Taiwan's GaAs foundry houses and VCSEL and DOE (diffraction optical element) backend specialists are set to land more follow-up orders from Apple in the fourth quarter of 2019 and...

GaAs foundry Win Semiconductors' third-quarter 2019 revenues climbed over 40% sequentially, beating its estimate of about 30% growth, due partly to strong demand for compound semiconductor...

Niche-market IC packaging house Xintec is eyeing its return to profitability this year, according to industry observers.

Taiwan's IC designers are set to ramp up shipments of diverse optical in-display fingerprint sensors for smartphone application starting in the first quarter of 2020, and backend...

Demand for GaN-based RF components and power amplifiers (PAs) is heading for long-term growth along with the establishment of 5G networks, according to industry sources.

CMOS image sensor (CIS) packaging specialist Xintec has put increased focus on high-profit segments of healthcare, industrial control and automotive CIS applications, and expects...

GaAs foundry Win Semiconductors, and backend houses Xintec and ShunSin Technology have started ramping up shipments for structured light 3D sensing components in the third quarter...

The manufacture of under-display optical fingerprint sensors for use in 5G-enabled phones will require wafer-level backend services. Suppliers capable of providing wafer-level backend...

Taiwan-based IC backend supply chain players are optimistic about their performance prospects for the second half of 2019 in line with TSMC's positive outlook about demand for high-end...

Clear order visibility for diverse IC packaging materials is seen through the end of the third quarter of the year thanks mainly to increasingly robust demand from OSAT (outsourced...

Foundries including Win Semiconductors and Advanced Wireless Semiconductor (AWSC), epitaxial wafer supplier Visual Photonics Epitaxy (VPEC), fabless chipmaker Himax Technologies,...

Niche-market IC packaging house Xintec continues to expand its offerings and client portfolio in its target markets, and remains focused on wafer-level packaging, according to company...

Image sensor packaging specialist Xintec expects a significant sequential revenue pickup in the second quarter of 2019 due mainly to faster inventory adjustments at 3D sensor supply...

Taiwan-based makers in the 3D sensing components supply chain, including VCSEL suppliers and 3D packaging firms, have seen their shipments start picking up recently after a slowdown...

Image sensor packaging specialist Xintec saw its net losses widen to NT$5.81 (US$0.19) per share in the first half of 2018 from NT$2.25 a year earlier.

After experiencing lackluster revenue and profit performances in the first half of 2018, Taiwan OSAT (outsourced semiconductor assembly and test) players still see unclear visibility...

Image sensor packaging specialist Xintec has decided to suspend its 12-inch wafer-level packaging production line for one year due to disappointing CMOS image sensor (CIS) demand...

Taiwan-based second-tier packaging and testing houses have enjoyed a pick-up of orders for flash memory, and 3D sensing and other optical components recently as their downstream clients...

As Apple has reportedly decided to continue using 3D sensor-based face recognition in its new iPhone devices in 2018, Taiwan suppliers in the 3D sensor supply chain, including those...

Image sensor packaging specialist Xintec saw its net losses widen to NT$733 million (US$25.1 million) in 2017 from losses of NT$636 million in 2016. EPS stayed negative at NT$2.71.

Taiwan-based IC packager Xintec is expected to enjoy significant 3D sensing business opportunities from both iPhone and Android-based smartphone camps in 2018 in its capacity as a...

With Android-based smartphones vendors expected to incorporate 3D sensors into their smartphone models following Apple's adoption of TrueDepth facial recognition system of iPhone...

Image sensor packaging specialist Xintec is expected to return to profitability in the fourth quarter of 2017 with revenues likely to increase around 30% sequentially to nearly NT$1.3...

Image sensor packaging specialist Xintec saw its losses widen to NT$609 million (US$20 million) in the first half of 2017, with EPS reaching negative NT$2.25.

Qualcomm is partnering with its ecosystem partners to develop 3D depth sensing technology, which will be applied to Andriod smartphones powered the Snapdragon mobile chips, according...