News tagged Chips + components at DIGITIMES

NEWS TAGGED CHIPS + COMPONENTS

Friday 24 April 2026

Chipmakers face higher cost pressure as packaging outpaces foundry price hikes

In recent weeks, chip companies ranging from major players to small and medium-sized firms have issued price increase notices or begun renegotiating product prices with select customers...

Friday 24 April 2026

Google splits AI chips into training and inference TPUs, signaling shift toward workload-specialized AI infrastructure

At Google Cloud Next 26, Google Cloud announced a strategic shift in its AI hardware approach by introducing two distinct eighth-generation Tensor Processing Units: the TPU v8t for...

Friday 24 April 2026

M31 and TSMC complete eUSB2V2 tapeout on N2P process

IP provider M31 has announced that its eUSB2V2 interface IP has completed tapeout on TSMC's N2P 2nm process. M31 CEO Scott Chang emphasized that 2nm interface IP must align closely...

Friday 24 April 2026

Memory price surge reshapes global notebook competition in 2026

The global notebook market is undergoing a structural shift in competitive dynamics in 2026, moving from product specifications and pricing battles to group-level integrated capabilities...

Friday 24 April 2026

Strait of Hormuz disruption puts semiconductor supply chains at risk as photoresist shortages grow

Geopolitical tensions in the Middle East and the blockade of the Strait of Hormuz since early March 2026 are beginning to ripple through...

Friday 24 April 2026

STMicroelectronics tops 1Q26 guidance, sees data center revenue surpass US$1 billion by 2027

STMicroelectronics reported first-quarter 2026 revenue of US$3.10 billion, up 23% year over year, with results coming in above the midpoint of its guidance as growth in personal electronics...

Friday 24 April 2026

TSMC CoPoS equipment orders face reshuffle with legal turmoil at Taiwanese equipment maker

The semiconductor packaging equipment sector is experiencing order shifts linked to significant executive changes at a key Taiwanese supplier, raising concerns over TSMC's chip-on-wafer-on-substrate...

Friday 24 April 2026

SK Hynix deepens TSMC ties with HBM4, advances memory-logic integration

SK Hynix showcased its latest high-bandwidth memory (HBM) technologies at TSMC's North America Technology Symposium 2026, highlighting...

Friday 24 April 2026

Texas Instruments eyes further price hikes amid strong data center, industrial chip demand

Texas Instruments (TI) reported robust results for the first quarter of 2026 on April 23, driven by surging AI data center demand and a notable rebound in industrial control applications...

Friday 24 April 2026

AI PCB supply crunch squeezes margins on rising materials and energy costs

A tightening supply of high-end materials is emerging as a key constraint just as PCB specifications and manufacturing processes move into a new upgrade cycle. Shortages span from...

Friday 24 April 2026

Zhen Ding to invest CNY40 billion in Huai'an to expand high-end PCB capacity

Zhen Ding Technology has broken ground on its HD campus at the Huai'an Technology City in China, as it accelerates investment to expand...

Friday 24 April 2026

MCU supplier Artery weighs price hikes on AI capacity squeeze, new applications drive growth

Microcontroller supplier Artery Technology (Arterytek or Arterychip) delivered a strong start to 2026, posting first-quarter consolidated...

Friday 24 April 2026

Texas Instruments says edge AI opportunities extend beyond robots

In an April 23 interview, Amichai Ron of Texas Instruments (TI) warned that edge AI will reshape devices worldwide, extending far beyond robotics and driving greater semiconductor...

Friday 24 April 2026

Exclusive: Google ramps new TPU servers, Taiwan suppliers gain share

Google's unveiling of its eighth-generation tensor processing unit (TPU) at Cloud Next 2026 is expected to drive the next wave of growth...

Friday 24 April 2026

SMIC returns to advanced packaging, scales team to boost AI chip strategy

China's leading foundry, SMIC, is quietly recalibrating its strategy, moving beyond its long-standing focus on front-end wafer manufacturing...

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