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TSMC runs CoWoS packaging lines at nearly full utilization

Julian Ho, Taipei; Jessie Shen, DIGITIMES Asia 0

Nvidia reportedly is among clients demanding TSMC's advanced packaging capacity. Credit: DIGITIMES

Robust AI and HPC processor orders have boosted TSMC's chip-on-wafer-on-substrate (CoWoS) packaging capacity utilization to nearly 100%, according to industry sources.

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