Xintec 12-inch wafer-level CSP ready for volume production in 2H15, says chairman

Julian Ho, Taipei; Jessie Shen, DIGITIMES Asia Tuesday 17 March 2015 0

Image sensor packaging house Xintec will have its 12-inch wafer-level chip-scale package (WL-CSP) line ready for volume production in the second half of 2015, according to company chairman and CEO Robert Kuan.

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