With TSMC's CoWoS and the 2.5D advanced packaging from OSAT companies becoming a hot topic due to capacity shortages, advanced packaging solutions are seen as the next big thing.
United Microelectronics (UMC) has launched a wafer-to-wafer (W2W) 3D IC project with partners including Advanced Semiconductor Engineering, Cadence, Faraday Technology, and Winbond...
Faraday Technology, a Taiwan-based provider of fabless ASIC services and silicon IP, expects to post a revenue decrease of 4-6% sequentially in the fourth quarter of 2023.
At the TSMC 2023 OIP Ecosystem Forum, TSMC announced the new 3Dblox 2.0 open standard and major achievements of its Open Innovation Platform (OIP) 3DFabric Alliance. The 3Dblox 2.0...
Artificial Intelligence (AI) is driving demand for servers, high-end chips, and advanced packaging, with 3D chips as a potential star in next-generation advanced packaging technology...
3D IC technology has emerged as a significant advancement in the semiconductor industry. Despite its significance, there are still a number of unresolved issues and challenges that...
Going beyond Moore's Law has become an important force driving advanced semiconductor technology. Top companies such as TSMC, Samsung Electronics and Intel are all already seeing...
Demand for 3D IC parts may not begin to take off until three years due to concerns of high production costs, according to Mike Liang, president of Amkor Technology Taiwan.
Taiwan Semiconductor Manufacturing Company (TSMC) reportedly plans to team up with Micron Technology to develop 3D ICs that will integrate Micron's hybrid memory cube-based DRAM chips...
Advanced Semiconductor Engineering (ASE) reportedly plans to team up with Inotera Memories to set up a joint venture for handling TSV (through-silicon via) 3D IC packaging.
Austria-based ams, a provider of high performance analog ICs and sensor solutions, has announced plans to invest over EUR25 million (US$33 million) to install 3D IC production capacity...
Micron Technology is striving to establish strategic cooperation with Taiwan-based contract chipmakers, according to company CEO Mark Durcan. Companies such as Taiwan Semiconductor...
Taiwan-based memory packaging/testing company Powertech Technology (PTI) and wafer foundry United Microelectronics (UMC) as well as Japan-based DRAM maker Elpida Memory on May 30...
