$13.02 billion) to construct a new advanced packaging facility, P&T7, in Cheongju, North Chungcheong Province, South Korea...

Wednesday 14 January 2026

Gold Circuit Electronics sees record revenue on ASIC server orders, plans Taiwan expansion

PCB manufacturer Gold Circuit Electronics (GCE) posted a record-high full-year consolidated revenue in 2025, surging more than 50% year-over-year, driven by a ramp-up in ASIC server...

Wednesday 14 January 2026

Samsung will adopt South Korea-made mask blanks to EUV process to reduce reliance on Japan

Samsung Electronics is set to introduce South Korea-made mask blanks into its extreme ultraviolet (EUV) process starting as early as the second quarter of 2026. According to ET...

Wednesday 14 January 2026

SK Hynix reportedly trims consumer memory, shifts focus to servers

Surging demand for AI hardware is prompting memory makers to reassess their product portfolios as resources shift toward higher-margin...

Wednesday 14 January 2026

Iluvatar CoreX sets three-generation GPU plan, eyes H200 performance

As China's domestic GPU developers accelerate public listings and expand both technological and capital investment, competition is shifting toward next-generation computing power....

Wednesday 14 January 2026

TSMC turns Arizona gamble into goldmine as suppliers ride 10-year wave

After five years of struggling with double construction timelines and billion-dollar regulatory hurdles, TSMC has quietly transformed its Arizona operations into a profit engine, and...

Wednesday 14 January 2026

Cerebras Systems seeks US$1 billion funding round with US$22 billion valuation

AI chip startup Cerebras Systems is reportedly in talks to raise US$1 billion in a new financing round, aiming for a valuation of up to US$22 billion, according to Bloomberg...

Wednesday 14 January 2026

CPO module output to grow by 137% annually as Taiwan fosters key photonic tech

Market research firm Yole Group has forecasted a 43% compound annual growth rate (CAGR) for the photonic integrated circuit (PIC) sector, with co-packaged optics (CPO) module output...

Wednesday 14 January 2026

HTSI gets boost from probe cards and engineering services

Hermes Testing Solutions Inc. (HTSI), a provider of semiconductor wafer testing solutions, said demand for flexible and highly customized...

Wednesday 14 January 2026

CXMT launches US$4bn bid to break DRAM market control

Surging artificial intelligence (AI) workloads have triggered a global shortage of HBM, tightening DRAM and NAND supply and pushing prices sharply higher. US PC maker HP is now evaluating...

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Feb 9, 08:00

iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory

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RESEARCH INSIGHTS

Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook