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Imec's IC-Link joins TSMC 3DFabric Alliance, extending 3D integration access worldwide

, DIGITIMES Asia, Taipei

May 13, 2026, 15:23 0

Credit: Imec

Imec's IC-Link has joined TSMC's OIP 3DFabric Alliance, opening up broader access to TSMC's 3D stacking and packaging technologies for global ASIC customers. The move could accelerate the development of multi-die systems, smoothing paths to high-volume...

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