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NEWS TAGGED COF
Tuesday 15 June 2021
IC materials distributors upbeat about sales in 3Q21
Taiwan's semiconductor materials distributors including Topco Scientific, Wah Lee Industrial, Topco Technologies, and Chang Wah Electromaterials are all upbeat about their sales in...
Tuesday 15 June 2021
DDI backend services, materials see order visibility throughout 2021
Display driver IC (DDI) backend specialists ChipMos Technologies and Chipbond Technology, and related COF and COG packaging materials vendors including Niching Industrial have seen...
Thursday 13 May 2021
DDI packaging materials demand stays robust
Demand for packaging materials for processing high-end display driver ICs (DDI) remains strong, as backend houses including Chipbond Technology and ChipMOS Technologies still maintain...
Wednesday 12 May 2021
Taiwan OSATs see order preparation times extended
Major Taiwan-based OSATs including ASE Technology, Powertech Technology (PTI), Chipbond Technology and ChipMOS Technologies have seen their order preparation times extended to three...
Wednesday 14 April 2021
Taiwan chipmaking material distributors to embrace strong 2021
Semiconductor material distributors including Topco Scientific, Topco Technologies and Wahlee Industrial, and IC packaging materials distributors Chang Wah Electromaterials (CWE)...
Wednesday 31 March 2021
Tape COF substrate supply to become tight for processing OLED DDI
The supply of tape COF substrates is expected to fall short of demand in 2021, due to growing COF packaging demand for OLED display driver ICs (DDI) , according to industry sources...
Wednesday 17 March 2021
ChipMOS expects double-digit sales growth in 2021
Taiwan's display driver IC (DDI) backend specialist ChipMOS Technologies expects to post a double-digit revenue growth in 2021 with better profits than 2020, driven by robust DDI...
Wednesday 10 March 2021
Packaging materials vendors gaining from strong DDI demand
Packaging materials suppliers have seen a surge in orders from display driver IC (DDI) backend specialists, and are poised to enjoy strong DDI demand throughout 2021, according to...
Friday 19 February 2021
Tape COF substrate demand picking up
Taiwan-based Chipbond Technology and JMC Electronics have both seen orders for tape COF substrates pick up substantially, reflecting limited capacity supply for such substrates and...
Friday 16 October 2020
Tape COF substrate demand falling, likely to rebound in 1Q21
Tape COF substrate demand has been falling thanks partly to insufficient foundry support for LCD driver ICs, and may not pick up until the first quarter of 2021, prompting some makers...
Tuesday 13 October 2020
COF, COG packaging materials shipments ramping up
Taiwan's IC materials distributors including Niching Industrial have seen a significant surge in shipments of COF and COG packaging materials and thermal solutions since the third...
Friday 24 July 2020
Backend firms eye surge in demand for OLED, TDDI driver ICs starting mid-3Q20
Display driver IC backend specialists including ChipMos Technologies and Chipbond Technolofy are expected to enjoy a significant ramp-up in demand for handset applications, including...
Friday 3 July 2020
Prices for TV SoCs, driver ICs set to rise
Taiwan's IC designers are mulling raising quotes for TV SoCs and driver ICs amid increasingly tight supply as Korean vendors gradually quit production of LCD panels and TVs as well...
Friday 12 June 2020
US trade ban on Huawei may cast shadow over 2H20 IC market, says Chang Wah
New US trade sanctions against Huawei will bring "uncontrollable variables" to the IC market in the second half of 2020, according to Canon Huang, chairman and president for IC packaging...
Thursday 11 June 2020
COF substrate maker JMC uncertain about 3Q20
Chip-on-film (COF) substrate supplier JMC Electronics has expressed uncertainty about its outlook for the third quarter of 2020 due mainly to fluctuations in demand, according to...