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NEWS TAGGED COF
Friday 19 November 2021
Taiwan COF packaging/testing service providers positive about 4Q21 demand
Taiwan-based COF (chip on film) OSAT (outsourced semiconductor assembly and test) service providers such as ChipMOS Technologies and Chipband Technology as well as COF substrate supplier...
Thursday 18 November 2021
Niching cuts into China 3rd-gen semiconductor supply chain
Niching Industrial with its in-house developed low-temperature sintering Ag paste materials has cut into China's third-generation semiconductor industry supply chain, according to...
Thursday 14 October 2021
Semiconductor materials distributors poised to enjoy strong 4Q21
Semiconductor materials distributors including Topco Scientific, Wah Lee Industrial and Niching Industrial are all set to see their fourth-quarter revenues stay high despite uncertainty...
Tuesday 14 September 2021
IC packaging materials distributors enjoy strong wire-bonding demand
IC packaging materials distributors continue to see strong demand for wire-bonding operations despite uncertainties facing sales of notebooks, handsets and other end-market devices...
Wednesday 11 August 2021
ChipMOS sees lucrative memory backend prospect for 2H21
Display driver IC and memory backend specialist ChipMOS Technologies is guardedly optimistic about its business prospects for the third quarter of 2021, with backend services for...
Tuesday 3 August 2021
COF substrate, probe card demand stays robust for processing DDI chips
Tape COF substrates and probe cards continue to see robust demand for processing display driver ICs (DDI), which will buoy revenue performance at related suppliers in the third quarter,...
Monday 26 July 2021
IC materials distributor CWE to transform into manufacturer
Chang Wah Electomaterials (CWE), after building a solid presence in the distribution of semiconductor materials, is on track to transform into a manufacturer of diverse materials...
Tuesday 15 June 2021
IC materials distributors upbeat about sales in 3Q21
Taiwan's semiconductor materials distributors including Topco Scientific, Wah Lee Industrial, Topco Technologies, and Chang Wah Electromaterials are all upbeat about their sales in...
Tuesday 15 June 2021
DDI backend services, materials see order visibility throughout 2021
Display driver IC (DDI) backend specialists ChipMos Technologies and Chipbond Technology, and related COF and COG packaging materials vendors including Niching Industrial have seen...
Thursday 13 May 2021
DDI packaging materials demand stays robust
Demand for packaging materials for processing high-end display driver ICs (DDI) remains strong, as backend houses including Chipbond Technology and ChipMOS Technologies still maintain...
Wednesday 12 May 2021
Taiwan OSATs see order preparation times extended
Major Taiwan-based OSATs including ASE Technology, Powertech Technology (PTI), Chipbond Technology and ChipMOS Technologies have seen their order preparation times extended to three...
Wednesday 14 April 2021
Taiwan chipmaking material distributors to embrace strong 2021
Semiconductor material distributors including Topco Scientific, Topco Technologies and Wahlee Industrial, and IC packaging materials distributors Chang Wah Electromaterials (CWE)...
Wednesday 31 March 2021
Tape COF substrate supply to become tight for processing OLED DDI
The supply of tape COF substrates is expected to fall short of demand in 2021, due to growing COF packaging demand for OLED display driver ICs (DDI) , according to industry sources...
Wednesday 17 March 2021
ChipMOS expects double-digit sales growth in 2021
Taiwan's display driver IC (DDI) backend specialist ChipMOS Technologies expects to post a double-digit revenue growth in 2021 with better profits than 2020, driven by robust DDI...
Wednesday 10 March 2021
Packaging materials vendors gaining from strong DDI demand
Packaging materials suppliers have seen a surge in orders from display driver IC (DDI) backend specialists, and are poised to enjoy strong DDI demand throughout 2021, according to...