Intel is gaining momentum in both chip design and foundry operations. Its PC platform roadmap for the next two years is coming into sharper focus as process technology and yield improve,...
MediaTek raised its outlook for its application-specific integrated circuit (ASIC) business during its first-quarter 2026 earnings call, signaling stronger growth prospects and sending...
Univacco said its Vietnam plant will begin mass production in the second quarter of 2027 as the company moves to position itself in the co-packaged optics and advanced packaging materials...
Rising memory prices have squeezed handset demand and are expected to widen the gap between smartphone and notebook shipment declines in 2026, according to industry reports. Global...
Onsemi told investors during its first-quarter 2026 earnings call, held on May 4, that China remains a key growth market for its automotive power products, even as China's passenger...
During an earnings call on May 4, Onsemi portrayed its artificial intelligence data center business and new Treo platform as central to a recovery that began in the first quarter,...
Lattice Semiconductor has signed a definitive agreement to acquire AMI, a leading provider of platform firmware and infrastructure manageability software, for US$1.65 billion. The...
Onsemi reported a mixed but generally improving set of first-quarter 2026 results, signaling early signs of recovery in key end markets while highlighting ongoing volatility in pro...
Intel's share price has hit historic highs as the semiconductor industry draws significant investor attention. But is this hype justified? DIGITIMES analyst Luke Lin took a deep dive...
Samsung Electronics is reportedly restarting its silicon carbide (SiC) wafer foundry business, aiming to tap into the fast-growing next-generation power semiconductor market, reinforce...
The AI chip race is increasingly running into a different kind of limit — not compute, but packaging, as supply constraints around advanced technologies such as CoWoS begin to...
Kioxia and SanDisk are set to present a new 3D flash memory architecture aimed at extending NAND scaling beyond 1,000 stacked layers, as memory makers seek ways to overcome the physical...
ADTechnology said it has signed a KRW40 billion (US$27.1 million) turnkey contract with a US-based AI fabless company to develop and supply HPC SoC chiplets for AI data-center applications...
Huawei is set to capture the largest share of China's AI chip market this year, with revenue expected to rise at least 60% as Chinese technology companies accelerate orders for domestic...
