中文網
Taipei
Sun, Aug 14, 2022
18:32
mostly clear
30°C
CONNECT WITH US

COG packaging demand picking up

Julian Ho, Taipei; Jessie Shen, DIGITIMES Asia 0

COG (chip-on-glass) packaging demand has picked up recently as some Taiwan-based suppliers of TDDI (touch and display driver integrated) chips adopt the method to replace COF (chip-on-film) packaging, according to industry sources.

The article you are trying to open requires News database subscription. Please sign in if you wish to continue.
Related stories