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Huawei Ascend 950 to feature in-house HBM in 2026, advancing China's AI memory independence

Staff reporter, Taipei; Levi Li, DIGITIMES Asia Friday 19 September 2025 0

Credit: Huawei Connect 2025

Huawei unveiled its next-generation Ascend AI chip roadmap at the 2025 Connect summit, highlighting a milestone for China's semiconductor ambitions. Starting in early 2026, the Ascend 950 PR will integrate Huawei's self-developed high-bandwidth memory...

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