News tagged Chips + components at DIGITIMES

NEWS TAGGED CHIPS + COMPONENTS

Friday 11 September 2026

Taiwan unfazed by Trump's renewed chip tariff threat as MOU already locks in preferential US treatment

Ahead of Chinese President Xi Jinping's expected visit to the US on September 24, US President Donald Trump has again discussed the issue of bringing chip manufacturing back to the...

Friday 11 September 2026

ficonTEC breaks CPO test bottleneck, teams with Hermes Testing

German silicon photonics (SiPh) test equipment maker ficonTEC has broken through a major bottleneck in co-packaged optics (CPO) "electrical-in, optical-out" testing and launched what...

Friday 11 September 2026

Chipmaking equipment spending could hit US$270 billion by 2030, Futurum says

Global wafer fab equipment (WFE) spending could reach about US$270 billion in 2030 as data center expansion drives demand for advanced logic, high-bandwidth memory (HBM), DRAM and...

Friday 11 September 2026

Memory makers gain the upper hand as Apple's iPhones pay the price

Apple has raised prices on both its new iPhone 18 Pro series and older models, including the iPhone 17, as rising memory costs push up component expenses.

Friday 11 September 2026

Enflame enters public markets with Nvidia alternatives in its sights

Chinese AI chipmaker Enflame Technology made a striking debut on Shanghai's STAR Market on Friday, with its shares opening 188% above...

Friday 11 September 2026

AUO, Innolux accelerate shift from displays to AI, CPO, advanced packaging

Taiwan's panel makers posted mixed August results as the industry's strategic focus shifts beyond monthly revenue toward AI, advanced packaging and co-packaged optics (CPO). AUO and...

Friday 11 September 2026

CPO startup Ayar Labs raises 2026 funding to US$650 million, adds Wiwynn as investor

Ayar Labs, a co-packaged optics (CPO) startup, has raised an additional US$150 million, bringing the primary capital it has raised so...

Friday 11 September 2026

China's DRAM supply chain clears another materials hurdle

China's semiconductor localisation effort has reached another upstream materials milestone. Jiangsu Pacific Quartz Co. has secured qualification for high-purity quartz products...

Friday 11 September 2026

CIOE 2026: Hitachi relies on partnerships, not proprietary tech, to ride China's optical boom

At an optoelectronics trade expo in China, Hitachi High-Tech used its booth not to unveil a flagship product of its own, but to showcase...

Friday 11 September 2026

Samsung's Exynos gains ground as Galaxy S26 lifts share to 9%

Samsung Electronics is regaining ground in the global smartphone processor market, with its Exynos share rising to 9% in the second...

Friday 11 September 2026

Taiwan govt boosts EDA R&D to target global gaps

Taiwan's National Science and Technology Council (NSTC) briefed Premier Jung-tai Cho on September 10, 2026, at an Executive Yuan meeting on the Chip-Driven, Taiwan-wide semiconductor...

Friday 11 September 2026

AI packaging turns to glass, with TGV metallisation persisting as key technical hurdle

Taiwan supply-chain sources said low-CTE glass fibre cloth used in high-end substrates remains tight, while glass-core substrates for next-generation packaging are still in technical...

Friday 11 September 2026

Micron pays Taiwan fab workers up to 68 months' salary in memory upturn

Micron has announced its FY26 pay package for more than 60,000 employees worldwide, the largest in the company's history. For the first time, every employee will receive merit-based...

Friday 11 September 2026

Apple's new chip packaging boosts A20 Pro AI power, pushing MediaTek, Qualcomm to follow suit

Apple has unveiled its latest iPhone 18 Pro and the A20 Pro, its first 2nm chip. According to Apple's official specifications, the A20 Pro features a six-core CPU, seven-core GPU,...

Friday 11 September 2026

Altera eyes $2B IPO, from Intel carve-out to public debut

Chipmaker Altera is laying the groundwork for an initial public offering (IPO) that could raise over US$2 billion as early as late 2026. According to sources familiar with the matter...

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