CMOS image sensor (CIS) backend specialists including Tong Hsing Electronic Industries and Xintec are expanding capacity seeking to satisfy growing demand for multi-lens camera pho...

IC backend and verification specialists in the supply chain of Apple devices have regained confidence in their revenue performances for 2020 as they are moving to deliver shipments...

Color filter (CF) maker VisEra Technologies, a subsidiary of TSMC, will establish a new plant in Longtan, northern Taiwan and is eyeing new orders from Sony, according to industry...

TSMC-reinvested backend house Xintec will see little seasonality impact on its revenues for the first half of 2020 as robust packaging demand for DOE (diffractive optical element)...

Taiwan-based makers of CMOS image sensor (CIS) and VCSEL components are optimistic that multi-lens camera modules incorporating ToF (time of flight) sensing technology will be mass-adopted...

OmniVision Technologies will raise its quotes for various CMOS image sensors (CIS) by 10-40% in 2020 to counter ever-expanding demand for application to handsets, notebooks, smart...

Niche-market IC packaging house Xintec has disclosed its net profit surged 252% from a year ago to NT$74 million (US$2.46 million) in November 2019. EPS for the month came to NT$0....

TSMC has placed orders for several hundred sets of test equipment with Teradyne, and will install the tools at the foundry's new advanced backend plant in northern Taiwan, according...

Taiwan's GaAs foundry houses and VCSEL and DOE (diffraction optical element) backend specialists are set to land more follow-up orders from Apple in the fourth quarter of 2019 and...

GaAs foundry Win Semiconductors' third-quarter 2019 revenues climbed over 40% sequentially, beating its estimate of about 30% growth, due partly to strong demand for compound semiconductor...

Niche-market IC packaging house Xintec is eyeing its return to profitability this year, according to industry observers.

Taiwan's IC designers are set to ramp up shipments of diverse optical in-display fingerprint sensors for smartphone application starting in the first quarter of 2020, and backend...

Demand for GaN-based RF components and power amplifiers (PAs) is heading for long-term growth along with the establishment of 5G networks, according to industry sources.

CMOS image sensor (CIS) packaging specialist Xintec has put increased focus on high-profit segments of healthcare, industrial control and automotive CIS applications, and expects...

GaAs foundry Win Semiconductors, and backend houses Xintec and ShunSin Technology have started ramping up shipments for structured light 3D sensing components in the third quarter...

The manufacture of under-display optical fingerprint sensors for use in 5G-enabled phones will require wafer-level backend services. Suppliers capable of providing wafer-level backend...

Taiwan-based IC backend supply chain players are optimistic about their performance prospects for the second half of 2019 in line with TSMC's positive outlook about demand for high-end...

Clear order visibility for diverse IC packaging materials is seen through the end of the third quarter of the year thanks mainly to increasingly robust demand from OSAT (outsourced...

Foundries including Win Semiconductors and Advanced Wireless Semiconductor (AWSC), epitaxial wafer supplier Visual Photonics Epitaxy (VPEC), fabless chipmaker Himax Technologies,...

Niche-market IC packaging house Xintec continues to expand its offerings and client portfolio in its target markets, and remains focused on wafer-level packaging, according to company...

Image sensor packaging specialist Xintec expects a significant sequential revenue pickup in the second quarter of 2019 due mainly to faster inventory adjustments at 3D sensor supply...

Taiwan-based makers in the 3D sensing components supply chain, including VCSEL suppliers and 3D packaging firms, have seen their shipments start picking up recently after a slowdown...

Image sensor packaging specialist Xintec saw its net losses widen to NT$5.81 (US$0.19) per share in the first half of 2018 from NT$2.25 a year earlier.

After experiencing lackluster revenue and profit performances in the first half of 2018, Taiwan OSAT (outsourced semiconductor assembly and test) players still see unclear visibility...

Image sensor packaging specialist Xintec has decided to suspend its 12-inch wafer-level packaging production line for one year due to disappointing CMOS image sensor (CIS) demand...