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    NEWS TAGGED 28NM
    Friday 27 March 2026
    Nexchip revenue rises 17.7% to US$1.58bn, foundry capacity stays tight

    Nexchip reported 2025 revenue of CNY10.89 billion (approx. US$1.58 billion), up 17.69% year-over-year, with net profit rising 32.16% to...

    Thursday 19 March 2026
    China's mature-node push gathers pace: Nexchip, Silan, Hua Hong step up capacity and integration

    China's semiconductor strategy is shifting from leading-edge competition to strengthening mature and specialty nodes. Facing geopolitical...

    Friday 13 March 2026
    China's Nexchip signals wafer price hikes amid capacity expansion and CIS growth
    Nexchip has confirmed that it has raised prices for certain wafer foundry products, aligning its pricing strategy with market conditions, customer demand, and ongoing operational improvements,...
    Thursday 29 January 2026
    In-depth: DeepSeek's one-year breakthrough shows how China builds AI without cutting-edge chips
    In January 2025, while the global AI and semiconductor industries remained focused on advanced process nodes and high-performance GPUs, China's large-scale model DeepSeek-R1 emerged...
    Monday 5 January 2026
    Nexchip Semiconductor launches US$5.1bn Hefei fab to scale 28nm mature-node capacity

    China's domestic foundry expansion gained momentum this week as Nexchip Semiconductor broke ground on its Phase IV project in Hefei, committing...

    Thursday 1 January 2026
    China capacity expansion and weakening end-market demand prompt cost reductions for 28nm process
    The 28-nanometer process has become the most popular node among mature processes. It boasts the highest utilization rates and the strongest price support. However, market conditions...
    Wednesday 24 December 2025
    TSMC Nanjing in no danger of operation disruption, says branch head
    As US-China technology controls continue to shape the global semiconductor supply chain, the operation of TSMC in China remains under close scrutiny from the market.
    Wednesday 8 October 2025
    China accelerates DUV lithography breakthroughs with patents and testing
    China is enhancing its DUV lithography technology amid US export restrictions. Yuliangsheng's 28nm immersion DUV machine is being tested at SMIC, while SMEE has patented a method to...
    Tuesday 16 September 2025
    Huawei’s Ren says failed Motorola deal set stage for chip self-reliance
    Since Huawei established Shenzhen HiSilicon Semiconductor in 2004, its semiconductor business has supported over two decades of development and innovation within Huawei's product ecosystem...
    Thursday 4 September 2025
    Why the US revoking TSMC’s Nanjing license may matter less than it seems
    The US Commerce Department has told TSMC it will revoke the company's Verified End-User (VEU) status for its Nanjing factory by December 31, 2025. TSMC said on September 2 that the...
    Monday 18 August 2025
    Hua Hong Semiconductor to acquire HLMC to expand 12-inch chipmaking capacity

    Hua Hong Semiconductor announced on August 17 that it will acquire a controlling stake in Shanghai Huali Microelectronics Corporation...

    Monday 18 August 2025
    Strong demand for advanced nodes drives Topco's 1H25 revenue growth
    Topco Scientific (TSC) stated during an earnings call on August 14, 2025, that current semiconductor market conditions are on par with the first quarter of 2025, adding that advanced...
    Monday 28 July 2025
    Huawei's shadow fab (3): key 'mature process' piece on the US radar
    While global attention focuses on the arms race in advanced semiconductor processes below 7nm, China is quietly setting up a formidable strategy in another area considered a "non-strategic...
    Saturday 31 May 2025
    UMC rules out Middle East fab as currency risks cloud 2H outlook
    UMC, a leading foundry, held its shareholders' meeting on May 28, 2025. Chief financial officer Chi-Tung Liu pointed out that due to significant impacts from tariffs and exchange rate...
    Thursday 22 May 2025
    Xiaomi vaults to 3nm with XRing O1, pairing custom AP with external baseband
    Xiaomi's XRing O1 will debut in the 15S Pro smartphone and Pad 7 Ultra, reportedly built on TSMC's second-gen 3nm (N3E) process. With around 19 billion transistors, the chip ranks...
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    Research Report Database
    BIZ FOCUS
    Feb 9, 08:00
    iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory
    Friday 6 February 2026
    2026 Market Outlook: Key Opportunities & Risks to Watch
    Thursday 5 February 2026
    Attopsemi Scales I-fuse Technology to 7nm following 12nm Silicon Success
    Wednesday 4 February 2026
    Teaching Machines to Feel the World TOUCH Lab Redefines Sensing
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    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook