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    NEWS TAGGED CHIPS + COMPONENTS
    Friday 11 September 2026
    More memory won't fix AI's bottleneck, says Microsoft's Azure hardware chief
    Microsoft's AI accelerator was never designed to compete with Nvidia. It was designed to run Microsoft's own inference workloads across its own fleet, and that scoping decision —...
    Thursday 10 September 2026
    ITRI to showcase 3.2T silicon photonics and AI data center cooling
    Taiwan's 2026 Innovation Technology Expo will run from September 17 to 19 at Taipei World Trade Center Hall 1. The Ministry of Economic Affairs Industrial Development Administration...
    Thursday 10 September 2026
    Nanoprinting lithography shifts from round to square, increasing waveguide output
    Nanoimprint technology is shifting from round to square substrates. Qingdao GermanLitho noted that this transition has become vital for volume manufacturing as the industry demands...
    Thursday 10 September 2026
    US Justice Department probes Nvidia-Groq deal over antitrust concerns
    The US Department of Justice has opened a probe into Nvidia's deal with AI chip startup Groq, according to reports from The New York Times and Reuters. Regulators are examining...
    Thursday 10 September 2026
    ASE August revenue tops NT$80 billion record as AI packaging capacity stays sold out
    ASE Technology Holding's revenue surpassed NT$80 billion (US$2.5 billion) for the first time in August 2026, as AI continued to drive demand for both advanced and conventional semiconductor...
    Thursday 10 September 2026
    Foxsemicon hits record 2Q26 revenue on Thailand ramp-up
    Foxsemicon Integrated Technology (FITI) posted record consolidated revenue of NT$6.3 billion (approx. US$200.0 million) in the second quarter of 2026, up 13.3% quarter-over-quarter...
    Thursday 10 September 2026
    AUO matching glass substrate size stokes TSMC collab speculation
    AUO is accelerating its transformation by extending its established large-format panel manufacturing capabilities into advanced semiconductor packaging.
    Thursday 10 September 2026
    Apple added flat US$100 to every iPhone and rebuilt A20 Pro around memory
    Two things happened at Apple's September 9 launch that belong in the same story: the company raised the price of every iPhone it sells by exactly US$100, and it introduced a chip whose...
    Thursday 10 September 2026
    China's Nvidia rivals raise prices as HBM shortage bites
    Chinese chipmakers challenging Nvidia are sharply raising prices for current and next-generation accelerators as high-bandwidth memory (HBM) becomes scarcer and more expensive, adding...
    Thursday 10 September 2026
    Intelligo targets double-digit 2027 revenue growth on AI IP, ASICs
    Intelligo said it is aiming for double-digit revenue growth in 2027 as AI IP licensing and AI edge-computing ASICs expand its reach into smartphones, notebooks, earbuds, gaming consoles...
    Thursday 10 September 2026
    TSMC August 2026 revenue jumps 53.3% as AI chip demand drives record growth

    TSMC reported strong revenue growth in August, underscoring continued momentum in AI-related semiconductor demand. TSMC said consolidated...

    Thursday 10 September 2026
    Taiwan chipmakers target humanoid robots beyond the 'brain,' focusing on vision, motor control

    Taiwanese IC design companies have recently begun highlighting opportunities in physical AI and robotics. Arm's recently announced expansion...

    Thursday 10 September 2026
    Spirox TGV inspection capable of scanning entire substrate in 20 minutes
    As advanced packaging moves toward higher-density stacking, demand is rising for glass through-glass via (TGV) and through-silicon via (TSV) inspection, while glass core substrates...
    Thursday 10 September 2026
    Hermes Testing ships membrane probe cards, targets SiPh and CPO
    Hermes Testing Solutions said its August revenue kept rising and topped NT$500 million for the first time, setting a new monthly record on steady growth in semiconductor test equipment...
    Thursday 10 September 2026
    AI semiconductor equipment boom redraws Taiwan IPC market: Edge AI, advanced packaging lift high-end demand
    AI and high-performance computing (HPC) demand is sustaining strong investment in advanced semiconductor processes, high-bandwidth memory (HBM), and advanced packaging, lifting the...
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    Tuesday 22 September 2026
    GUC Announces 2nm 16 Gbps HBM4E IP
    Tuesday 22 September 2026
    AT&S Unveils Strategy to Drive AI Growth
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