Weekly news roundup: Russia to begin production of 350nm chips using self-developed EUV lithography machines in 2024

Peng Chen, DIGITIMES Asia, Taipei 0


These are the most-read DIGITIMES Asia stories in the week of May 27 – May 31.

Russia to produce 350nm chips with its self-developed EUV lithography machines in 2024, says Chinese media

According to China-based Ijiwei, Vasily Shpak, Deputy Minister of Industry and Trade of the Russian Federation, said the country had assembled and manufactured its first domestic lithography machine, which has been tested as part of the Zelenograd technology production line. Shpak said Russia will soon begin producing chips with a 350nm process with its first domestic lithography machine. It aims to build lithography machines that support the 130nm process in 2026.

China unveils semiconductor standards, potentially creating distinct ecosystem

Data from the National Public Service Platform for Standards Information of China revealed the country's two semiconductor standards, including the "format for LSI-Package-Board interoperable design" and "remote operation and maintenance of IC packaging equipment-status monitoring. These standards are expected to take effect in August and November, respectively. The situation signals China's intention to build a semiconductor ecosystem that may diverge from the established global framework.

China can break through US EUV ban with mature-node innovation, but how?

The market positions of HiSilicon and SMIC have been enhanced as Huawei claims to have successfully achieved domestic substitution by using its self-developed 7nm and 5nm chips in its smartphones. However, Chinese experts said the future of the country's semiconductor sector lies in mature nodes rather than advanced nodes. The theory still needs to be tested. Canalys' data showed that the delivery of HiSilicon processors grew to 7 million and 8 million APs in 4Q23 and 1Q24, respectively, since the introduction of Huawei's 7-nanometer chip in 2023.

Vietnam poised to become Marvell's third-largest IC design center globally with new Da Nang Office

US-based Marvell opened its third location in Vietnam. The new office in Da Nang came after those in Ho Chi Minh City and Hanoi. According to the Vietnam News Agency (VNA), Marvell plans to expand operations in Ho Chi Minh City with dedicated IC design offices. Le Quang Dam, General Manager of Marvell's Vietnam subsidiary, said Vietnam would soon become the company's third-largest global IC design center after the United States and India.

Nvidia jumps to FOPLP for AI server chips amid CoWoS capacity strain

Nvidia is said to plan to use the Fan-Out Panel Level Packaging (FOPLP) technology for its GB200 AI server chips ahead of schedule as the production capacity of TSMC's Chip on Wafer on Substrate (CoWoS) packaging is tight. Industry sources said FOPLP would become a prime alternative to CoWoS for packaging AI chips due to TSMC's CoWoS capacity constraints and the surging demand for AI chips.

TechInsights: Semiconductor production capacity in China to grow by 40% in next five years

According to TechInsights' information on China's semiconductor fab capacity, the country is projected to see 40% in semiconductor production capacity by 2029, reaching 875msi. TechInsights said fabs in China have purchased equipment rapidly in the past three years. Spending on wafer fabrication equipment in China grew from US$11 billion in 2018 to close to US$30 billion in 2023. The explosive purchase of equipment is translating into rapid capacity growth.

Marvell, AMD, and Arm reveal their talent strategies in India

Talent is one of the reasons why India is attractive to global semiconductor companies. According to Nasscom, the Indian tech sector has a demand-supply gap of 21.1%, lower than the US, UK, and China. Navin Bishnoi, India Country Manager at Marvell, said the company had shifted from hiring college graduates directly to a strong internship program lasting six to 11 months. The program allows Marvell and interns to evaluate if they will be a good fit.