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    Wus Printed Circuit sees turnaround on high-end PCB demand
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    Exclusive: Wiwynn triples capital, president says it signals confidence
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    NEWS TAGGED CHIPS + COMPONENTS
    Tuesday 26 May 2026
    Huawei eyes AI storage breakthrough with DoB packaging, 245TB SSD roadmap
    Huawei has released its Data Storage 2030 white paper, setting out a technology roadmap for the global storage industry over the next five to...
    Tuesday 26 May 2026
    ASML expands Taiwan hiring and operations to meet advanced chip demand
    Grace Wang, vice president and general manager of ASML in Taiwan, said that ASML plans to deploy extreme ultraviolet (EUV) and next-generation high numerical aperture (high-NA) EUV...
    Tuesday 26 May 2026
    Analysis: Huawei's Tau Law signals a new semiconductor framework — with implications beyond China
    As the global semiconductor industry approaches the physical limits of transistor scaling, Huawei has proposed a new framework for the post-Moore era through its recently introduced...
    Tuesday 26 May 2026
    GlobalWafers to increase prices, targets 4Q26 shipments for square wafers, Asia capacity fully booked
    GlobalWafers held its shareholders' meeting on May 25, where CEO Doris Hsu stated that the semiconductor market in 2026 has gradually moved beyond 2025's two extremes, when only AI...
    Tuesday 26 May 2026
    SK Hynix moves cooling directly to D2D PHY to tackle rising HBM heat challenges
    Heat management has become a critical challenge as HBM technology advances, with higher stacking and faster speeds to meet surging global demand for AI data processing. Efficient control...
    Tuesday 26 May 2026
    China pushes homegrown AI stack with local chips, LLMs

    Following the conclusion of the Trump-Xi meeting and amid continued delays in China approving imports of Nvidia H20 GPUs, China's National...

    Tuesday 26 May 2026
    Intel CEO Lip-Bu Tan Taiwan-bound for closed-door meetings ahead of Computex
    Intel CEO Lip-Bu Tan is set to arrive in Taiwan this weekend, joining AMD CEO Lisa Su and Nvidia CEO Jensen Huang in a high-stakes push by the world's top chip leaders to deepen ties...
    Tuesday 26 May 2026
    Taiwan MLCC makers plug into AI server demand
    AI servers are driving a surge in demand for high-end passive components, rapidly eating into multilayer ceramic capacitor (MLCC) capacity and extending lead times to more than 16–20...
    Tuesday 26 May 2026
    Wingtech sues Nexperia for US$1.2B as it fights delisting risk
    Wingtech Technology, the Chinese tech company that owns Dutch semiconductor manufacturer Nexperia, has filed a civil lawsuit against Nexperia and five defendants for alleged damages...
    Tuesday 26 May 2026
    Holy Stone Enterprise says AI power surge will deepen global MLCC shortages
    Holy Stone Enterprise warns that AI-driven power upgrades are creating global shortages and record demand for multilayer ceramic capacitors (MLCCs), with lead times beyond 20 weeks...
    Tuesday 26 May 2026
    Micron expands US DDR4 output as AI keeps global supply tight
    As Micron Technology's decision to restart large-scale DDR4 production in the US grabs global attention, memory-chip executives and analysts say the move is less a revival of aging...
    Tuesday 26 May 2026
    Lightmatter joins TSMC on COUPE for 3D optical engines
    AI computing's massive demand for infrastructure is making interconnect and laser technologies key to overcoming power and bandwidth limits, prompting silicon photonics unicorn Lightmatter...
    Tuesday 26 May 2026
    ADATA outlines cloud-to-edge AI ecosystem and cost-cutting AI Scaler at COMPUTEX 2026
    ADATA Technology said it will present a cloud-to-edge artificial intelligence ecosystem at COMPUTEX 2026, bringing together its enterprise storage brand TRUSTA, ADATA Industrial, gaming...
    Tuesday 26 May 2026
    Powerchip unveils 3D AI Foundry with 3D WoW DRAM stacking at COMPUTEX 2026
    Powerchip announced it will present a "3D AI Foundry" showcase at COMPUTEX 2026 to demonstrate 3D wafer-on-wafer (WoW) DRAM stacking, interposers, and Si-cap integrated passive devices...
    Tuesday 26 May 2026
    Samsung's silicon photonics push adds new layer to Korea-Dutch chip ties

    South Korea and the Netherlands are looking to broaden their semiconductor partnership beyond ASML's EUV lithography machines, as silicon...

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    BIZ FOCUS
    Jun 1, 08:00
    LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
    Friday 29 May 2026
    Datotek Introduces AI PSSD Sustainable Storage Solutions at COMPUTEX 2026
    Thursday 28 May 2026
    AGI Debuts DDR5 R-DIMM and Smart Industrial Solutions at COMPUTEX 2026
    Thursday 28 May 2026
    Retronix Launches Sparrow Hawk Edge AI Computing Platform Worldwide
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    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook