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NEWS TAGGED 3D IC
Thursday 2 November 2023
Heterogeneous integration and system-level integration seen as 'next step' in advanced packaging era
With TSMC's CoWoS and the 2.5D advanced packaging from OSAT companies becoming a hot topic due to capacity shortages, advanced packaging solutions are seen as the next big thing.
Wednesday 1 November 2023
UMC launches 3D IC project in collaboration with partners
United Microelectronics (UMC) has launched a wafer-to-wafer (W2W) 3D IC project with partners including Advanced Semiconductor Engineering, Cadence, Faraday Technology, and Winbond...
Wednesday 25 October 2023
Faraday expects 4-6% revenue drop in 4Q23
Faraday Technology, a Taiwan-based provider of fabless ASIC services and silicon IP, expects to post a revenue decrease of 4-6% sequentially in the fourth quarter of 2023.
Monday 16 October 2023
TSMC says OIP ecosystem collaboration brings 15 years of innovation
TSMC introduced its open innovation platform (OIP) in 2008, when 40nm was the most advanced node on the market.
Thursday 28 September 2023
TSMC talks about new 3Dblox 2.0, 3DFabric achievements
At the TSMC 2023 OIP Ecosystem Forum, TSMC announced the new 3Dblox 2.0 open standard and major achievements of its Open Innovation Platform (OIP) 3DFabric Alliance. The 3Dblox 2.0...
Monday 11 September 2023
With heterogeneous integration technology constantly evolving, EVG sheds lights on hybrid bonding and NIL trends
Artificial Intelligence (AI) is driving demand for servers, high-end chips, and advanced packaging, with 3D chips as a potential star in next-generation advanced packaging technology...
Friday 1 September 2023
3D IC still yet to be fully known, says Cadence executive
3D IC technology has emerged as a significant advancement in the semiconductor industry. Despite its significance, there are still a number of unresolved issues and challenges that...
Friday 26 November 2021
EDAs to play crucial role in upcoming 3D IC era
Going beyond Moore's Law has become an important force driving advanced semiconductor technology. Top companies such as TSMC, Samsung Electronics and Intel are all already seeing...
Wednesday 3 September 2014
Demand of 3D ICs may not take off for 3 years, says Amkor Technology
Demand for 3D IC parts may not begin to take off until three years due to concerns of high production costs, according to Mike Liang, president of Amkor Technology Taiwan.
Tuesday 3 June 2014
TSMC reportedly to tie up with Micron to develop 3D ICs
Taiwan Semiconductor Manufacturing Company (TSMC) reportedly plans to team up with Micron Technology to develop 3D ICs that will integrate Micron's hybrid memory cube-based DRAM chips...
Monday 31 March 2014
ASE, Inotera reportedly to set up 3D IC packaging joint venture
Advanced Semiconductor Engineering (ASE) reportedly plans to team up with Inotera Memories to set up a joint venture for handling TSV (through-silicon via) 3D IC packaging.
Thursday 5 September 2013
Austrian chipmaker ams to set up 3D IC production line
Austria-based ams, a provider of high performance analog ICs and sensor solutions, has announced plans to invest over EUR25 million (US$33 million) to install 3D IC production capacity...
Thursday 6 September 2012
Micron expresses interest in partnering with TSMC
Micron Technology is striving to establish strategic cooperation with Taiwan-based contract chipmakers, according to company CEO Mark Durcan. Companies such as Taiwan Semiconductor...
Tuesday 31 May 2011
PTI, Elpida, UMC to collaborate to develop 3D IC logic+DRAM integration solution
Taiwan-based memory packaging/testing company Powertech Technology (PTI) and wafer foundry United Microelectronics (UMC) as well as Japan-based DRAM maker Elpida Memory on May 30...
Thursday 9 September 2010
ASE gears up for 2.5D, 3D IC commercialization
3D IC Technology holds great promise for manufacturing at 20nm and beyond, bridging the gap between SoC and future system requirements. Because of its high technical thresholds, integrated...