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Huawei patent reveals DUV method to replicate 2nm-class chipmaking without EUV

Levi Li, Staff reporter, Levi Li, DIGITIMES Asia Saturday 6 December 2025 0

Credit: AFP

A newly released filing from China's National Intellectual Property Administration (CNIPA) shows Huawei submitted a patent in June 2022 outlining a method to achieve 2nm-class metal line patterning using only deep ultraviolet (DUV) lithography —...

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