CONNECT WITH US

China's Big Fund Phase III opens with Piotech Jianke investment in hybrid bonding technology

Staff reporter, Taipei; Levi Li, DIGITIMES Asia 0

Credit: Piotech Jianke

Chinese chip equipment maker Piotech said on September 12 its unit Piotech Jianke (Haining) Semiconductor Equipment has kicked off a new funding round at a CNY2.5 billion (approx. US$350 million) pre-investment valuation, seeking to raise as much as...

The article requires paid subscription. Subscribe Now