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    Akamai plans US$5.5 billion cloud buildout after US$11.6 billion Anthropic deal
    4min ago
    Singapore deepens chip R&D ties with Applied Materials, KLA and GlobalFoundries
    9min ago
    Dutch PM presses US to avoid tighter ASML China curbs
    11min ago
    NEWS TAGGED CHIPS + COMPONENTS
    Thursday 10 September 2026
    Europe and US IDM grid-to-core push challenges Taiwan power modules
    Data-center power systems are entering a new phase as operators move toward 800V HVDC and denser DC-DC architectures, raising demand for high-voltage, low-loss, and high-frequency...
    Thursday 10 September 2026
    STMicro sees AI sales accelerating as factory transfers hold key to margin recovery
    STMicroelectronics expects rapidly expanding AI infrastructure sales and stronger automotive demand to support growth into 2027, but its largest gross-margin gains will depend on customer...
    Thursday 10 September 2026
    Analog Devices agrees to buy Alif Semiconductor to expand edge AI push
    Analog Devices has agreed to acquire Alif Semiconductor in a US$1.35 billion all-cash deal, a move that could broaden access to faster, more energy-efficient edge AI systems for industrial,...
    Thursday 10 September 2026
    Yageo's August revenue hits record on AI demand
    Yageo posted year-over-year and month-over-month revenue growth in August, extending its streak of record monthly highs to a sixth straight month. The passive components maker said...
    Thursday 10 September 2026
    How AI and global expansion are reshaping semiconductor recruitment to production, tech integration
    Driven by sustained artificial intelligence (AI) demand, global semiconductor capacity expansion is accelerating. According to the 2026 Semiconductor Industry Talent Report released...
    Thursday 10 September 2026
    Arm launches second-generation CSS, targets China's AI smartphone market with C2 CPU
    Arm unveiled its second-generation mobile Compute Subsystem (CSS), Arm CSS for Mobile 2, at its annual Arm Everywhere China event in Shanghai on September 8, further integrating AI...
    Thursday 10 September 2026
    AI server ODMs face widening component mismatches, with shortages reaching 15–20%
    Nvidia's Vera Rubin platform is entering its production ramp, and although server ODM shipments are still expected to ramp further, server ODMs delivered strong operating results in...
    Thursday 10 September 2026
    Silicon photonics boom could push InP supply-demand gap above 70%, triggering race for strategic optical resources
    As AI drives the transition toward high-speed transmission technologies such as 800G and 1.6T, silicon photonics has become increasingly mainstream in high-speed optical communications,...
    Thursday 10 September 2026
    Taiwan IC design firms seek government subsidies for advanced chip development
    Taiwan's Ministry of Economic Affairs (MOEA) and National Science and Technology Council (NSTC) will hold a joint ministerial meeting in September to discuss subsidy applications submitted...
    Thursday 10 September 2026
    Hiwin supply deal with Semes points to deeper access in South Korea's memory equipment market
    Hiwin Technologies has signed a supply contract with Semes, Samsung Electronics' semiconductor equipment arm, for a single-axis positioning stage being tested in hybrid bonding equipment,...
    Wednesday 9 September 2026
    OpenAI's deeper Samsung tie-up lands on a foundry that is running out of capacity
    For Samsung Electronics' two loss-making logic businesses, OpenAI's declaration that it is jointly producing and researching next-generation chips with the Korean company matters less...
    Wednesday 9 September 2026
    Samsung, LG secure roles as key suppliers for Apple's foldable iPhone

    Apple's expected first foldable iPhone is set to channel a significant share of its component value to South Korean suppliers, with Samsung...

    Wednesday 9 September 2026
    Cambricon wins PyTorch Foundation board seat in bid to strengthen China AI chip software ecosystem
    Chinese AI chip developer Cambricon said on September 8 that it has formally joined the PyTorch Foundation as a platinum member, the organisation's highest membership tier, securing...
    Wednesday 9 September 2026
    Samsung turns to Japan for packaging edge, narrows HBM gap with SK Hynix

    Samsung Electronics has opened an advanced packaging research center in Yokohama, bringing development work closer to Japanese suppliers...

    Wednesday 9 September 2026
    Ample Electronic hits 120% utilization as MLCC customers step up copper paste orders
    Ample Electronic Technology said strong demand for passive components and artificial intelligence (AI) server-related products is boosting business momentum, as multi-layer ceramic...
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