Bits + chips
COF demand to receive boost in 2H18, says JMC
Julian Ho, Taipei; Jessie Shen, DIGITIMES

Chip-on-film (COF) packaging demand will start to grow substantially in the second half of 2018, driven by the arrival of new smartphones featuring an edge-to-edge display, according to JMC Electronics, an affiliate of Chang Wah Electromaterials (CWE)...

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