COF packaging substrate, service suppliers bracing for strong sales in 2H18

Julian Ho, Kaohsiung; Steve Shen, DIGITIMES Asia 0

Chip on film (COF) packaging substrate supplier JMC Electronics and COF back-end service firms Chipbond Technology and ChipMOS Technologies are set to enjoy brisk sales in the second half of 2018 thanks to increasing adoption of COF packaging for LCD...

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