Bits + chips
UMC to break ground for new factory buildings at 12-inch fab in May
Josephine Lien, Taipei; Jessie Shen, DIGITIMES

United Microelectronics (UMC) is scheduled to hold a groundbreaking ceremony for new factory buildings (Phase 5 and 6) at its 12-inch Fab 12A located at the Southern Taiwan Science Park (STSP) in May. New capacity will focus on 28nm processes.

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