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Nvidia surges after company proclaims AI has hit 'tipping point'
Unimicron poised to regain ABF substrate shipment growth amid AI chip boom
EU's battery recycling mandates spark surge in market potential
AI server reality check: Foxconn's Young Liu raises doubts amidst industry hype
SEMICON Taiwan 2024 to launch 'precision machinery zone' amid rise of integrated mechatronics supply chain
SKT, MediaTek, Nota AI's data transmission breakthrough promises phone battery for days
Taiwan's green hydrogen ambitions: navigating upstream opportunities
NEWS TAGGED COF
Friday 13 October 2023
Packaging materials demand decelerates
Packaging materials suppliers have seen customers slow down their pace of orders in the fourth quarter, and may encounter a decline in revenue compared to the previous quarter, according...
Friday 18 August 2023
Tape COF substrate suppliers see modest demand pick-up
Tape chip-on-film (COF) substrate suppliers including Chipbond Technology and JMC Electronics have seen a modest increase in demand and are expected to see their operations improve...
Monday 26 June 2023
Demand recovery for large-size displays benefiting peripheral IC supply chain
Large-size displays such as TVs have seen demand recover earlier than smaller ones for handset, notebook and other consumer electrics devices after becoming the first to enter inventory...
Friday 9 June 2023
JMC expects modest revenue growth in 2Q23
JMC Electronics, a supplier of chip-on-film (COF) substrates, reported an 8.2% month-over-month revenue increase in May and anticipates modest sequential revenue growth in the second...
Monday 15 May 2023
Tape COF substrate supplier JMC posts smaller loss in 1Q23
Taiwan-based JMC Electronics, a tape chip-on-film (COF) substrate supplier, saw its net losses narrow to NT$18 million (US$0.58 million) in the first quarter of 2023, despite a 17%...
Wednesday 10 May 2023
Utilization rates for COF packaging rise
Backend houses' production utilization rates for COF packaging have increased, boosted by a recovery in display driver IC (DDI) demand, according to industry sources.
Tuesday 23 August 2022
Tape COF substrate makers conservative about 2H22 prospects
Taiwan's tape COF substrate suppliers JMC Electronics and Chipbond Technology are highly conservative about their business prospects for the second half of 2022 due mainly to sluggish...
Tuesday 14 June 2022
Tape COF substrates in sluggish demand for large-size DDIs
Sluggish sales of large-size panels and continuous uncertainties in TV terminal demand have continued to erode shipments of large-size display driver ICs (DDI), resulting in revenue...
Friday 18 March 2022
Backend demand for TV SoCs, large-size DDIs may rebound in 2H22
TV SoC and large-size display driver IC (DDI) packaging demand will have a chance to rebound in the second half of 2022, as the FIFA World Cup 2022 slated for November 21-December...
Thursday 3 March 2022
Optical inspection equipment maker Utechzone upbeat about 2022 sales
Taiwan-based optical inspection equipment (AOI) supplier Utechzone expects to post impressive revenue growth this year, driven by robust demand from chipmaking and IC substrate clients...
Friday 19 November 2021
Taiwan COF packaging/testing service providers positive about 4Q21 demand
Taiwan-based COF (chip on film) OSAT (outsourced semiconductor assembly and test) service providers such as ChipMOS Technologies and Chipband Technology as well as COF substrate supplier...
Thursday 18 November 2021
Niching cuts into China 3rd-gen semiconductor supply chain
Niching Industrial with its in-house developed low-temperature sintering Ag paste materials has cut into China's third-generation semiconductor industry supply chain, according to...
Thursday 14 October 2021
Semiconductor materials distributors poised to enjoy strong 4Q21
Semiconductor materials distributors including Topco Scientific, Wah Lee Industrial and Niching Industrial are all set to see their fourth-quarter revenues stay high despite uncertainty...
Tuesday 14 September 2021
IC packaging materials distributors enjoy strong wire-bonding demand
IC packaging materials distributors continue to see strong demand for wire-bonding operations despite uncertainties facing sales of notebooks, handsets and other end-market devices...
Wednesday 11 August 2021
ChipMOS sees lucrative memory backend prospect for 2H21
Display driver IC and memory backend specialist ChipMOS Technologies is guardedly optimistic about its business prospects for the third quarter of 2021, with backend services for...
Feb 19, 10:55
Latest solutions from Newhaven Display
Wednesday 7 February 2024
New platform upgrade: Cincoze showcases latest Alder Lake industrial computer and wide range of panel PCs
Tuesday 6 February 2024
A comprehensive look at the electronic component industry: Fusion Worldwide's 2024 report
Thursday 1 February 2024
Chroma ATE spotlights AI and IoT chip test solutions to address soaring demand in edge computing
Nvidia is reportedly considering ASIC services
SMIC's bold expansions spark concerns about potential mature-process overcapacity
Pressures mount for Taiwan-based suppliers as they relocate production to Vietnam and Mexico
Qualcomm announces AP contract extension with Samsung's flagship models; full adoption of Exynos will have to wait
Samsung reportedly wins first 2nm order in the most advanced chip-making race
Huawei's NearLink wireless technology signals a decoupled connected world
Intel cuts off manufacturing in IDM2.0, TSMC is expected to benefit
Tesla's humanoid robot 'Optimus' debuts in Taiwan, showcasing AI advancements
ASML reportedly sees first big EUV equipment order cut from TSMC
US, Japanese, and Dutch semiconductor equipment export values to China dropped; more substantial strategies demanded by expert
China's smartphone shipments threaten 20% slide in 1Q24 says DIGITIMES Research
AP shipments to Chinese smartphone brands unpleasant in 4Q23, but to stay flat in 1Q24, says DIGITIMES Research
Software is key to AI PC's success, says DIGITIMES Research
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