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Thursday 11 June 2026
US lawmakers push ITC to enforce patent case involving TSMC

Congressional Republicans are urging stronger exclusion orders in the ongoing Section 337 investigation tied to TSMC's advanced-node...

Thursday 11 June 2026
CPO delays may shift AI networking demand, not derail it

Concerns have emerged in recent weeks that the commercialization of co-packaged optics (CPO), a technology widely viewed as the future...

Thursday 11 June 2026
Montage Tech samples 9200 MT/s DDR5 RCD06 chip for AI server memory upgrade
Montage Technology has begun sampling its sixth-generation DDR5 registering clock driver chip (RCD06) to customers, marking a step forward in the performance upgrade of next-generation...
Thursday 11 June 2026
Taiwan Mask sells Zhunan plant to Siliconware Precision Industries for NT$2.8 billion
Taiwan Mask (TMC), a Taiwanese photomask manufacturing process company, has approved the sale of its Plant 6 in Zhunan, Taiwan. The company said the move is primarily a strategic measure...
Thursday 11 June 2026
MicroIP's new Kaohsiung R&D base points to broader AI push in southern Taiwan
MicroIP has opened a nearly 300-ping southern R&D center at Kaohsiung's PIER F, with plans to expand smart manufacturing and smart transportation applications. The move signals...
Thursday 11 June 2026
AI servers squeeze high-end MLCC supply, sending Taiwan firms toward China alternatives
AI servers and high-voltage electric vehicles (EVs) are tightening the global supply of high-end multilayer ceramic capacitors (MLCCs), prompting some Taiwan supply chain players to...
Thursday 11 June 2026
Questions emerge over timing of Nvidia's 800V data center push, but suppliers say plans remain unclear
Recent market speculation suggests that Nvidia's ambitious transition to a native 800-volt direct-current (800VDC) architecture for AI data centers may be delayed by up to a year,...
Thursday 11 June 2026
CanSemi IPO exposes strains in China's mature-node chip push
CanSemi Technology's planned ChiNext listing has exposed the financial strain behind China's push to build mature-node semiconductor capacity, as the Guangzhou-based foundry seeks...
Thursday 11 June 2026
Taiwan deepens ties with Central and Eastern Europe as Taiwanese firms expand into Czech Republic, Poland
The Czech Republic and other Central and Eastern European countries have gradually become emerging markets for Taiwanese investment and exports. This follows the donation of vaccines...
Thursday 11 June 2026
Applied Materials invests US$500 million in Singapore to meet AI chip demand
As artificial intelligence (AI) fuels an unprecedented surge in demand for advanced semiconductors, Applied Materials is deepening its commitment to one of Asia's most important chipmaking...
Thursday 11 June 2026
Largan's CPO play hinges on sub-0.3-micron precision, not perfect parts
Largan Precision is accelerating its push into CPO-related optical components, with chairman Adam Lin revealing that the company is building its first automated pilot line at a new...
Thursday 11 June 2026
Wistron ITS rebrands as WITS to scale chip and AI engineering in software-hardware integration pivot
Wistron ITS has officially changed its name to WITS. Chairman Ching Hsiao pointed out that the rebranding signifies the company's transition from software into the new frontier of...
Thursday 11 June 2026
Exclusive: Astera Labs sees switch chips becoming biggest revenue driver by end of 2026

Astera Labs expects its Scorpio switch-chip business to become its largest revenue contributor by the end of 2026, marking a shift for...

Thursday 11 June 2026
Gudeng flags EUV supply constraints as advanced-chip expansion accelerates
Gudeng chairman and CEO Bill Chiu said global demand for AI is driving a wave of 2nm and 3nm advanced-node capacity expansion, but the biggest constraint for chipmakers is not building...
Thursday 11 June 2026
How an alliance of Taiwanese chip suppliers cracked Intel's supply chain with a FOUP solution
TSS Semiconductor Alliance, a group of 18 small and medium-sized Taiwanese suppliers of semiconductor materials, components and equipment, is preparing to form a third cohort as members...