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NEWS TAGGED COF
Friday 13 October 2023
Packaging materials demand decelerates
Packaging materials suppliers have seen customers slow down their pace of orders in the fourth quarter, and may encounter a decline in revenue compared to the previous quarter, according...
Friday 18 August 2023
Tape COF substrate suppliers see modest demand pick-up
Tape chip-on-film (COF) substrate suppliers including Chipbond Technology and JMC Electronics have seen a modest increase in demand and are expected to see their operations improve...
Monday 26 June 2023
Demand recovery for large-size displays benefiting peripheral IC supply chain
Large-size displays such as TVs have seen demand recover earlier than smaller ones for handset, notebook and other consumer electrics devices after becoming the first to enter inventory...
Friday 9 June 2023
JMC expects modest revenue growth in 2Q23
JMC Electronics, a supplier of chip-on-film (COF) substrates, reported an 8.2% month-over-month revenue increase in May and anticipates modest sequential revenue growth in the second...
Monday 15 May 2023
Tape COF substrate supplier JMC posts smaller loss in 1Q23
Taiwan-based JMC Electronics, a tape chip-on-film (COF) substrate supplier, saw its net losses narrow to NT$18 million (US$0.58 million) in the first quarter of 2023, despite a 17%...
Wednesday 10 May 2023
Utilization rates for COF packaging rise
Backend houses' production utilization rates for COF packaging have increased, boosted by a recovery in display driver IC (DDI) demand, according to industry sources.
Tuesday 23 August 2022
Tape COF substrate makers conservative about 2H22 prospects
Taiwan's tape COF substrate suppliers JMC Electronics and Chipbond Technology are highly conservative about their business prospects for the second half of 2022 due mainly to sluggish...
Tuesday 14 June 2022
Tape COF substrates in sluggish demand for large-size DDIs
Sluggish sales of large-size panels and continuous uncertainties in TV terminal demand have continued to erode shipments of large-size display driver ICs (DDI), resulting in revenue...
Friday 18 March 2022
Backend demand for TV SoCs, large-size DDIs may rebound in 2H22
TV SoC and large-size display driver IC (DDI) packaging demand will have a chance to rebound in the second half of 2022, as the FIFA World Cup 2022 slated for November 21-December...
Thursday 3 March 2022
Optical inspection equipment maker Utechzone upbeat about 2022 sales
Taiwan-based optical inspection equipment (AOI) supplier Utechzone expects to post impressive revenue growth this year, driven by robust demand from chipmaking and IC substrate clients...
Friday 19 November 2021
Taiwan COF packaging/testing service providers positive about 4Q21 demand
Taiwan-based COF (chip on film) OSAT (outsourced semiconductor assembly and test) service providers such as ChipMOS Technologies and Chipband Technology as well as COF substrate supplier...
Thursday 18 November 2021
Niching cuts into China 3rd-gen semiconductor supply chain
Niching Industrial with its in-house developed low-temperature sintering Ag paste materials has cut into China's third-generation semiconductor industry supply chain, according to...
Thursday 14 October 2021
Semiconductor materials distributors poised to enjoy strong 4Q21
Semiconductor materials distributors including Topco Scientific, Wah Lee Industrial and Niching Industrial are all set to see their fourth-quarter revenues stay high despite uncertainty...
Tuesday 14 September 2021
IC packaging materials distributors enjoy strong wire-bonding demand
IC packaging materials distributors continue to see strong demand for wire-bonding operations despite uncertainties facing sales of notebooks, handsets and other end-market devices...
Wednesday 11 August 2021
ChipMOS sees lucrative memory backend prospect for 2H21
Display driver IC and memory backend specialist ChipMOS Technologies is guardedly optimistic about its business prospects for the third quarter of 2021, with backend services for...
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