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Chipbond thinks COF crucial for packaging smartphone driver ICs

Julian Ho, Taipei; Willis Ke, DIGITIMES Asia Wednesday 20 June 2018 0

The most important evolution in the LCD driver IC packaging sector in 2018 is that the COF (chip on film) package process has become a crucial alternative to COG (chip on glass) for packing driver ICs on smaller-size panels for smartphones and other...

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