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Monday 2 March 2026
Insight: Broadcom delivers 2nm 3.5D AI processor, expanding custom chip push against Nvidia

Broadcom has begun shipping the industry's first 2nm custom compute SoC built on its 3.5D eXtreme Dimension System in Package (XDSiP) platform...

Monday 2 March 2026
Rare Huawei-ByteDance alliance unveils RRAM AI chip delivering 66x CPU speed at ISSCC 2026
Huawei and ByteDance have jointly unveiled a next-generation AI acceleration chip based on resistive random-access memory (RRAM), developed with Tsinghua University and other Beijing...
Monday 2 March 2026
Samsung Electronics and SK Hynix reportedly plan large DRAM price increases, deepening supplier advantage for big buyers
Samsung Electronics and SK Hynix have notified customers of plans to raise DRAM prices in the second quarter of 2026 and have begun price negotiations, South Korean outlet SEDaily...
Monday 2 March 2026
Rohm integrates TSMC GaN process to scale production and meet AI server demand by 2027
Rohm has reached an agreement to integrate its internal development and manufacturing capabilities for gallium nitride (GaN) power devices with process technology from Taiwan Semiconductor...
Monday 2 March 2026
Meta reportedly scraps advanced in-house AI chip, deepens reliance on Nvidia and AMD

Meta's push to design its own AI chips has reportedly hit major technical and strategic setbacks, forcing the company to scrap its most...

Monday 2 March 2026
Arizona in the black: a milestone for TSMC—and Washington

Taiwan Semiconductor Manufacturing Co. (TSMC) has reached a critical financial turning point in its high-stakes expansion into the American desert,...

Monday 2 March 2026
Commentary: Nvidia sparks silicon photonics race, yet copper still anchors data centers?
As data center computing demand expands, high-speed transmission architectures are under pressure to upgrade. Scaling high-performance computing platforms is exposing bandwidth and...
Monday 2 March 2026
Weekly news roundup: semiconductor power shifts and AI momentum
Below are the most-read DIGITIMES Asia stories from the week of Feb 3 - Mar 1, 2026.
Monday 2 March 2026
Nvidia and major telecom carriers pledge AI-native, open platforms to guide 6G infrastructure
At Mobile World Congress (MWC), Nvidia said it and leading operators and infrastructure providers, including Booz Allen, BT Group, Cisco, Deutsche Telekom, Ericsson, MITRE, Nokia,...
Monday 2 March 2026
India roundup: An emerging chip trio in Asia

A trilateral semiconductor model is emerging, combining Japan's capital, Taiwan's ecosystem expertise,...

Monday 2 March 2026
Insight: Memory shortage tightens grip on smartphone market as prices near tipping point
The memory market is no longer just a component story — it is becoming a fault line running through the entire tech industry. As AI infrastructure buildout accelerates, cloud...
Monday 2 March 2026
Nvidia's Vera Rubin platform faces HBM4, cooling, and software hurdles ahead of ramp
Nvidia's next-generation Vera Rubin platform has moved from public unveiling to early customer sampling, with the company projecting a broader production ramp later this year. Both...
Monday 2 March 2026
TSMC bolsters local equipment supply chain with subsidies and five-year rebate program
TSMC is accelerating supplier upgrades and has made growing the share of Taiwan-sourced equipment components a long-term strategic objective. As of February 2026, it had worked with...
Sunday 1 March 2026
Exclusive: Phison shifts to prepayments as NAND prices hike 500%

NAND prices continue to climb, and supply remains tight. NAND controller supplier Phison Electronics has notified customers that it will...

Sunday 1 March 2026
Taiwan's Fitipower eyes stronger year as AI and edge chips gain traction
Fitipower, a Taiwanese driver IC and semiconductor supplier, offered a cautiously optimistic outlook for 2026 during its February 25 investor briefing. Chairman Young Lin said the...