Subscribe to newsletter

REALTIME NEWS

Artilux intros GeSi sensor solution for TWS devices

Before Going to Press

IDMs, IC design gearing up for AIoT market growth

Before Going to Press

Smartphone sales in Taiwan remain weak

Before Going to Press

BOE unlikely to be excluded from Apple OLED panels supply chain

Before Going to Press

China MEMS sensor companies eyeing bigger global presence

Before Going to Press

Micron to start installing EUV fab tools at Taiwan plant in end-2022

Before Going to Press

Taiwan pure-play foundries on track to post record revenues in 2022

Before Going to Press

Acer warns of worsening inflation in 2H22

Before Going to Press

Home Tech Chips + Components

COF demand to receive boost in 2H18, says JMC

Julian Ho, Taipei; Jessie Shen, DIGITIMES Tuesday 20 March 2018 0

Chip-on-film (COF) packaging demand will start to grow substantially in the second half of 2018, driven by the arrival of new smartphones featuring an edge-to-edge display, according to JMC Electronics, an affiliate of Chang Wah Electromaterials (CWE)...

The article you are trying to open requires News database subscription. Please sign in if you wish to continue.

LOGIN

Email address

Password

Save my User ID and Password

Save my User ID and Password

Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time they visit the site. To activate this function, check the 'Save my User ID and Password' box in the log-in section. This will save the password on the computer you're using to access the site.

Note: If you choose to use the log-out feature, you will lose your saved information. This means you will be required to log-in the next time you visit our site.

NEW individual users please REGISTER first.

Enterprise user first-time LOGIN.

I forgot my ID and/or password?

MEMBERSHIP BENEFITS

Full access to articles dating back to 2000.
Real-time access to the news as it breaks.
Access to premium content.
Full access to Before Going to Press.
Asia Supply Chain 100 dataset access.
Access to research insights.

Categories

Chips + components IC manufacturing Passive, PCB, other IC components

Tags

2018 8K China Chipbond COF COG demand display electronics handset manufacturing OLED packaging panel revenues shipments smartphone substrate supplier

Companies

Chipbond Technology

Related stories

2022 Avalue e-channel webinar

MSI unveils new lineup at Computex 2022 Online

Global server shipment forecast and industry analysis, 2022

NXP soon to roll out new-gen 5nm automotive processor

TOP STORIES
MOST-READ 2021