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Thursday 24 July 2025
Samsung unveils 9nm DRAM strategy
Samsung Electronics is reportedly planning to introduce a vertical 4F Square structure for its in-development 9nm DRAM products, while continuing development of the existing 6F Square...
Thursday 24 July 2025
China-Taiwan trade heating up amid US tariffs saga
Business exchanges between Chinese and Taiwanese makers have shown significant increases amid concerns over US tariffs, trade restrictions, and global supply chain restructuring,...
Thursday 24 July 2025
TSMC sees 2nm orders surge; related capacity to reach 200,000 units by 2028
TSMC has continued to accelerate its development of sub-2nm processes despite market expectations that clients would turn cautious with their 2nm orders, given the quote for the process...
Thursday 24 July 2025
Trump weighed Nvidia breakup but was told it'd be 'hard'
President Donald Trump said he considered attempting to break up Nvidia to increase competition in artificial intelligence (AI) chips before finding out "it's not easy in that busi...
Thursday 24 July 2025
SK Hynix reassures on China fabs with stable VEU status amid US AI chip export easing
SK Hynix addressed concerns about the potential impacts of tightening US export controls on its fabrication operations in China, adding no change in the company's validated end user...
Thursday 24 July 2025
SK Hynix optimistic on HBM demand amid AI growth, highlights next-gen DRAMs
In SK Hynix's second-quarter earnings call, the company emphasized strong confidence in the sustained growth of HBM, driven by increasing AI workloads and emerging applications like...
Thursday 24 July 2025
'Awkward' fit: Nvidia's H20 snubbed in China as Qihoo 360 turns to Huawei AI chips
Nvidia's H20 chip has re-entered the Chinese market but is facing an underwhelming reception, as influential tech leaders increasingly favor local semiconductor alternatives. Zhou...
Thursday 24 July 2025
AMD CEO sees chips from TSMC's US plant costing 5%-20% more
Advanced Micro Devices Inc. Chief Executive Officer Lisa Su said that the chips her company gets from supplier Taiwan Semiconductor Manufacturing Co. cost more when they're produced...
Thursday 24 July 2025
SK Hynix rides DRAM wave, doubles down on HBM with capex boost
SK Hynix reported second-quarter 2025 revenue of KRW22.23 trillion (US$16.17 billion), up 35% year-over-year, driven by surging demand for AI and high-performance DRAM. The company...
Thursday 24 July 2025
AI server boom runs into fiberglass bottleneck
As the four major cloud service providers (CSPs) actively invest in self-developed application-specific integrated circuits (ASICs), market forecasts predict a rapid increase in shipments...
Thursday 24 July 2025
Samsung plans HBM4 comeback with advanced chip technology
Samsung Electronics is preparing a strategic challenge to SK Hynix's dominance in sixth-generation high-bandwidth memory with an ambitious technological leap that could reshape the...
Thursday 24 July 2025
China gains ground on Taiwan's OSAT dominance amid pricing revolt
Taiwan continues to dominate the global outsourced semiconductor assembly and test (OSAT) market, but China is catching up quickly. Driven by state-backed chip self-reliance efforts,...
Wednesday 23 July 2025
SK Group chairman meets OpenAI CEO Sam Altman to deepen AI, HBM ties
SK Group chairman Chey Tae-won recently visited OpenAI's headquarters in San Francisco for a private meeting with CEO Sam Altman, according to reports from South Korean outlets Maeil...
Wednesday 23 July 2025
Bosch to cut 1,100 jobs in Germany as it shifts focus to semiconductor expansion
Bosch plans to restructure its Reutlingen manufacturing site in Germany, with up to 1,100 jobs set to be cut as part of a broader cost-cutting initiative. The company cited shifting...
Wednesday 23 July 2025
Samsung starts hybrid bonding shift with HBM4E; will it stick before HBM5?
Samsung Electronics plans to introduce hybrid bonding technology with its 16-layer HBM4E (7th-generation high-bandwidth memory), marking a pivotal shift in advanced memory packaging...