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NEWS TAGGED XINTEC
Thursday 7 April 2022
Automotive CIS emerging as new blue-ocean market for supply chain
It seems that CMOS image sensor (CIS) demand momentum for mainstream handset applications has become stagnant amid unclear market prospects, but the automotive CIS segment is emerging...
Monday 28 March 2022
IDMs, backend partners expanding automotive CIS capacity
International IDMs such as Onsemi and Sony are keenly expanding capacities for automotive CMOS image sensors (CIS) to meet ever-mounting demand for ADAS applications, and their backend...
Friday 25 March 2022
Mixed levels of price reduction pressure looming for diverse IC segments
Different IC segments will be experiencing mixed levels of price downward pressure at least in the first half of the year, according to industry sources.
Friday 18 February 2022
Xintec cautious about 2022
CMOS image sensor backend specialist Xintec has expressed caution about its sales performance this year, citing the ongoing pandemic, labor shortages, and supply-side challenges,...
Wednesday 15 September 2021
OSATs busy with high-end backend services for new iPhones
Taiwan's OSATs including ASE Technology and Powertech Technology (PTI) are gearing up to extend high-end backend services for new iPhones and other Apple devices, and their momentum...
Wednesday 8 September 2021
OmniVision to cut back wafer starts at Taiwan foundries, say sources
OmniVision plans to cut back substantially its orders placed with Taiwan's IC manufacturing sector, according to market sources.
Tuesday 17 August 2021
Backend houses enjoy strong influx of orders for automotive CIS
Taiwan-based backend houses, including Tong Hsing Electronic Industries, King Yuan Electronics (KYEC), and Xintec, have seen orders from international IDMs continue ramping up for...
Friday 13 August 2021
Xintec optimistic about 3Q21
Taiwan-based CIS and 3D sensor packaging specialist Xintec has expressed optimism about its sales performance in the third quarter of 2021, thanks to a seasonal pick-up in demand...
Monday 19 July 2021
Chip probing houses to gain from new iPhone SE series, say sources
Apple reportedly is set to roll out its third-generation iPhone SE series in the first half of 2022, providing new business opportunities for chip probing specialists including TSMC...
Wednesday 14 July 2021
Taiwan CIS backend firms to embrace strong 2H21
Backend houses including Xintec, ShunSin Technology and Tong Hsing Electronic Industries are expected to post brisker sales results for the second half of 2021 after posting impressive...
Wednesday 7 April 2021
Strong sensor demand to buoy suppliers in 2021
Demand for CMOS image sensor (CIS) and other sensors is set to be robust this year, driven by a surge in demand for video conferencing, security surveillance and automotive electronics...
Monday 29 March 2021
VisEra may offer wafer-level optical films for new iPhones
TSMC subsidiary VisEra Technology, which offers image sensor foundry, wafer-level testing and wafer-level optical film services, is expected to land orders for customized wafer-level...
Wednesday 3 February 2021
Backend house Xintec expects strong 1Q21
TSMC-invested backend house Xintec expects to enjoy a particularly strong first-quarter 2021 and stable revenue and profit increases for the entire year, thanks to brisk wafer-level...
Monday 25 January 2021
CIS chip suppliers tapping lucrative automotive, surveillance sectors
CMOS image sensor (CIS) suppliers are shifting their marketing strategies to focus more on automotive and surveillance applications seeking to ramp up profitability, according to...
Tuesday 8 December 2020
Xintec, ShunSin see robust backend orders
Backend houses Xintec and ShunSin Technology have both enjoyed strong orders for processing 3D sensing components and 5G power amplifier modules with SiP technology, respectively,...