41 news items tagged XinTec
VCSEL foundry houses, backend specialists see strong demand
Monday 28 October 2019Taiwan's GaAs foundry houses and VCSEL and DOE (diffraction optical element) backend specialists are set to land more follow-up orders from Apple in the fourth quarter of 2019 and...
Win Semi 3Q19 revenues beat guidance
Tuesday 8 October 2019GaAs foundry Win Semiconductors' third-quarter 2019 revenues climbed over 40% sequentially, beating its estimate of about 30% growth, due partly to strong demand for compound semiconductor...
Xintec eyeing return to profit in 2019
Monday 7 October 2019Niche-market IC packaging house Xintec is eyeing its return to profitability this year, according to industry observers.
Optical fingerprint sensors shipments to ramp up in 1Q20
Monday 30 September 2019Taiwan's IC designers are set to ramp up shipments of diverse optical in-display fingerprint sensors for smartphone application starting in the first quarter of 2020, and backend...
Demand for GaN-based components set for long-term growth
Monday 19 August 2019Demand for GaN-based RF components and power amplifiers (PAs) is heading for long-term growth along with the establishment of 5G networks, according to industry sources.
Backend firm Xintec focuses more on high-profit CIS applications
Friday 16 August 2019CMOS image sensor (CIS) packaging specialist Xintec has put increased focus on high-profit segments of healthcare, industrial control and automotive CIS applications, and expects...
Win Semi, Xintec and ShunSin ramping up shipments for 3D sensing components
Friday 16 August 2019GaAs foundry Win Semiconductors, and backend houses Xintec and ShunSin Technology have started ramping up shipments for structured light 3D sensing components in the third quarter...
Wafer-level backend demand promising
Wednesday 14 August 2019The manufacture of under-display optical fingerprint sensors for use in 5G-enabled phones will require wafer-level backend services. Suppliers capable of providing wafer-level backend...
IC backend supply chain buoyed by TSMC positive 3Q19 outlook
Friday 19 July 2019Taiwan-based IC backend supply chain players are optimistic about their performance prospects for the second half of 2019 in line with TSMC's positive outlook about demand for high-end...
Order visibility for IC packaging materials clear throughout 3Q19
Wednesday 10 July 2019Clear order visibility for diverse IC packaging materials is seen through the end of the third quarter of the year thanks mainly to increasingly robust demand from OSAT (outsourced...
Taiwan chipmakers gearing up for 3D sensor market boom
Tuesday 9 July 2019Foundries including Win Semiconductors and Advanced Wireless Semiconductor (AWSC), epitaxial wafer supplier Visual Photonics Epitaxy (VPEC), fabless chipmaker Himax Technologies,...
Xintec cautious about 2019
Monday 3 June 2019Niche-market IC packaging house Xintec continues to expand its offerings and client portfolio in its target markets, and remains focused on wafer-level packaging, according to company...
IC packager Xintec expects revenues to pick up in 2Q19
Wednesday 20 February 2019Image sensor packaging specialist Xintec expects a significant sequential revenue pickup in the second quarter of 2019 due mainly to faster inventory adjustments at 3D sensor supply...
Shipments of 3D sensing components for smartphones picking up
Wednesday 22 August 2018Taiwan-based makers in the 3D sensing components supply chain, including VCSEL suppliers and 3D packaging firms, have seen their shipments start picking up recently after a slowdown...
Xintec posts wider loss in 1H18
Monday 13 August 2018Image sensor packaging specialist Xintec saw its net losses widen to NT$5.81 (US$0.19) per share in the first half of 2018 from NT$2.25 a year earlier.
Taiwan OSAT firms suffer unclear order visibility for 3Q18
Friday 22 June 2018After experiencing lackluster revenue and profit performances in the first half of 2018, Taiwan OSAT (outsourced semiconductor assembly and test) players still see unclear visibility...
Xintec halts 12-inch wafer-level packaging production
Wednesday 20 June 2018Image sensor packaging specialist Xintec has decided to suspend its 12-inch wafer-level packaging production line for one year due to disappointing CMOS image sensor (CIS) demand...
Taiwan 2nd-tier backend firms enjoy pick-up of orders
Monday 4 June 2018Taiwan-based second-tier packaging and testing houses have enjoyed a pick-up of orders for flash memory, and 3D sensing and other optical components recently as their downstream clients...
Taiwan 3D sensor supply chain to gain more from new iPhones
Monday 26 March 2018As Apple has reportedly decided to continue using 3D sensor-based face recognition in its new iPhone devices in 2018, Taiwan suppliers in the 3D sensor supply chain, including those...
Xintec losses widen in 2017
Thursday 8 February 2018Image sensor packaging specialist Xintec saw its net losses widen to NT$733 million (US$25.1 million) in 2017 from losses of NT$636 million in 2016. EPS stayed negative at NT$2.71.
Xintec to see orders for 3D sensing from iPhone and Android camps
Tuesday 16 January 2018Taiwan-based IC packager Xintec is expected to enjoy significant 3D sensing business opportunities from both iPhone and Android-based smartphone camps in 2018 in its capacity as a...
Taiwan players in 3D sensor supply chain to see lucrative market in 2018
Monday 4 December 2017With Android-based smartphones vendors expected to incorporate 3D sensors into their smartphone models following Apple's adoption of TrueDepth facial recognition system of iPhone...
Xintec to swing to profit in 4Q17, says report
Tuesday 17 October 2017Image sensor packaging specialist Xintec is expected to return to profitability in the fourth quarter of 2017 with revenues likely to increase around 30% sequentially to nearly NT$1.3...
Xintec loss widens in 1H17
Friday 25 August 2017Image sensor packaging specialist Xintec saw its losses widen to NT$609 million (US$20 million) in the first half of 2017, with EPS reaching negative NT$2.25.
Qualcomm developing 3D depth sensing technology
Tuesday 22 August 2017Qualcomm is partnering with its ecosystem partners to develop 3D depth sensing technology, which will be applied to Andriod smartphones powered the Snapdragon mobile chips, according...