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Thursday 10 September 2026
Elmos locks in SK keyfoundry wafer supply through 2037 as 8-inch capacity tightens

Germany's Elmos Semiconductor has secured wafer capacity from South Korea's SK keyfoundry through 2037, expanding an 18-year manufacturing...

Thursday 10 September 2026
DB HiTek completes reliability qualification for 8-inch SiC MOSFET process
DB HiTek said it has completed reliability qualification for its 1,200 V silicon carbide (SiC) MOSFET process on 8-inch wafers. The development could expand foundry capacity for next-generation...
Thursday 10 September 2026
Compute-in-memory returns to the spotlight with edge AI's power, memory squeeze
AI is shifting from data centers to PCs, personal AI systems, robots, and other edge devices, renewing a core semiconductor challenge: delivering enough compute and memory bandwidth...
Thursday 10 September 2026
JD Cloud plans 100,000-GPU cluster built on Moore Threads chips
JD Cloud said on September 9 that it plans to build a 100,000-card cluster of full-function GPUs supplied by Moore Threads, a deployment the company describes as the first time domestic...
Thursday 10 September 2026
SK Hynix says 3D DRAM will borrow from logic foundry playbook
SK Hynix is signaling a shift in memory design that could matter far beyond South Korea. By adopting logic foundry techniques for 3D DRAM, the company is moving toward a future where...
Thursday 10 September 2026
China gets an early shot at the next SiC power-chip cycle

Alkaidsemi (Shanghai) Technologies Corporation has introduced a 1,200 V silicon carbide superjunction MOSFET that it describes as the...

Thursday 10 September 2026
Samsung Electro-Mechanics' glass-substrate rollout slows as TSMC evaluation drags on

Samsung Electro-Mechanics (Semco) is facing a slower glass-substrate rollout as a reliability evaluation of through-glass via (TGV) modules...

Thursday 10 September 2026
Samsung trims foundry partner network as remaining DSPs gain momentum
Samsung Electronics has reduced its foundry Design Solution Partner (DSP) network to 11 companies from 13, as the chipmaker shifts toward greater emphasis on partners that can secure...
Thursday 10 September 2026
CXMT's HBM3 yield reportedly stalls at 25% as TSV and stacking challenges expose China's AI memory gap

China's leading DRAM maker ChangXin Memory Technologies (CXMT) has begun trial production of HBM3, but its initial yield has reportedly...

Thursday 10 September 2026
CIOE 2026: Morphotonics draws on display background to break AR waveguide bottlenecks
At the China International Optoelectronic Expo (CIOE), Morphotonics, a Netherlands-based nanoimprint lithography company, made the case that the quickest way to reach affordable AR...
Thursday 10 September 2026
Apple just put a US$700 premium on hinges — seven supply chain takeaways
These are the seven supply chain takeaways from Apple's announcements on September 9, covering new iPhone models, new AirPods, chips, and upgrades to its ecosystem.
Thursday 10 September 2026
Apple's A20 Pro pushes mobile chips into the 2nm era — but AI may be the bigger disruption

For years, smartphone processors have competed through a familiar formula: faster CPUs, stronger graphics, and increasingly smaller...

Thursday 10 September 2026
Nvidia reportedly drives testing interface capacity crunch, pushes Taiwan suppliers
AI chip demand is tightening high-end testing interface capacity, and supply-chain sources say Nvidia has raised prices to secure most of the probe card and test socket output from...
Thursday 10 September 2026
Qualcomm's AWS deal raises stakes for MediaTek and Alchip
Qualcomm this week announced a multi-generation collaboration with Amazon to develop custom silicon for AI inference and high-performance optical connectivity for Amazon Web Services...
Thursday 10 September 2026
Analysis: China chases EUV as chipmakers move to High-NA
The extreme ultraviolet (EUV) lithography race is splitting into two tracks. Intel has moved High-NA EUV into production, Samsung Electronics and SK Hynix are targeting DRAM production...