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Monday 5 October 2026
DIGITIMES Insight: AI data demand surges as power and cooling become new bottlenecks
As the number of AI computing transistors integrated within a single CoWoS package rises rapidly, DIGITIMES observes that moving massive volumes of data to compute chips fast...
Monday 5 October 2026
AI system integration eclipses chip specs
As AI develops rapidly across both cloud and edge environments, major chipmakers are devoting less attention to chip specifications and more to system-level design and ecosystems....
Monday 5 October 2026
Nanya Tech expands 3D OSAT to chase HBM-like demand
Nanya Technology is stepping up investment in new factory capacity to expand packaging and testing as some customers move into trial production for specification-based designs. The...
Monday 5 October 2026
Podcast highlights: TSMC Texas plant talk is premature, Intel 18A hits backfiring criticism
This excerpt from DIGITIMES analyst Luke Lin's podcast looks at TSMC's rumored Texas expansion, Intel's 14A and 18A process debate, and Qualcomm's high bandwidth compute (HBC) push...
Monday 5 October 2026
India roundup: India deepens its role in global technology supply chains

India is expanding its role across semiconductors, electronics and digital services, as new investment rules, supply-chain localization and Apple...

Saturday 3 October 2026
Musk confirms talks with TSMC over his Texas chip factory project
Elon Musk has confirmed that Terafab, the chipmaking venture backed by his SpaceX and Tesla, is in discussions with TSMC. The confirmation followed a report that the Taiwanese foundry...
Saturday 3 October 2026
Elon Musk, Jensen Huang see China closing lithography gap by 2030
While ASML executives explore how to scale extreme ultraviolet (EUV) lithography output beyond 110 units by 2028, China is pursuing indigenous advanced lithography systems. ASML plans...
Saturday 3 October 2026
Biren readies BR20X, sharpening China's AI GPU challenge to Nvidia
Biren Technology is preparing its next-generation GPU for mass production, advancing a domestic AI accelerator roadmap built around broader low-precision support and locally available...
Friday 2 October 2026
Samsung's Galaxy Tab S12 taps MediaTek Dimensity 9500 as 2nm successor arrives
MediaTek announced on September 30 that its flagship Dimensity 9500 chip powers Samsung's new Galaxy Tab S12 Ultra and Galaxy Tab S12+ tablets. The deal continues a long-running partnership...
Friday 2 October 2026
Bull's France factory doubles capacity to capture growing orders as EU pushes AI sovereignty
Supercomputer maker Bull will double its production capacity using an expanded factory that reopened on October 1. The French creator of Europe's fastest supercomputers described unprecedented...
Friday 2 October 2026
ficonTEC, Hermes Testing target CPO testing scale-up with INS-2 platform
ficonTEC, a maker of optoelectronic automation assembly and test equipment, has announced a strategic partnership with Hermes Testing Solutions Inc. (HTSI) to support Taiwan's rapidly...
Friday 2 October 2026
Taiwan pledges to help TSMC expand domestic investment amid Singapore rumors
Rumors that TSMC is weighing a new semiconductor investment in Singapore have reignited concerns over its overseas expansion, while the Ministry of Economic Affairs (MOEA) said on...
Friday 2 October 2026
Inside Volantis's photonic bid to break AI's memory wall after US$88 million raise
Semiconductor startup Volantis has raised US$88 million in Series A funding to develop an AI inference architecture that uses photonic interconnect technology to address memory bottlenecks...
Friday 2 October 2026
Amazon weighs US$8B chip sale-leaseback to support credit rating
Amazon is considering moving about US$8 billion worth of high-end Nvidia chips off its balance sheet through a sale-leaseback structure, according to the Financial Times and...
Friday 2 October 2026
Nvidia weighs PTFE and HC for glass-free PCBs in Rubin Ultra
Nvidia is testing glass-free PCB material systems for its next-generation AI server platforms, evaluating polytetrafluoroethylene (PTFE) and hydrocarbon (HC) resin formulations for...