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    FOPLP progress fastest in foundries, slower in testing and panel fabs
    3h 3min ago
    YMTC launched third phase with hubei state capital support, no big fund stake
    3h 3min ago
    Military and semiconductor sectors boost IPC growth momentum
    3h 4min ago
    AI chip demand drives future semiconductor growth trends
    3h 4min ago
    YMTC decade-long journey highlights the evolution of China tech sovereignty
    3h 4min ago
    China's leading wafer maker aquaire three loss-making subsidiaries to strengthen 12-inch wafer integration
    3h 4min ago
    NEWS TAGGED CHIPS + COMPONENTS
    Friday 22 August 2025
    Urban mining pioneer Lianyou Metals leads in tungsten and cobalt recycling , eyes stronger 2H25
    Amid rising geopolitical risks and tightening global supply chains, the strategic value of rare metals has come into sharp focus. Taiwan's Lianyou Metals, leveraging patented smelting...
    Friday 22 August 2025
    China signals soft resistance to US-approved Nvidia H20 shipments
    On August 11, 2025, US President Donald Trump announced that Nvidia's H20 chips were approved for shipment to China. Before this, at the end of July 2025, reports indicated that Nvidia...
    Friday 22 August 2025
    Xiaomi readies next-gen XRing O2 chip as it pushes toward 2nm and beyond
    Xiaomi is accelerating its in-house semiconductor development. After unveiling its first 3nm flagship SoC, the XRing O1, in 2025, industry sources say the company is now developing...
    Thursday 21 August 2025
    High-end PCB materials shortage looms as AI demand outpaces capacity
    The artificial intelligence boom is driving sharp demand growth across the printed circuit board (PCB) materials chain, pushing both prices and volumes higher. Supply pressure is...
    Thursday 21 August 2025
    MediaTek automotive platform integrates Google ecosystem, leveraging diverse technologies
    MediaTek recently announced that it has become the first partner to provide Google's Project Treble support specifically for the automotive ecosystem. The company will offer customers...
    Thursday 21 August 2025
    Research Insights: UCIe 1.1 upgrade aims at auto industry, boosts chiplet adoption
    As automotive computing platforms increasingly demand higher performance, longer lifespans, and near-zero defect rates, chip architecture faces the challenge of balancing system reliability...
    Thursday 21 August 2025
    Taiwan's MPI grabs first-mover advantage in MEMS probe cards for AI chips

    Taiwan's MPI Corporation is set to benefit from a major shift in semiconductor testing, as global cloud providers ramp up custom AI chip...

    Thursday 21 August 2025
    Chinese AI startup Butterfly Effect moves HQ to Singapore as its AI agent Manus surges to US$90M run rate

    China's AI startup Butterfly Effect has revealed financial results for the first time, projecting an annualized revenue run rate of US$90...

    Thursday 21 August 2025
    Nvidia's impossible dilemma: trust on a string between Washington and Beijing
    Nvidia's H20 chips have unexpectedly emerged as a new flashpoint in the intensifying tech rivalry between the United States and China. Reports that Washington installs trackers on...
    Thursday 21 August 2025
    Sunplus sees uneven recovery: auto orders rebound, consumer chips under strain
    Sunplus Group warned that the consumer electronics slump and rising competition from Chinese chipmakers will cloud its outlook for the second half of 2025. The Taiwan-based IC design...
    Thursday 21 August 2025
    Pixel 10 powered by Tensor G5 on TSMC 3nm with 34% CPU gain and 60% faster AI
    Alphabet Inc. has introduced its latest Pixel 10 series smartphones featuring the newly developed Tensor G5 processor, marking the company's most significant upgrade in custom chip...
    Thursday 21 August 2025
    Samsung's Lee Jae-yong hints at 2026 chip comeback after US visit
    Samsung Electronics Executive Chairman Lee Jae-yong returned to South Korea this week after more than two weeks in the US, telling reporters at the airport he was "ready for 2026."...
    Thursday 21 August 2025
    SJ Semiconductor advances 3D packaging as key Huawei partner, climbs global OSAT rankings
    China's semiconductor packaging and testing firm SJ Semiconductor (SJ Semi) has made significant headway with the completion of its third production facility, J2C, in Jiangyin's high-tech...
    Thursday 21 August 2025
    South Korea denies US plans to acquire Samsung shares amid CHIPS Act speculation
    The South Korean presidential office has dismissed reports that the US government intends to purchase shares of Samsung Electronics Co., stating there is no factual basis for such...
    Thursday 21 August 2025
    Chinese firms enter advanced hybrid bonding race as global chipmakers accelerate
    With Moore's Law losing momentum, advanced packaging has become the industry's next significant lever to drive performance gains. At the center of this race is hybrid bonding, widely...
    20/301 pages
    SpecialReports
    BIZ FOCUS
    Aug 5, 11:49
    Cultivating OCP, embracing open source
    Wednesday 3 September 2025
    Tescan Unveils New Global Brand Platform 'The Art of Discovery' with APAC Rollout at SEMICON Taiwan
    Wednesday 3 September 2025
    Micraft System Plus Unveils Proprietary Thermo-Compression Bonder, Expands into Advanced Packaging Market
    Wednesday 3 September 2025
    SK hynix Introduces Industry's First Commercial High NA EUV
    Summary of Tech Supply Chain News!
    RESEARCH INSIGHTS
    Intel signals overhaul of IDM 2.0 and foundry strategy with Lip-Bu Tan's appointment, says DIGITIMES