Chinese chip equipment maker Piotech said on September 12 its unit Piotech Jianke (Haining) Semiconductor Equipment has kicked off a new funding round at a CNY2.5 billion (approx...
To accelerate the development of heterogeneous integration and advanced packaging technologies, the "3DIC Advanced Manufacturing Alliance" was officially established on September...
To break through the technical, mass production, and yield challenges in advanced packaging processes such as 3D IC and CoWoS, SEMI, together with TSMC and ASE Holdings, has established...
Cadence Design Systems expressed confidence in its second-half 2025 outlook despite lingering geopolitical uncertainties. In its second-quarter 2025 earnings call, executives affirmed...
The Industrial Technology Research Institute (ITRI) has partnered with microcontroller unit (MCU) manufacturer Generalplus to develop a wireless oral sensing capsule for medical inspection...
Similar to Abenomics' three arrows over a decade ago, Japan is now introducing three initiatives aimed at reversing the decline in its semiconductor industry. Professor Kuroda Tadayoshi...
TSMC is advancing system-level innovation by improving the 3D IC design ecosystem through enhanced collaboration with foundries, customers, and partners, according to a recent blog...
A major focus of SEMICON Taiwan 2024 that concluded last week was advanced packaging, with CoWoS, 3D IC, and FOPLP being the leading technologies. CoWoS has caught more attention...
The AI boom is driving chipmaking advancements, with Co-Packaged Optics (CPO) promising to stake a claim as a favored semiconductor packaging technology along with CoWoS.
The potential of advanced packaging technology to upgrade chip performance has attracted many Japanese equipment and material suppliers to allocate their resources in this highly...
With TSMC's CoWoS and the 2.5D advanced packaging from OSAT companies becoming a hot topic due to capacity shortages, advanced packaging solutions are seen as the next big thing.
United Microelectronics (UMC) has launched a wafer-to-wafer (W2W) 3D IC project with partners including Advanced Semiconductor Engineering, Cadence, Faraday Technology, and Winbond...
Faraday Technology, a Taiwan-based provider of fabless ASIC services and silicon IP, expects to post a revenue decrease of 4-6% sequentially in the fourth quarter of 2023.
