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TSMC on track to develop InFO_3D tech for mobile device chips

Julian Ho, Taipei; Willis Ke, DIGITIMES Asia Monday 18 July 2022 0

Credit: DIGITIMES

TSMC is on track to develop InFO_3D technology for processing mobile device chips that are going slimmer and lighter, looking to further expand its 3D Fabric lineup and serve more clients with its 3D chip stacking and advanced packaging technologies,...

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