TSMC plans to launch an enhanced version of 3nm process technology in 2023, with Apple being the initial customer adopting the process, according to industry sources.

TSMC internally does not consider orders for Intel's processors as long-term ones, and therefore is unlikely to build additional production capacity for the new contract, according...

Intel at its recent earnings call disclosed that its next-generation 7nm processors, including the company's first 7nm datacenter GPU design, would rely on external and internal process...

Synaptics has announced the signing of definitive agreements under which Synaptics will acquire certain assets and manufacturing rights associated with the wireless IoT business of...

Samsung Electronics has revised its foundry process roadmap, skipping 4nm and jumping directly to 3nm from 5nm, according to industry sources.

Samsung Electronics is gearing up for mass production of 5nm chips later this year to further enhance its FinFET process offerings that leverage extreme ultraviolet (EUV) technolog...

Globalfoundries announced recently that its embedded magnetoresistive non-volatile memory (eMRAM) on the company's 22nm FD-SOI (22FDX) platform has entered production. The foundry...

MediaTek is expected to embrace an ambitious strategy to grow its presence in the 5G smartphone SoC sector. It will focus its efforts on 5G chip solutions for the upper midrange smartphone...

Synaptics has announced it has signed a definitive agreement to divest its mobile LCD TDDI business to Hua Capital through a special purpose entity backed by Hua-Capital Cayman for...

MediaTek has released Dimensity 1000 featuring four Arm Cortex-A77 cores operating up to 2.6GHz with four power-efficient Arm Cortex-A55 cores operating at up to 2.0GHz, accelerating...

MediaTek will introduce the new generation of its 5G SoCs later this week when the mobile chip specialist discloses its shipment goal next year, according to sources familiar with...

SJ Semiconductor (SJSemi) has unveiled its ultrawideband dual-polarization antenna-in-package (AiP) technology for 5G millimeter-wave applications.

SEMI and Imec are joining forces to drive innovation and deepen industry alignment on technology roadmaps and international standards while adding technology depth to SEMI's five...

The just-concluded 2018 Advantech IoT Co-Creation Summit held in Suzhou, China highlighted the top IPC vendor's roadmap for developing IoT solutions and services in cooperation with...

Arm has unveiled its latest client CPU roadmap in Taiwan, seeking to boost processor performance by at least 15% annually by 2020 to brace for the data-centric computing era and help...

With sub-10nm node manufacturing requiring huge capex, a number of foundries have slowed down their investment pace while fabless chipmakers stick with 14/12nm products for cost reasons...

Globalfoundries is reshaping its technology portfolio to intensify its focus on delivering differentiated offerings for clients in high-growth markets, according to the pure-play...

Taiwan-based diode suppliers including Eris Technology, HY Electronic, Lite-On Semiconductor, Panjit International and Taiwan Semiconductor Company (TSC) have all shifted their focus...

ASML has reported net sales of EUR2.74 billion (US$3.19 billion) for the second quarter of 2018, which went above its guidance range from EUR2.5 billion to EUR2.6 billion.

The global smartphone applications processor (AP) market declined 5% on year to US$20.2 billion in 2017, while the tablet AP market grew 3% to US$2 billion, according to Strategy...

AU Optronics (AUO) has said that it does not have a specific roadmap as well as a schedule for volume production of micro LED display products currently although it has successfully...

Samsung Electronics has disclosed its comprehensive process technology roadmap updates down to 3nm at the annual Samsung Foundry Forum in the US.

Set-top box (STB) chipset developer ALi has obtained orders from Videocon d2h, an India-based direct-to-home (DTH) operator, for Videocon d2h's next-generation high-definition (HD)...

Intel and Micron Technology have announced the completion of an expansion to Building 60 (B60) at the IM Flash facilities in Lehi, Utah. The expanded fab will produce 3D XPoint memory...

United Microelectronics (UMC) recently disclosed plans to expand its 28nm process offering by launching 28nm HPC and 28nm HPC Plus nodes, and introduce a further improved version...