TSMC to boost advanced packaging capacity by 2026

Monica Chen, Hsinchu; Jessie Shen, DIGITIMES Asia 0

TSMC CEO CC Wei at the foundry house's tech forum in Taiwan on August 30. Credit: DIGITIMES

TSMC expects to scale up its advanced packaging production capacity in 2022, which will be 300% greater than that in 2018, and to further boost the output by 2026 thanks to the commercialization of its 3D SoIC (system on integrated chips) technology.

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